• Title/Summary/Keyword: Electronic packaging technology

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Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

  • Kim, Yoo-Sun;Zhang, Shuye;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.1
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    • pp.35-41
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    • 2015
  • In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

Characterization of Stiffness Coefficients of Silicon Versus Temperature using "Poisson's Rati" Measurements

  • Cho, Chun-Hyung;Cha, Ho-Young;Sung, Hyuk-Kee
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.153-158
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    • 2016
  • The elastic material constants, stiffness constants ($c_{11}$, $c_{12}$, and $c_{44}$), are three unique coefficients that establish the relation between stress and strain. Accurate knowledge of mechanical properties and the stiffness coefficients for silicon is required for design of Micro-Electro-Mechanical Systems (MEMS) devices for proper modeling of stress and strain in electronic packaging. In this work, the stiffness coefficients for silicon as a function of temperature from $-150^{\circ}C$ to $+25^{\circ}C$ have been extracted by using the experimental measurements of Poisson's ratio (${\nu}$) of silicon in several directions.

Development of Cooling System for Electronic Devices using Oscillating Capillary Tube Heat Pipe (진동세관형 히트파이프를 이용한 전자기기 냉각에 대한 연구)

  • Kim Jong-Soo;Ha Soo-Jung
    • Journal of Advanced Marine Engineering and Technology
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    • v.29 no.4
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    • pp.436-442
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    • 2005
  • Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. In this paper, characteristics on oscillating heat pipe according to operating conditions (environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated From the experimental results $25^{\circ}C$(environment temperature) R-141b (working fluid) $40\%$ (charging ratio) was best performace at others of inclination angle and the top heating mode of OCHP performed $80\%$ efficiency of the bottom heating mode.

Research Trends in Thermal Interface Materials for Flexible and Stretchable Electronic Device (유연신축성 전자 디바이스를 위한 열계면 소재 연구동향)

  • Young-Joo Park;Geon-Joo Jeong;Kwang-Seok Kim
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.1
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    • pp.7-15
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    • 2024
  • In the trend of the multi-functionalization, miniaturization, and increased power output trends of flexible and stretchable electronic devices, the development of materials or structures with superior heat transfer characteristics has become a pressing issue. Traditional thermal interface materials (TIM) fail to meet the heat dissipation requirements of flexible and stretchable electronic devices, which must endure rapid bending, twisting, and stretching. To address this challenge, there is a demand for the development of TIM that simultaneously possesses high thermal conductivity and stretchability. This paper examines the research trends of liquid metal, carbon, and ceramic-based stretchable thermal interface materials and explores effective strategies for enhancing their thermal and mechanical properties.

Hands-On Experience-Based Comprehensive Curriculum for Microelectronics Manufacturing Engineering Education

  • Ha, Taemin;Hong, Sang Jeen
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.5
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    • pp.280-288
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    • 2016
  • Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

Epoxy-Based Siloxane/Silica Composites for Electronic Packaging by Composition and Molecular Structure of Siloxane, and Analysis of Changes in Properties (조성 및 실록산 분자 구조에 따른 전자 패키징용 에폭시 기반 실록산/실리카 복합체의 물성 변화 분석)

  • Junho Jang;Dong Jun Kang;Hyeon-Gyun Im
    • Journal of Powder Materials
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    • v.30 no.4
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    • pp.346-355
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    • 2023
  • Epoxy-based composites find extensive application in electronic packaging due to their excellent processability and insulation properties. However, conventional epoxy-based polymers exhibit limitations in terms of thermal properties and insulation performance. In this study, we develop epoxy-based siloxane/silica composites that enhance the thermal, mechanical, and insulating properties of epoxy resins. This is achieved by employing a sol-gel-synthesized siloxane hybrid and spherical fused silica particles. Herein, we fabricate two types of epoxy-based siloxane/silica composites with different siloxane molecular structures (branched and linear siloxane networks) and investigate the changes in their properties for different compositions (with or without silica particles) and siloxane structures. The presence of a branched siloxane structure results in hardness and low insulating properties, while a linear siloxane structure yields softness and highly insulating properties. Both types of epoxy-based siloxane/silica composites exhibit high thermal stability and low thermal expansion. These properties are considerably improved by incorporating silica particles. We expect that our developed epoxy-based composites to hold significant potential as advanced electronic packaging materials, offering high-performance and robustness.

Study of IoT Module Package Design Optimization for Drop Testing by Drone (IoT 모듈 패키지 디자인 최적화 및 드론에서의 낙하해석 연구)

  • Jo, Eunsol;Kim, Gu-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.4
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    • pp.63-67
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    • 2021
  • In order to detect fires that may not be visible to the naked eye, an IoT module that uses changes in Carbon dioxide (CO2) levels and temperature to effectively identify ambers (dying flames) was developed. Finite element analysis was then used to optimize the packaging for this module. Given the nature of ambers, the low power long range LoRa (Long Range) technology was used in the development of this module. To protect the module, a number of packages were designed, and comparative analysis performed on the stress generated when they fall. The results of which show that Model C showed the lowest stress. In addition, unlike other models in which stress concentration was predicted in the module mounting part of the package, in this model the stress concentration phenomenon was predicted in the wing part. It was therefore determined that this approach is ideal for protecting the internal module, and a package to which this was applied was manufactured.

Thickness Effect of Double Layered Sheet on Burr Formation during Micro-Via Hole Punching Process (미세 비아홀 펀칭 공정 중 이종 재료 두께에 따른 버 생성)

  • 신승용;임성한;주병윤;오수익
    • Transactions of Materials Processing
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    • v.13 no.1
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    • pp.65-71
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    • 2004
  • Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

Corrosion Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging (반도체 패키징용 금-코팅된 은 와이어의 부식특성)

  • Hong, Won Sik;Kim, Mi-Song;Kim, Sang Yeop;Jeon, Sung Min;Moon, Jeong Tak;Kim, Youngsik
    • Corrosion Science and Technology
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    • v.20 no.5
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    • pp.289-294
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    • 2021
  • In this study, after measuring polarization characteristics of 97.3 wt% Ag, Au-Coated 97.3 wt% Ag (ACA) and 100 wt% Au wires in 1 wt% H2SO4 and 1 wt% HCl electrolytes at 25 ℃, corrosion rate and corrosion characteristics were comparatively analyzed. Comparing corrosion potential (ECORR) values in sulfuric acid solution, ACA wire had more than six times higher ECORR value than Au wire. Thus, it seems possible to use a broad applied voltage range of bonding wire for semiconductor packaging which ACA wire could be substituted for the Au wire. However, since the ECORR value of ACA wire was three times lower than that of the Au wire in a hydrochloric acid solution, it was judged that the use range of the applied voltage and current of the bonding wire should be considered. In hydrochloric acid solution, 97.3 wt% Ag wire showed the highest corrosion rate, while ACA and Au showed similar corrosion rates. Additionally, in the case of sulfuric acid solution, all three types showed lower corrosion rates than those under the hydrochloric acid solution environment. The corrosion rate was higher in the order of 97.3 wt% Ag > ACA > 100 wt% Au wires.