Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2003.07b
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- Pages.760-763
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- 2003
Characterization of Embedded Thick Film Capacitor in LTCC Substrate
유전체 Paste를 이용한 LTCC 내장형 후막 Capacitor 제작 및 평가
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Cho, Hyun-Min
(KETI) ;
-
Yoo, Myung-Jae
(KETI) ;
-
Park, Sung-Dae
(KETI) ;
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Lee, Woo-Sung
(KETI) ;
- Kang, Nam-Kee (KETI)
-
조현민
(전자부품연구원 고주파재료연구센터) ;
-
유명재
(전자부품연구원 고주파재료연구센터) ;
-
박성대
(전자부품연구원 고주파재료연구센터) ;
-
이우성
(전자부품연구원 고주파재료연구센터) ;
- 강남기 (전자부품연구원 고주파재료연구센터)
- Published : 2003.07.10
Abstract
Low Temperature Cofired Ceramics (LTCC) technology is a promising technology to integrate many devices in a module by embedding passive components. For the module substrate, most LTCC structures have dielectric constants below 10 to reduce signal delay time. Some components, which need high dielectric constants, have not been yet embedded in LTCC module. So, embedding capacitor with high capacitance by applying another dielectrics with high dielectric constants in LTCC is an important issue to maximize circuit density in LTCC module. In this study, electrical properties of embedded capacitor fabricated by dielectric paste of high dielectric constants (K-100) and co-firing behavior with LTCC were investigated. To prevent camber development of co-fired structure, constrained sintering process was tested. Dielectric properties of embedded capacitors were calculated from their capacitance and impedance value. Temperature coefficient of capacitance were also measured.