• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.12
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• pp.964-973
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• 2017

In this paper, we analyze the effects of parasitic components of common-mode choke on the common mode and differential mode in a wide band, and we propose a simple method for high-frequency modeling. Common mode and differential mode 2-port networks were configured and the S-parameters in each mode were measured using a network analyzer. Equivalent circuit elements were extracted from the measured results to model a high-frequency equivalent circuit, and the validity was verified by comparing the measured S-parameters with the simulation results.

• Journal of Power Electronics
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• v.17 no.1
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• pp.305-313
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• 2017

A novel interference isolation method is proposed by using several designed coils in capacitive power transfer systems as isolation impedances. For each designed coil, its stray parameters such as the inter-turn capacitance, coil resistance and capacitance between the coil and the core, etc. are taken into account. An equivalent circuit model of the designed coil is established. According to this equivalent circuit, the impedance characteristic of the coil is calculated. In addition, the maximum impedance point and the corresponding excitation frequency of the coil are obtained. Based on this analysis, six designed coils are adopted to isolate the interference from power delivery. The proposed method is verified through experiments with a power carrier frequency of 1MHz and a data carrier frequency of 8.7MHz. The power and data are transferred parrallelly with a data carrier attenuation lower than -5dB and a power attenuation on the sensing resistor higher than -45dB.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.51 no.7
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• pp.370-378
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• 2002

As resent trends in structural construction have been to build taller and larger structures than any time in the past, they have had high flexibility and low damping that can cause large vibration response under severe environmental loading such as earthquakes, winds, and mechanical excitations. The damper with mass and spring is one approach to safeguarding the structure against excessive vibrations. In this paper, the lumped electrical circuit approach of mass/spring system is used to model the mechanical aspects according to the frequency. Therefore, the mass/spring system can be dealt with here and linked with the equivalent circuit of electric linear oscillatory actuator(LOA). Analysis models are two types of vibration control system, active mass damper(AMD) and hybrid mass damper(HMD). AMD consists of the moving coil LOA with mass only The LOA of HMD with mass and spring is composed of the fixed coil and the movable permanent magnet(PM) field part. The PM field part composed magnet modules and iron coke, is the damper marts itself. We Present the motional resistance and reactance of mass/spring system and the system impedance of AMD and HMD according to the frequency.

• Korean Journal of Optics and Photonics
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• v.15 no.4
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• pp.349-354
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• 2004

As a transmitter sub-assembly in the XFP(10 Gb/s Small Form Factor Pluggable) transceiver module, a transmitter optical sub-assembly(TOSA) is designed, fabricated and characterized in view of electrical and thermal performances. For a low-cost and compact packaging TOSA, the bias-tee and the matching resistor are monolithically integrated on the AlN sub-mount and a newly designed coplanar waveguide is drawn in the TO-stem. All optoelectronic components packaged in the TOSA are modeled by the equivalent circuit, which helps to improve and characterize the TOSA performance. The fabricated TOSA shows the -3㏈ bandwidth as high as 11 GHz at an elevated temperature of 85$^{\circ}C$.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.9
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• pp.1308-1316
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• 1989

A simplified 10-element GaAs MESFET equivalent circuit model has been presented which is suitable for the design of ultrabroad-band microwave small-signal amplification, the these circuit element values are extracted from measured S-parameters using complex-curve fitting algorithm. Packaged GaAs MESFET equivalent circuits are composed of intrinsic \ulcornermodel and several extrinsic elements at microwave frequencies, of which the largest effects are caused by package lead inductances. If these are eliminated from measured S-parameters, newly obtained S-parameters are closed to intrinsic \ulcornermodel, and the rest element values can be easily extracted. The modeling results applied to the packaged GaAs MESFET NE71083 are almost equal between the measure S-parameters and the mideled S-parameters within b 2% errors from DC to 8GHz, and errors are increased to \ulcorner% upto 12GHz wide bandwidth.

• Proceedings of the KIEE Conference
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• 2008.10c
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• pp.90-92
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• 2008

A novel solving technique has been developed to analyze the dynamic characteristics of high speed Thomson-coil arc eliminator. The electromagnetic repulsion actuator based on Thomson-coil is taken as the driving part of the arc eliminator, due to which, the opening and closing time is quite short compare to other type actuators. The electromagnetic repulsion actuator is composed of one repulsion plate and two fixed coils, corresponding to the opening coil and closing coil, respectively. The new solving technique is derived based on the equivalent electric circuit model of the system which is set up by dividing the repulsion plate into multi segments using adaptive segmentation method. This solving technique is applied to the dynamic characteristic analysis of electromagnetic repulsion actuators in high speed Thomson-coil arc eliminators. The calculation results are testified by the FEM calculation results and experiment results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.277-278
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• 2005

Admittance Spectroscopic analysis was applied to study the effect of LiF buffer layer and to model the equivalent circuit for poly(2-methoxy-5-(2'-ethylhexyloxy)-1,4-phenylenevinylene) (MEH-PPV)-based polymer light emitting diodes (PLEDs) with the LiF cathode buffer layer. The single layer device with ITO/MEH-PPV/Al structure can be modeled as a simple parallel combination of resistor and capacitor. Insertion of a LiF layer at the Al/MEH-PPV interface shifts the highest occupied molecular orbital level and the vacuum level of the MEH-PPV layer as a result the barrier height for electron injection at the Al/MEH-PPV interface is reduced. The admittance spectroscopy measurement of the devices with the LiF cathode buffer layer shows reduction in contact resistance ($R_c$), parallel resistance ($R_p$) and increment in parallel capacitance ($C_p$).

• Korean Journal of Optics and Photonics
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• v.22 no.1
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• pp.35-39
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• 2011

The PSPICE equivalent circuit elements of a 1550 nm InGaAsP laser diode were derived by using multi-level rate equations. The device parameters were extracted by using a self-consistent numerical method for the optical gain properties of the MQW active regions. The resulting equivalent circuit model is also applied to an actual optical transmitter, and its PSPICE simulation results show good agreement with the measured results once the parasitic capacitance due to the packaging is taken into account.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.4
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• pp.255-261
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• 2005

With the advent of sub-90nm technologies, the system-on-chip (SoC) and system-in-package (SiP) are becoming the trend in delivering low-cost, low-power, and small-form-factor consumer electronic systems running at multiple GHz. The shortened transistor channel length reduces the transistor switching cycles to the range of several picoseconds, yet the time-of-flights of the critical on-chip and off-chip interconnects are in the range of 10 picoseconds for 1.5mm-long wires and 100 picoseconds for 15mm-long wires. Designers realize the bottleneck today often lies at chip-to-chip interconnects and the industry needs a good model to compute the inductance in these parts of circuits. In this paper we propose a new method for extracting accurate equivalent inductance circuit models for SPICE-level circuit simulations of system-on-chip (SoC) and system-in-package (SiP) designs. In our method, geometrical meshes are created and numerical methods are used to find the solutions for the electromagnetic fields over the fine meshes. In this way, multiple-GHz SoC and SiP designers can use accurate inductance modeling and interconnect optimization to achieve high yields.

• The Transactions of the Korean Institute of Power Electronics
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• v.23 no.5
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• pp.305-312
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• 2018

DC distribution systems has recently taken the spotlight. Concerns over human safety and stability facility are raised in DC distribution systems. Std. IEC 60479 provides basic guidance on "the effects of shock current on human beings and livestock" for use in the establishment of electrical safety requirements and suggests an electrical impedance of the human body. This study analyzes impedance spectrums based on the electrical equivalent impedance circuit for the human body; human body impedances measured by experiments are analyzed below the fundamental frequency (60 Hz). The analysis shows that the equivalent impedance circuit for the human body should be modified at least in low-frequency range below the fundamental frequency (60 Hz). The DC residual current detection method that can classify electric shock accidents of humans and electric leakages of facilities is proposed by applying the analysis result. The detection method is verified by experiments on livestock.