• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2017.11a
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• pp.61-62
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• 2017

In this study, the initiation of steel corrosion was monitored due to chloride attack using embedded sensor. In general, Steel bars embedded in concrete are protected from corrosion by being forming a passive film on the surface. However, the passive film is destroyed by chemical erosion such as concrete carbonation and chloride penetration, and the rebar is exposed to the deteriorating factor and corrosion proceeds. In order to realize the initiation of steel corrosion, OCP and change of Impedance parameter were observed by using Half-cell and EIS method depending on cover depth. As result, 10mm cover showed the impedence increased in 6weeks.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.315-316
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• 2007

최근 전자제품의 경박단소화와 고성능화에 대한 관심이 증가하면서 내장형 수동소자 (Embedded Passive Device)에 대한 연구가 활발히 진행되고 있다. 본 연구에서는 Ni-coated $BaTiO_3$와 PMMA의 함량 변화에 따른 복합체의 유전적 특성을 연구하였다. Ni-coated $BaTiO_3$첨가량을 0~50%까지 증가시키며 유전율을 측정하였으며, 코팅되지 않은 $BaTiO_3$-PMMA복합체의 유전율과 결과를 비교하였다. 본 연구결과 Ni 코팅에 의한 유전율 증가를 관찰할 수 있었으며, 코팅 상태는 코팅공정시의 시간과 온도 등에 의존한다는 것을 확인하였다. 본 논문에서는 이러한 실험결과를 개선된 혼합법칙을 바탕으로 해석하고자 한다.

• Advances in robotics research
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• v.1 no.1
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• pp.21-39
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• 2014

Due to the rapid progress in the field of robotics, it is a high time to concentrate on the development of a robot that can manoeuvre in all type of landscapes, ascend and descend stairs and sloping surfaces autonomously. This paper presents details of a prototype robot which can navigate in very rough terrain, ascend and descend staircase as well as sloping surface and cross ditches. The robot is made up of six differentially steered wheels and some passive mechanism, making it suitable to cross long ditches and landscape undulation. Static stability of the developed robot have been carried out analytically and navigation capability of the robot is observed through simulation in different environment, separately. Description of embedded system of the robot has also been presented and experimental validation has been made along with some details on obstacle avoidance. Finally the limitations of the robot have been explored with their possible reasons.

• Proceedings of the Korean Society of Computer Information Conference
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• 2011.06a
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• pp.367-368
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• 2011

본 논문에서는 PON(Passive Optical Network)망의 장애진단을 위한 임베디드 네트워크 제어기를 설계하고 구현하였다. 본 연구에서 구현한 임베디드 네트워크 제어기는 PON망의 가장 말단인 수용가의 인터넷 공유기에 부착되어 수용가의 인터넷 선로장애를 진단할 수 있도록 구현함으로서 인터넷 서비스 제공자(ISP)의 NMS가 점검할 수 없는 영역까지 장애를 진단할 수 있다. 또한, 임베디드 네트워크 제어기는 PON망의 장애진단 뿐만 아니라 수용가의 가전제품 전원제어나 다양한 센서를 부착하여 제어할 수 있도록 제작하여 간단한 홈오토메이션 제어기로 활용할 수 있도록 설계하였다.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.607-610
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• 2003

The characteristic prediction and analysis of 3-dimensional (3-D) solenoid-type embedded inductors is investigated. The four different structures of 3-D inductor are fabricated by using low-temperature cofired ceramic (LTCC) process. The circuit model parameters of the each building block are optimized and extracted using the partial element equivalent circuit method and HSPICE circuit simulator. Based on the model parameters, predictive modeling is applied for the structures composed of the combination of the modeled building blocks. And the characteristics of test structures, such as self-resonant frequency, inductance and Q-factor, are analyzed. This approach can provide the characteristic conception of 3-D solenoid embedded inductors for structural variations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.760-763
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• 2003

Low Temperature Cofired Ceramics (LTCC) technology is a promising technology to integrate many devices in a module by embedding passive components. For the module substrate, most LTCC structures have dielectric constants below 10 to reduce signal delay time. Some components, which need high dielectric constants, have not been yet embedded in LTCC module. So, embedding capacitor with high capacitance by applying another dielectrics with high dielectric constants in LTCC is an important issue to maximize circuit density in LTCC module. In this study, electrical properties of embedded capacitor fabricated by dielectric paste of high dielectric constants (K-100) and co-firing behavior with LTCC were investigated. To prevent camber development of co-fired structure, constrained sintering process was tested. Dielectric properties of embedded capacitors were calculated from their capacitance and impedance value. Temperature coefficient of capacitance were also measured.

• Geomechanics and Engineering
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• v.20 no.4
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• pp.333-343
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• 2020

Preventing or reducing the damage impact of lateral soil movements on piled foundations is highly dependent on understanding the behavior of passive piles. For this reason, a detailed experimental study is carried out, aimed to examine the influence of soil density, the depth of moving layer and pile spacing on the behavior of a 2×2 free-standing pile group subjected to a uniform profile of lateral soil movement. Results from 8 model tests comprise bending moment, shear force, soil reaction and deformations measured along the pile shaft using strain gauges and others probing tools were performed. It is found that soil density and the depth of moving layer have an opposite impact regarding the ultimate response of piles. A pile group embedded in dense sand requires less soil displacement to reach the ultimate soil reaction compared to those embedded in medium and loose sands. On the other hand, the larger the moving depth, the larger amount of lateral soil movement needs to develop the pile group its ultimate deformations. Furthermore, the group factor and the effect of pile spacing were highly related to the soil-structure interaction resulted from the transferring process of forces between pile rows with the existing of the rigid pile cap.