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http://dx.doi.org/10.5781/KWJS.2012.30.6.487

Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module  

Kang, Myong-Suk (Dept. Electronic Packaging, University of Science & Technology)
Bang, Jung-Hwan (Advanced Welding & Joining Technology, Korea Institute of Industrial Technology)
Lee, Chang-Woo (Advanced Welding & Joining Technology, Korea Institute of Industrial Technology)
Publication Information
Journal of Welding and Joining / v.30, no.6, 2012 , pp. 1-5 More about this Journal
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Times Cited By KSCI : 2  (Citation Analysis)
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1 S. K. Kang and A. K. Sharkel, "Pb-free solders for Electronic Packaging", J. Electron. Mater., 23(8), 701 (1994)   DOI
2 M. McCormack and S. Jin, "Improved Mechanical Properties in New, Pb-Free Solder Alloys", J. Electron. Mater., 23(8), 715 (1994)   DOI   ScienceOn
3 Y. K. Jee, Y. H. Ko, and J. Yu, J. Mater. Res., "Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints", J. Mater. Res., 22(10), 1879 (2007)   DOI   ScienceOn
4 B. I. Noh, S. H. Won, and S. B. Jung, "Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder", J. Microelectron. Packag. Soc., 14(4), 21 (2007)   과학기술학회마을
5 J. H. Choi, S. W. Jun, H. J. Won, B. Y. Jung, and T. S. Oh, "Electromigration Behavior of the Flip-Chip Bonded Sn-3.5Ag-0.5Cu Solder Bumps", J. Microelectron. Packag. Soc., 11(4), 43 (2004)   과학기술학회마을
6 R. W. Johnson, J. L. Evans, P. Jacobsen, J. R. Thompson, and M. Christopher, "The Changing Automotive Environment: High-Temperature Electronics", IEEE Trans. Electron. Package. Manufac. 27(3), 164 (2004)   DOI   ScienceOn
7 R. W. Johnson, J. L. Evans, P. Jacobsen, J. R. Thompson, and M. Christopher, "The Changing Automotive Environment: High-Temperature Electronics", IEEE Trans. Electron. Package. Manufac. 27(3), 164 (2004)   DOI   ScienceOn
8 Y. S. Chen, C. S. Wang, and Y. J. Yang, "Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components", Microelectron. Reliab., 48, 638 (2008)   DOI   ScienceOn
9 J. M. Song, T. S. Lui, G. F. Lan, and L. H. Chen, "Resonant vibration behavior of Sn-Zn-Ag solder alloys", J. Alloy. Compd., 379 (2004)
10 S. K. KANG, W. K. CHOI, M. J. YIM, and D. Y. SHIH, "Studies of the Mechanical and Electrical Properties of Lead-Free Solder Joints", J. Electron. Mater., 31(11), 1292 (2002)   DOI   ScienceOn