• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.135-135
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• 2003

The fast evolution in the fold of optical communication systems demands powerful optical information treatment. These functions can be performed by integrated optical systems. A key component of such systems is erbium doped waveguide amplifier(EDWA). The intra 4f radiative transition of Er at 1.5 $\mu\textrm{m}$ is particularly interesting because this wavelength is standard in optical telecommunications. The fabrication of waveguide amplifier for integrated optics using sol-gel process has received an increasing attention. Potential advantage of lower cost by less capital equipment and easy processing makes this process an attractive alternatives to conventional technologies like flame hydrolysis deposition, ion exchange and chemical vapor deposition, etc. In addition, sol-gel process has been found to be extremely suitable for the control of composition and refractive index related directly with optical properties. The main drawback of such an amplifier with respect to the EDWA is the need for a much higher Er3+ concentration to compensate for the smaller interaction length. However, the high doping of Er might be resulted in the non-radiative relaxation by clustering of Er ions End co-operative upconversion. In order to solve this problem, we investigate the possibility of avoiding short Er-Er distances by encapsulation of Er3+ ions in hosts such as organic-inorganic hybrid materials. For inorganic-organic hybrid sols, methacryloxypropyltrimethoxysilane (MPTS), zirconyl chloride octahydrate and erbium(III) chloride hexahydrate were used as starting materials, followed by conventional sol-gel process. It was observed by TEM that nano sols having core/shell toplology were formed, depending on the mole ratio of Zr/Er. The surface roughness for the coatings on Si substrate was investigated by AFM as a function of Zr/Er ratio. The local environment and vibrational Properties of Er3+ ions were studied using Near-IR, FT-IR, and UV/Vis spectroscopy. Nano hybrid coatings derived from polymer and Er doped encapsulation Eave the good luminescence at 1.55$\mu\textrm{m}$.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.1-5
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• 2017

Encapsulation of organic based devices is essential issue due to easy deterioration of organic material by water vapor. Thin layer of encapsulation film is required to preserve transparency yet protecting materials in it. Atomic layer deposition(ALD) is a promising solution because of its low temperature deposition and quality of the deposited film. $Al_2O_3$ or $Al_2O_3/TiO_2/Al_2O_3$ multilayer film has shown excellent environmental protection characteristics despite of thin thicknesses of the films. $Al_2O_3/TiO_2/Al_2O_3$ multilayer and 1.5 dyad layer of $Al_2O_3/polymer/Al_2O_3$ deposited by ALD was measured to have water vapor transmittance rate(WVTR) well below the detection limit($5.0{\times}10^{-5}g/m^2day$) of MOCON Aquatran 2 equipment.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.26-34
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• 2016

In this study, core-crosslinked amphiphilic polymer (CCAP) nanoparticles prepared using a reactive amphiphilic polymer precursor (RARP) were used for preparing some valuable compounds encapsulated polymer nanoparticles with high payload through nanoprecipitation process. Various solvents (acetone, ethanol, and THF) having different polarity and CCAP nanoparticles prepared using different amphiphilicity were used for the preparation of ${\alpha}$-tocopherol encapsulated polymer nanoparticles to investigate their effects on the encapsulation efficiency, payload, nanoparticle size, and stability. CCAP dissolved in hydrophobic solvent, THF, could form ${\alpha}$-tocopherol encapsulated polymer nanoparticles dispersed in water with the high payload of ${\alpha}$-tocopherol and encapsulation efficiency. Because of their physically and chemically robust nano-structure originated from crosslinking of the hydrophobic core, CCAP nanoparticles could encapsulate ${\alpha}$-tocopherol with the high payload (33 wt%) and encapsulation efficiency (97%), and form 70 nm-sized stable nanoparticles in water.

• Journal of the Korean institute of surface engineering
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• v.47 no.3
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• pp.99-103
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• 2014

The encapsulation method of flexible organic light emitting devices (OLEDs) was investigated for the structure of ITO / 2-TNATA / NPB / $Alq_3$ : Rubrene (1 vol.%) / $Alq_3$ / LiF / Al / $Alq_3$ / LiF / Al (OLED #1), on which $SiN_x$ thin film was deposited and metal film was attached to protect the damage of OLED from oxygen and moisture. The $SiN_x$ thin film was deposited by plasma enhanced chemical vapor deposition (PECVD) method using $SiH_4$ of 20 sccm and $N_2$ of 15~35 sccm as reactor gases. The optimum $SiN_x$ deposition condition was found to be 20 sccm $SiH_4$ and 20 sccm $N_2$ from the Ca test of the fabricated $SiN_x$ thin film. The life time of OLED #1, OLED #1 / $SiN_x$ 200 nm, OLED #1 / $SiN_x$ 400 nm and OLED #1 / $SiN_x$ 400 nm / metal film was 7, 12, 25, and 45 hours, respectively. In conclusion, it has been shown that the lifetime of OLEDs can be improved more than 6 times by $SiN_x$ film and a metal film encapsulation.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.13-28
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• 2021

Since transient electronic devices can operate under harsh conditions such as electrolytic solutions or inside the body, and be removed by hydrolysis after operation, they can replace conventional electronic devices in various research areas like biomedical implantable devices. Moreover, transient electronic devices that can dissolve in water and enzymes are the focus of the new concept of green technology, which can solve electrical waste issues. However, the surroundings of transient electronic devices can deteriorate internal device components. Thus, an encapsulation strategy is introduced for stable operation in solution by shielding the outside of a device with a passive barrier. This article summarizes recent research trends in transient electronic devices, including their background, dissolution behavior, and encapsulation strategies to enhance reliability by blocking water permeation.

• Bulletin of the Korean Chemical Society
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• v.34 no.7
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• pp.2162-2166
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• 2013

The tailored surface modification of electrode materials is crucial to realize the wanted electronic and electrochemical properties. In this regard, a dexterous carbon encapsulation technique can be one of the most essential preparation methods for the electrode materials for lithium rechargeable batteries. For this purpose, DL-malic acid ($C_4H_6O_5$) was here used as the carbon source enabling an amorphous carbon layer to be formed on the surface of Si nanoparticles at enough low temperature to maintain their own physical or chemical properties. Various structural characterizations proved that the bulk structure of Si doesn't undergo any discernible change except for the evolution of C-C bond attributed to the formed carbon layer on the surface of Si. The improved electrochemical performance of the carbon-encapsulated Si compared to Si can be attributed to the enhanced electrical conductivity by the surface carbon layer as well as its role as a buffering agent to absorb the volume expansion of Si during lithiation and delithiation.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.39-44
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• 2006

A new kind of silicone-epoxy composite is reported in this research. The silicone-epoxy resin was synthesized by the hydrosilylation of tetramethycyclotetrasiloxane and 4-vinyl-1-cyclohexene 1,2-epoxy with a high reaction yield. It was found that the obtained silicone-epoxy resin shows a high reactive activity to the aluminum complex-silanol catalyst. The resin could be cured under the catalysis of $(Al(acac)_3/Ph_2Si(OH)_2$ at a concentration below 0.1 wt% to give a hard cured resin showing excellent optical clarity, UV resistance and thermal stability. It was also found that the Si-H groups facilitated the curing reaction and the silicone-epoxy resin bearing Si-H group could be cured effectively even if $Ph_2Si(OH)_2h$ was absent. Moreover, the UV resistance and thermal stability were improved significantly by the introduction of Si-H groups. This is possibly due to the reductive property of Si-H groups which can annihilate radical and peroxide effectively. This kind of silicone-containing epoxy composite might have very promising applications as optical resin, optical adhesive and encapsulation materials for electronic devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1703-1705
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• 2007

Before the ultra-violet glue encapsulation, the research evaporated LiF thin film on device surface to be the extra packaging layer for improving the lifetime of organic light-emitting diode. The formula of UV glue was specially developed. We found 100 nm LiF is the optimum thickness. The best lifetime obtained by using LiF and special UV glue is 2.4 times longer than those by commercial UV glue.

• International Journal of Concrete Structures and Materials
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• v.3 no.1
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• pp.33-37
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• 2009

Fiber Bragg grating (FBG) sensors already have been the focus for structural health monitoring (SHM) due to their distinguishing advantages. However, as bare optical fiber is very fragile, bare FBG strain sensor without encapsulation can not properly be applied in practical infrastructures. Therefore encapsulation techniques for making encapsulated FBG strain sensor show very important in pushing forward the application of FBG strain sensors in SHM. In this paper, a simplified approximate method to analyze the stress transferring rules for embedded FBG strain sensors in concrete monitoring is put forward according to mechanics of composite materials. Shear lag theory is applied to analyze the stress transferring rule of embedded FBG strain sensor in measured host material at the first time. The measured host objects (concrete) and the encapsulated FBG strain sensor are regarded as a composite, and then the stress transfer formula and stress transfer coefficient of encapsulated FBG strain sensor are obtained.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.05a
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• pp.99-100
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• 2023

In this study, an approach has been made to understand the effect of encapsulation thickness of the nanoencapsulated PCMs on the phase transition kinetics. Paraffin is encapsulated by silica via single pot polycondensation reaction. Different ratios of silica precursor are chosen to encapsulate paraffin. The obtained encapsulated PCMs are identified as nano sized, as well as with increasing silica precursor, thicker silica encapsulations have been manifested with shrinking core diameter. The synthesized PCMs are characterized using various characterization techniques. Isochronal kinetic studies are done in differential scanning calorimeter (DSC) to understand about their phase transformation behaviors. This study can appreciate the cognition of the large-scale applications of PCMs into the building constructions as well as the fundamental conception on the phase transition kinetics of PCMs can also be amended.