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Fully Embedded LC Diplexer Passive Circuit into an Organic Package Substrate  

Lee, Hwan-Hee (광운대학교 전자공학과)
Park, Jae-Yeong (광운대학교 전자공학과)
Lee, Han-Sung (대덕전자)
Yoon, Sang-Keun (대덕전자)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.16, no.6, 2007 , pp. 201-204 More about this Journal
Abstract
In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.
Keywords
Organic SOP; diplexer; embedded; packaging; high Q inductor; high DK capacitor;
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