Browse > Article
http://dx.doi.org/10.4313/JKEM.2015.28.5.300

Photocatalyst Surface Properties of the Oxide Thin Films According to the Plasma Etching Process  

Lee, Chang-Hyun (Department of Electronic and Electrical Engineering, Catholic University of Daegu)
Seo, Sung-Bo (Department of Electronic and Electrical Engineering, Catholic University of Daegu)
Oh, Ji-Yong (Department of Electronic and Electrical Engineering, Catholic University of Daegu)
Jin, Ik-Hyeon (Department of Electronic and Electrical Engineering, Catholic University of Daegu)
Sohn, Sun-Young (Future IT Innovation Laboratory, Pohang University of Science and Technology)
Kim, Hwa-Min (Department of Electronic and Electrical Engineering, Catholic University of Daegu)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.28, no.5, 2015 , pp. 300-305 More about this Journal
Abstract
$WO_3$, $SiO_2$, and $TiO_2$ films with hydrophilic property are deposited by rf-magnetron sputtering. Their wettability is strongly depends on the presence or absence of the oxygen plasma etching on the glass substrates. The $TiO_2$ film of 50 nm-thick on the plasma etched glass shows a water contact angle (WCA) below $5^{\circ}$ which means a super-hydrophilic surface. However, WCA values are gradually degraded when the films are exposed under atmosphere, especially $WO_3$. In order to improve hydrophilic property, the degraded films can be again recovered by UV illumination for 10 sec using UV-light and the $TiO_2$ film shows a super-hydrophilic surface about $3^{\circ}$.
Keywords
Super-hydrophilic; Water contact angle; Plasma etching; UV illumination; Roughness factor;
Citations & Related Records
연도 인용수 순위
  • Reference
1 M. Langlet, A. Kim, M. Audier, C. Guillard, and J. M. Herrmann, Thin Solid Films, 429, 12 (2003).
2 C. Shifu, Z. Wei, Z. SuJuan, and L. Wei, Chem. Eng., J. 148, 263 (2009).   DOI
3 C. C. Sun and T. C. Shou, J. Mol. Catal. A., 151, 133 (2000).   DOI
4 T. G. Maffeis, D. Yung, L. Lepennec, M. W. Penny, R. J. Cobley, E. Comini, G. Sberveglieri, and S. P. Wilks, Suface Science, 601, 4953 (2007).   DOI
5 S. Skathivle, M. V. Shanker, M. Palanichamy, B. Arabindoo, D. W. Bahnemann, and V. Murugesan, Water Res., 38, 300 (2004).
6 D. Ke, H. Liu, T. Peng, X. Liu, and K. Dai, Mater. Lett., 62, 447 (2008).   DOI   ScienceOn
7 W. J. Xiao, Z. C. Huang, and Z. H. He, Appl. Phys. Lett., 89, 083101 (2006).   DOI
8 H. C. Barshilia, D. K. Mohan, N. Selvakumar, and K. S. Rajam, Appl. Phys. Lett., 95, 033116 (2009).   DOI
9 G. Li, T. Chen, B. Yan, Y. Ma, Z. Zhang, T. Yu, Z. Shen, H. Chen, and T. Wu, Appl. Phys. Lett., 92, 173104 (2008).   DOI
10 H. C. Barshilia, D. K. Mohan, N. Selvakumar, and K. S. Rajam, Appl. Phys. Lett., 95, 033116 (2009).   DOI
11 A. Opitz, M. Scherge, S.I.U. Ahmed, and J. A. Schaefer, J. Appl. Phys., 101, 064310 (2007).   DOI
12 D. G. Cahill and T. H. Allen, Appl. Phys. Lett., 65, 309 (1994).   DOI
13 M. Kitano, K. Funatsu, M. Matsuoka, M. Ueshima, and M. Anpo. J. Phys. Chem., B, 110, 25266 (2006).   DOI
14 M. Nakamura, M. Kobayashi, N. Kuzuya, T. Komatsu, and T. Mochizuka, Thin Solid Films, 502, 121 (2006).   DOI
15 K. Han and J. H. Kim, Appl. Surf. Sci., 263, 69 (2012).   DOI
16 R. N. Wenzel, Industrial & Engineering Chemistry, 28, 988 (1936).   DOI
17 P. D. Schulze1, S. L. Shaffer, R. L. Hance, and D. L. Utley, J. Vac. Sci. Technol. A, 1, 97 (1983).   DOI
18 M. H. Habibi, S. Tangestaninejad, and B. Yadollahi, Applied Catalyst B: Environmental, 33, 57 (2001).   DOI
19 K. T. Ranjit, E. Joselevich, and I. Willner, J. Photochemistry and Photobiology A: Chemistry, 99, 185 (1996).   DOI
20 G. Hollinger, Appl. Surf. Sci., 8, 318 (1981).   DOI
21 D. Ren, X. Cui. J. Shen, Q. Zhang, X. Yang, and Z. Zhang, and L. Ming, J. Sol-Gel. Sci. Technol., 29, 131 (2004).   DOI