• 센서학회지
• /
• 제10권6호
• /
• pp.279-285
• /
• 2001

본 연구에서는 HNA를 이용한 Si의 bulk 식각을 통해 렌즈 모양을 갖는 몰드를 제작 한 뒤 그 위에 렌즈로 사용될 SU-8을 도포 한 다음 몰드와 렌즈를 분리시키는 방법으로 마이크로렌즈 배열을 제조하는 공정을 개발하였으며 이는 공정순서가 단순하며 경제적인 것을 특징으로 한다. Stirring 속도 800rpm 이상의 조건에서 높이 $45{\mu}m$, 직경 $150{\mu}m$의 높은 fill factor를 가지는 렌즈의 제작조건을 확립하였으며, 이와 같이 제작된 초소형 렌즈는 적외선 감지 소자와 같은 영상 소자나 projection display 영역에 응용되어 소자 성능을 향상시킬 수 있다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
• /
• pp.912-915
• /
• 2004

Inductors material utilized in the downsizing passive devices and Rf components requires the physical and electrical properties at given area such as inductors thickness reduction, inductance and q-factor increase, low leakage current and thermal stability. In this study, Spiral inductors on the $SiO_2/Si$(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of $2{\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to $60{\mu}m$ and from 20 to $70{\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays

• Current Photovoltaic Research
• /
• 제6권1호
• /
• pp.27-30
• /
• 2018

The dependency of the electrical characteristics of silicon solar-cells on the depth of damaged layer induced by wire-sawing process was investigated. To compare cell efficiency with residual sawing damage, silicon solar-cells were fabricated by using as-sawn wafers having different depth of saw damage without any damaged etching process. The damaged layer induced by wire-sawing process in silicon bulk intensely influenced the value of fill factor on solar cells, degrading fill factor to 57.20%. In addition, the photovoltaic characteristics of solar cells applying texturing process shows that although the initial depth of saw-damage induced by wire-sawing process was different, the value of short-circuit current, fill-factor, and power-conversion-efficiency have an almost same, showing ~17.4% of cell efficiency. It indicated that the degradation of solar-cell efficiency induced by wire-sawing process could be prevented by eliminating all damaged layer through sufficient pyramid-surface texturing process.

• 정보저장시스템학회논문집
• /
• 제2권3호
• /
• pp.163-168
• /
• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• 전기전자학회논문지
• /
• 제12권3호
• /
• pp.138-143
• /
• 2008

본 논문에서 기존 반도체공정들이 갖는 리소그래피와 식각 등의 공정단계를 배제하는 direct-write 공정과 LAM(Laser Ablation of Microparticles) 공정을 이용하여 친환경적인 이점을 가질 수 있는 나선형 인덕터의 구조를 제안하고 주파수 특성을 확인하였다. 인덕터의 구조는 Si를 540${\mu}m$, $SiO_2$를 3${\mu}m$으로 하였으며, Cu 코일의 폭과 선간의 간격은 LAM 공정과 direct-write 공정을 이용할 수 있도록 각각 30${\mu}m$으로 설정하여 2회 권선하였다. 나선형 박막 인덕터의 성능을 나타내는 인덕턴스, quality-factor, SRF에 대한 주파수 특성을 HFSS로 시뮬레이션 하였다. Underpass와 via가 제거된 인덕터는 300-800MHz 범위에서 1.11nH의 인덕턴스, 5GHz에서 최대 38 정도의 품질계수를 가지며, SRF는 18GHz로 시뮬레이션 결과를 얻었다. 반면에 underpass와 via를 가지는 일반적인 인덕터는 300-800MHz 범위에서 1.12nH의 인덕턴스, 5GHz에서 최대 35 정도의 품질계수를 가지며, SRF는 16GHz로 시뮬레이션 결과를 얻을 수 있었다.

• 설비공학논문집
• /
• 제20권11호
• /
• pp.767-774
• /
• 2008

This paper presented the heat transfer and pressure drop characteristics for micro plate heat exchanger with straight channel. The metal sheets for straight channel are manufactured by chemical etching and fabricated micro plate heat exchangers by using the vacuum brazing of bonding technology. The performance experiments are performed within the Reynolds numbers range of 15$\sim$250 under the same flow rate conditions for hot and cold sides. The inlet temperature of hot and cold water are conducted in the range of $30^{\circ}C{\sim}50^{\circ}C$ and $15^{\circ}C{\sim}25^{\circ}C$, respectively. Heat transfer rate and pressure drop are evaluated by the Reynolds numbers and mass flow rates as the inlet temperature variations of the hot and cold sides. Correlations of Nusselt number and friction factor are suggested for micro plate heat exchanger with straight channel using the results of performance experiment.

• 전기학회논문지
• /
• 제60권2호
• /
• pp.362-369
• /
• 2011

In this paper, optimal deep reactive ion etching (DRIE) process conditions for fused quartz were experimentally determined by Taguchi method, and fused quartz-based micro cantilevers were fabricated. In addition, comparative study on Q-factors of fused quartz and silicon micro cantilevers was performed. Using a silicon layer as an etch mask for fused quartz DRIE process, different 9 flow rate conditions of $C_4F_8$, $O_2$ and He gases were tested and the optimum combination of these factors was estimated. Micro cantilevers based on fused quartz were fabricated from this optimal DRIE condition. Through conventional silicon DRIE process, single-crystalline silicon micro cantilevers whose dimensions were similar to those of quartz cantilevers were also fabricated. Mechanical Q-factors were calculated to compare intrinsic damping properties of those two materials. Resonant frequencies and Q-factors were measured for the cantilevers having fixed widths and thicknesses and different lengths. The Q-factors were in a range of 64,000 - 108,000 for fused quartz cantilevers and 31,000 - 35,000 for silicon cantilevers. The experimental results supported that fused quartz had a good intrinsic damping property compared to that of single crystalline silicon.

• 마이크로전자및패키징학회지
• /
• 제23권4호
• /
• pp.31-34
• /
• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• 한국정밀공학회지
• /
• 제25권11호
• /
• pp.90-94
• /
• 2008

Recently, a great deal of research is focused on the printed electronics. One of their mainly concerned products is printed RFID tag. RFID technology has attracted researchers and enterprises as a promising method for automatic identification, and they are expected to replace conventional bar codes in inventory tracking and management. The key to successful RFID technology lies in developing low-cost RFID tags and the first step in applying printing technology to RFID systems is to replace antennas that are conventionally produced by etching copper or aluminum. However, due to the printing quality variations, errors, and lower conductivity, the performance of the printed RFID antennas is lower than that of antennas manufactured by conventional etching methods. In this paper, the effect of variations in the printing conditions on the antenna performance is investigated. Three levels for each condition parameter is assumed and effect on the resonant frequency are examined experimentally based on orthogonal array. The most serious factor that affects the resonant frequency of the antenna is the non-uniformity of the edge and the resonant frequency is found to be lower as the non-uniformity increases.

• Journal of Radiation Protection and Research
• /
• 제13권2호
• /
• pp.57-66
• /
• 1988

CR-39 검출기를 부착한 두 종류의 라돈컵을 사용하여 토양중의 라돈 농도를 제주도 일원의 4개지역(제주시, 서귀포시, 대정읍, 성산읍)에서 측정하였다. 본 실험에서는 CR-39 검출기의 최적 부식조건을 $70^{\circ}C$, 6.25N NaOH, 5.5시간으로 결정하였으며, 두 종류의 라돈컵을 지름 15cm, 깊이 50m인 두개의 땅구덩이에 각각 설치하였는데 이중 밀폐된 라돈컵은 구덩이 바닥의 토양 위에, 개방된 라돈컵은 지지대를 이용하여 바닥에서 45cm높이에 설치하였다. CR-39의 부식조건으로는 $70^{\circ}C$의 6.25N NaOH 용액에서 5.5시간 동안 처리하였으며 환산인자로 $1track/mm^{2}{\cdot}30day=0.059Bq/\ell$을 얻었다. 1987년 5월 1일부터 1988년 4월 23일까지 측정한 결과 30일간의 평균 라돈 농도의 연평균치는 개방된 라돈컵과 밀폐된 라돈컵에서 각각 $3.1{\pm}0.3Bq/{\ell}$와 $1.7{\pm}0.2Bq/\ell$였다.