• Title/Summary/Keyword: Equipment for semiconductor

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Effect of Perovskite Surface Treatment Using Oxygen Atmospheric Pressure Plasma (산소분위기의 상압플라즈마를 이용한 페로브스카이트 표면 처리 효과)

  • Kim, Kyoung-Bo;Lee, Jongpil;Kim, Moojin
    • Journal of Convergence for Information Technology
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    • v.11 no.6
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    • pp.146-153
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    • 2021
  • Recently, research on perovskite semiconductor materials has been performed, and the evaluation of properties using surface treatment for this material is the basis for subsequent studies. We studied the results of surface treatment of perovskite thin films exposed to air for about 6 months by generating oxygen plasma with an atmospheric pressure plasma equipment. The reason for exposure for 6 months is that the perovskite thin film is made of organic and inorganic substances, so when exposed to air, the surface changes through reaction with oxygen or water vapor. Therefore, this change is to investigate whether it is possible to restore the original film. The surface shape and the ratio of elements were analyzed by varying the process time from 1 s to 1200 s in an oxygen plasma atmosphere. It was found that the crystal grains change over a process time of 5 s or more. In order to maintain the properties of the deposited film, it is the optimal process condition between 2 s and 5 s.

Development of High Efficiency Dehumidifiers in low temperature (저온에서 고효율 제습기 개발)

  • Kim, Jong-Ryeol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.9
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    • pp.206-211
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    • 2016
  • Various applications require dry air at low temperature, such automation equipment, semiconductor manufacturing, chemical production lines, and coating processes for the shipbuilding industry. Four evaporators for low temperature (below $0^{\circ}C$) were installed for a dehumidification system. Moist air is cooled sequentially over three evaporators. The first evaporator has an evaporation temperature of $13^{\circ}C$, that of the second evaporator is $5^{\circ}C$, and that of the third evaporator is maintained at $-1.3^{\circ}C$. In the fourth evaporator implantation thereby the moisture contained in the moisture air. A pressure regulator (CPCE 12) is used at this point and is defrosted when the vapor pressure is below a set value. The non-implantation moisture of the air is a heating system that uses the waste heat of a condenser with high temperature. It develops the cooling type's dehumidifier, which is important equipment that prevents the destruction of protein and measures the temperature and humidity at each interval by changing the front air velocity from 1.0 m/s to 4.0 m/s. The cooling capacity was also calculated. The greatest cooling capacity was 1.77 kcal/h for a front air velocity of 2.0 m/s

Rotordynamic Analysis of a Dry Vacuum Pump Rotor-Bearing System for High-Speed Operation (고속 운전용 건식진공펌프 로터-베어링 시스템의 회전체동역학 해석)

  • Lee, An-Sung;Lee, Dong-Hwan;Kim, Byung-Ok
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2006.11a
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    • pp.523-530
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    • 2006
  • A rotordynamic analysis was performed with a dry vacuum pump, which is a major equipment in modern semiconductor and LCD manufacturing processes. The system is composed of screw rotors, lobes picking air, helical gears, driving motor, and support rolling element hearings of rotors and motor. The driving motor-screw rotor system has a rated speed of 6,300rpm, and was modeled utilizing a rotordynamic FE method for analysis, which was verified through the results of its 3-D finite element model. As loadings on the bearings due to the gear action were significant in the system considered, each resultant bearing load was calculated determinately and indeterminately by considering the generalized forces of the gear action as veil as the rotor itself. Each resultant hearing loading was used in calculating each stiffness of rolling element bearings. Design goals are to achieve wide separation margins of critical speeds and favorable unbalance responses of the rotor in the operating range. Then, a complex rotordynamic analysis of the system was carried out to evaluate its forward synchronous critical speeds, whirl natural frequencies and mode shapes, and unbalance responses under various unbalance locations. Results show that the entire system is well designed in the operating range. In addition, the procedure of rotordynamic analysis for dry vacuum pump rotor-bearing system was proposed and established.

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Non-contact Transportation of Flat Panel Substrate by Combined Ultrasonic Acoustic Viscous and Aerostatic Forces

  • Isobe, Hiromi;Fushimi, Masaaki;Ootsuka, Masami;Kyusojin, Akira
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.2
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    • pp.44-48
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    • 2007
  • In recent years, the size of plane substrates and semiconductor wafers has increased. As conventional contact transportation systems composed of, for example, carrier rollers, belt conveyers, and robot hands carry these longer and wider substrates, the increased weight results in increased potential for fracture. A noncontact transportation system is required to solve this problem. We propose a new noncontact transportation system combining acoustic viscous and aerostatic forces to provide damage-free transport. In this system, substrates are supported by aerostatic force and transported by acoustic viscous streaming induced by traveling wave deformation of a disk-type stator. A ring-type piezoelectric transducer bonded on the stator excites vibration. A stator with a high Q piezoelectric transducer can generate traveling vibrations with amplitude of $3.2{\mu}m$. Prior to constructing a carrying road for substrates, we clarified the basic properties of this technique and stator vibration characteristics experimentally. We constructed the experimental equipment using a rotational disk with a 95-mm diameter. Electric power was 70 W at an input voltage of 200 Vpp. A rotational torque of $8.5\times10^{-5}Nm$ was obtained when clearance between the stator and disk was $120{\mu}m$. Finally, we constructed a noncontact transport apparatus for polycrystalline silicon wafers $(150(W)\times150(L)\times0.3(t))$, producing a carrying speed of 59.2 mm/s at a clearance of 0.3 mm between the stator and wafer. The carrying force when four stators acted on the wafer was $2\times10^{-3}N$. Thus, the new noncontact transportation system was demonstrated to be effective.

A Rotordynamic Analysis of Dry Vacuum Pump Rotor-Bearing System for High-Speed Operation (고속 운전용 건식진공펌프 로터-베어링 시스템의 전체동역학 해석)

  • Kim, Byung-Ok;Lee, An-Sung;Noh, Myung-Keun
    • The KSFM Journal of Fluid Machinery
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    • v.10 no.3 s.42
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    • pp.47-54
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    • 2007
  • A rotordynamic analysis was performed with a dry vacuum pump, which is a major equipment in modem semiconductor and LCD manufacturing processes. The system is composed of screw rotors, lobes picking air, helical gears, driving motor, and support rolling element bearings of rotors and motor. The driving motor-screw rotor system has a rated speed of 6,300rpm, and was modeled utilizing a rotordynamic FE method for analysis, which was verified through the results of its 3-D finite element model. As loadings on the bearings due to the gear action were significant in the system considered, each resultant bearing load was calculated determinately and indeterminately by considering the generalized forces of the gear action as well as the rotor itself. Each resultant bearing loading was used in calculating each stiffness of rolling element bearings. Design goals are to achieve wide separation margins of critical speeds and favorable unbalance responses of the rotor in the operating range. Then, a complex rotordynamic analysis of the system was carried out to evaluate its forward synchronous critical speeds, whirl natural frequencies and mode shapes, and unbalance responses under various unbalance locations. Results show that the entire system is well designed in the operating range. In addition, the procedure of rotordynamic analysis for dry vacuum pump rotor-bearing system was proposed and established.

Study on Calibration Methods of Discharge Coefficient of Sonic Nozzles using Constant Volume Flow Meter

  • Jeong, Wan-Seop;Sin, Jin-Hyeon;Gang, Sang-Baek;Park, Gyeong-Am;Im, Jong-Yeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.17-17
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    • 2010
  • This paper address technical issues in calibrating discharge coefficients of sonic nozzles used to measure the volume flow rate of low vacuum dry pumps. The first challenging issue comes from the technical limit that their calibration results available from the flow measurement standard laboratories do not fully cover the low vacuum measurement range although the use of sonic nozzles for precision measurement of gas flow has been well established in NMIs. The second is to make an ultra low flow sonic nozzlesufficient to measure the throughput range of 0.01 mbar-l/s. Those small-sized sonic nozzles do not only achieve the noble stability and repeatability of gas flow but also minimize effects of the fluctuation of down stream pressures for the measurement of the volume flow rate of vacuum pumps. These distinctive properties of sonic nozzles are exploited to measure the pumping speed of low vacuum dry pumps widely used in the vacuum-related academic and industrial sectors. Sonic nozzles have been standard devices for measurement of steady state gas flow, as recommended in ISO 9300. This paper introduces two small-sized sonic nozzles of diameter 0.03 mm and 0.2 mm precisely machined according to ISO 9300. The constant volume flow meter (CVFM) readily set up in the Vacuum center of KRISS was used to calibrate the discharge coefficients of the machined nozzles. The calibration results were shown to determine them within the 3% measurement uncertainty. Calibrated sonic nozzles were found to be applicable for precision measurement of steady state gas flow in the vacuum process. Both calibrated sonic nozzles are demonstrated to provide the precision measurement of the volume flow rate of the dry vacuum pump within one percent difference in reference to CVFM. Calibrated sonic nozzles are applied to a new 'in-situ and in-field' equipment designed to measure the volume flow rate of low vacuum dry pumps in the semiconductor and flat display processes.

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A Rotordynamics Analysis of High Efficiency and Hybrid Type Vacuum Pump (고효율 복합형 진공펌프의 로터다이나믹 해석)

  • Kim, Byung-Ok;Lee, An-Sung;Noh, Myung-Keun
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.17 no.10
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    • pp.967-975
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    • 2007
  • A rotordynamic analysis was performed with a dry vacuum pump, which is a major equipment in modern semiconductor and LCD manufacturing processes. The system is composed of screw rotors, lobes picking air, helical gears, driving motor, and support rolling element bearings of rotors and motor. The driving motor-screw rotor system has a rated speed of 6,300 rpm, and was modeled utilizing a rotordynamic FE method for analysis, which was verified through 3-D FE analysis and experimental modal analysis. As loadings on the bearings due to the gear action were significant in the system considered, each resultant bearing load was calculated by considering the generalized forces of the gear action as well as the rotor itself. Each resultant bearing loading was used in calculating each stiffness of rolling element bearings. Design goals are to achieve wide separation margins of lateral and torsional critical speeds, and favorable unbalance responses of the rotor in the operating range. Then, a complex rotordynamic analysis of the system was carried out to evaluate its forward synchronous critical speeds, whirl natural frequencies and mode shapes, unbalance responses under various unbalance locations, and torsional interference diagram. Results show that the entire system is well designed in the operating range. In addition, the procedure of rotordynamic analysis for dry vacuum pump rotor-bearing system was proposed and established.

Fundamental Study on the Maintenance Technology for SF6 Gas Condition using Pressure and UHF Sensors (UHF 및 가스센서를 이용한 SF6 가스 상태 감시기술 기초연구)

  • Ahn, Hee-Sung;Cho, Sung-Chul;Eom, Ju-Hong
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.21 no.2
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    • pp.20-27
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    • 2007
  • [ $SF_6$ ] gas for compacted power facilities has a important role as an insulation gas. It is very blown well that $SF_6$ gas has the superior characteristics as an insulation gas. For reliable operation of SF6-gas-based high and medium voltage equipment it is very important to keep the insulation ability within a safe range. And the experimental and measuring system were implemented. The test chamber designed to endure up to 3 atmospheric pressure. The analysis results of the experimental data shows that positive partial discharge can be detected by discharge current and UHF signal. Additionally it is shown the possibility that $CO_2$ gas sensor of semiconductor type can be detect the variation of $SF_6$ gas condition. The UHF sensor shows good feature to detect the variation of $SF_6$ gas condition for partial discharge and breakdown discharge.

The Properties of $Bi_2Mg_{2/3}Nb_{4/3}O_7$ Thin Films Deposited on Copper Clad Laminates For Embedded Capacitor (임베디드 커패시터의 응용을 위해 CCL 기판 위에 평가된 BMN 박막의 특성)

  • Kim, Hae-Won;Ahn, Jun-Ku;Ahn, Kyeong-Chan;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.45-45
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    • 2007
  • Capacitors among the embedded passive components are most widely studied because they are the major components in terms of size and number and hard to embed compared with resistors and inductors due to the more complicated structure. To fabricate a capacitor-embedded PCB for in-line process, it is essential to adopt a low temperature process (<$200^{\circ}C$). However, high dielectric materials such as ferroelectrics show a low permittivity and a high dielectric loss when they are processed at low temperatures. To solve these contradicting problems, we studied BMN materials as a candidate for dielectric capacitors. processed at PCB-compatible temperatures. The morphologies of BMN thin films were investigated by AFM and SEM equipment. The electric properties (C-F, I-V) of Pt/BMN/Cu/polymer were evaluated using an impedance analysis (HP 4194A) and semiconductor parameter analyzer (HP4156A). $Bi_2Mg_{2/3}Nb_{4/3}O_7$(BMN) thin films deposited on copper clad laminate substrates by sputtering system as a function of Ar/$O_2$ flow rate at room temperature showed smooth surface morphologies having root mean square roughness of approximately 5.0 nm. 200-nm-thick films deposited at RT exhibit a dielectric constant of 40, a capacitance density of approximately $150\;nF/cm^2$, and breakdown voltage above 6 V. The crystallinity of the BMN thin films was studied by TEM and XRD. BMN thin film capacitors are expected to be promising candidates as embedded capacitors for printed circuit board (PCB).

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Influence of Plasma Corrosion Resistance of Y2O3 Coated Parts by Cleaning Process (세정공정에 따른 Y2O3 코팅부품의 내플라즈마성 영향)

  • Kim, Minjoong;Shin, Jae-Soo;Yun, Ju-Young
    • Journal of Surface Science and Engineering
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    • v.54 no.6
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    • pp.365-370
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    • 2021
  • In this research, we proceeded with research on plasma resistance of the cleaning process of APS(Atmospheric Plasma Spray)-Y2O3 coated parts used for semiconductor and display plasma process equipment. CF4, O2, and Ar mixed gas were used for the plasma environment, and respective alconox, surfactant, and piranha solution was used for the cleaning process. After APS-Y2O3 was exposed to CF4 plasma, the surface changed from Y2O3 to YF3 and a large amount of carbon was deposited. For this reason, the plasma corrosion resistance was lowered and contamination particles were generated. We performed a cleaning process to remove the defect-inducing surface YF3 layer and carbon layer. Among three cleaning solutions, the piranha cleaning process had the highest detergency and the alconox cleaning process had the lowest detergency. Such results could be confirmed through the etching amount, morphology, composition, and accumulated contamination particle analysis results. Piranha cleaning process showed the highest detergency, but due to the very large thickness reduction, the base metal was exposed and a large number of contaminated particles were generated. In contrast, the surfactant cleaning process exhibit excellent properties in terms of surface detergency, etching amount, and accumulated contamination particle analysis.