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Encapsulation Method of Flexible OLED Using SiNx and Metal Film

SiNx와 금속막을 이용한 플렉시블 OLED 봉지 방법

  • Lee, Hyoe Sun (Department of Advanced Materials Science & Engineering, Daejin University) ;
  • Ju, Sung-Hoo (Department of Advanced Materials Science & Engineering, Daejin University)
  • 이효선 (대진대학교 신소재공학과) ;
  • 주성후 (대진대학교 신소재공학과)
  • Received : 2014.06.09
  • Accepted : 2014.06.26
  • Published : 2014.06.30

Abstract

The encapsulation method of flexible organic light emitting devices (OLEDs) was investigated for the structure of ITO / 2-TNATA / NPB / $Alq_3$ : Rubrene (1 vol.%) / $Alq_3$ / LiF / Al / $Alq_3$ / LiF / Al (OLED #1), on which $SiN_x$ thin film was deposited and metal film was attached to protect the damage of OLED from oxygen and moisture. The $SiN_x$ thin film was deposited by plasma enhanced chemical vapor deposition (PECVD) method using $SiH_4$ of 20 sccm and $N_2$ of 15~35 sccm as reactor gases. The optimum $SiN_x$ deposition condition was found to be 20 sccm $SiH_4$ and 20 sccm $N_2$ from the Ca test of the fabricated $SiN_x$ thin film. The life time of OLED #1, OLED #1 / $SiN_x$ 200 nm, OLED #1 / $SiN_x$ 400 nm and OLED #1 / $SiN_x$ 400 nm / metal film was 7, 12, 25, and 45 hours, respectively. In conclusion, it has been shown that the lifetime of OLEDs can be improved more than 6 times by $SiN_x$ film and a metal film encapsulation.

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References

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