• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.89-93
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• 2018

1200V 이상 급의 전기자동차의 파워 모듈에 적용되는 세라믹 기판은 구동 전력으로 고전력이 인가되는 특성상 고열전도도, 고 전기절연성, 저열팽창계수, 급격한 온도 변화에 대한 저항성의 특성이 요구된다. 방열기판에 적용되는 세라믹 중 질화알루미늄과 질화규소는 그 요구를 충족하는 소재로서 고려되고 있다. 이에 따라 본 논문에서는 질화알루미늄과 질화규소의 방열기판 소재로서의 특성을 상용해석프로그램을 통해 비교하였다. 그 결과 질화규소는 질화알루미늄에 대해 각각 동일한 조건의 열을 부여하는 공정을 시물레이션으로 구현했을 때 스트레스와 휨이 덜 발생하여 더 우세한 내충격성, 내stress성을 보였다. 열전도도 측면에서는 질화알루미늄이 방열 소재로서 더 우수한 특성을 지니지만 신뢰성 측면에서는 질화규소가 더 우세함을 시물레이션을 통해 관찰하였다.

• 한국식품저장유통학회지
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• 제19권3호
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• pp.328-336
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• 2012

데침 나물류의 품질유지에 효과적인 포장방법을 개발하기 위하여 포장 방법에 따른 데친 나물의 저장 중 품질변화를 조사하였다. 고사리, 토란대, 취나물, 시래기를 데친 후 비닐포장, 밀봉포장, 진공포장 방법으로 각각 개별 포장하여 $10^{\circ}C$에서 10일 동안 저장하면서 미생물 검사, 경도, pH, 냄새성분 분석을 수행하였다. pH는 데침 나물의 종류에 따라 상이했고 데친 취나물과 데친 시래기의 경우 포장방법에 따른 유의적인 차이가 있었다. 경도는 저장기간이 늘어날수록 모든 시료에서 감소하는 경향을 보였고 진공포장을 한 데친 고사리와 데친 취나물에서 경도가 상대적으로 높은 경도를 유지하였다. 데침 나물의 미생물 검사 결과 모든 시료가 저장기간 동안 호기성세균과 대장균군수가 증가하는 경향을 보였고, 대장균은 검출되지 않았다. 포장방법별 데침나물의 균수는 진공<밀봉<비닐 순으로 높게 나타났다. 전자코를 이용한 냄새성분은 전반적으로 모든 시료구에서 포장방법에 따른 냄새패턴 변화율이 차이가 났으며 제 1주성분값은 positive에서 negative로 이동하는 경향을 나타내었다. 포장방법에 있어서 진공포장방법이 냄새성분의 변화율이 가장 낮았다. 저장기간 동안의 냄새변화율은 비닐포장의 경우 데친 고사리와 데친 취나물은 저장 7일, 데친 시래기는 저장 3일 이후부터 냄새의 변화가 급격한 반면 진공포장은 저장기간 동안 냄새변화가 거의 없었다. 결론적으로 저장기간 동안 포장 조건에 따른 데친 나물의 품질 유지에 있어서 진공포장이 가장 효과적임을 확인할 수 있었다.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.7-14
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• 2015

Recently, advances in nano-material researches have opened the door for various transparent conductive materials, which include carbon nanotube, graphene, Ag and Cu nanowire, and printable metal grids. Among them, Ag nanowires are particularly interesting to synthesize because bulk Ag exhibits the highest electrical conductivity among all metals. Here we reviewed recently-published research works introducing various devices from organic light emitting diode to tactile sensing devices, all of which are employing AgNW for a conducting material. They proposed methods to enhance the stretchability and reversibility of the transparent electrodes, and apply them to make various flexible and stretchable electronics. It is expected that Ag nanowires are applicable to a wide range of high-performance, low-cost, stretchable electronic devices.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• 마이크로전자및패키징학회지
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• 제22권3호
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• pp.9-17
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• 2015

After its inception in 1994, the Journal of the Microelectronics and Packaging Society has continued to make significant strides in the number and quality of publications within its field. The interest in the microelectronics and packaging research has become more critical as consumer electronic products continue its increasing trend towards thinner and lighter devices that tests the boundaries of electronic devices. This study utilizes social network analysis of all published literature in the Journal for the past 22 years. Using the keywords and abstracts available within each individual article, the publications within the Journal has focused on major topics covering (1) flip chip, (2) reliability, (3) Cu, (4) IMC (intermetallic compounds), and (5) thin film. Using the social network relationship between keywords within articles, flip chip was closely associated with reliability, BGA (ball grid array), contact resistance, electromigration in many of the published research works within the Journal. From the centrality analysis, it was found that flip chip, reliability, Cu, thin film, IMC, and RF (radio frequency) to have a high degree of centrality suggesting these key areas of research have relatively high connectivity with other research topics within the Journal and is central to many of the research fields within the micro-electronics and packaging area. The cohesiveness analysis showed research clustering of five major cohesive sub-groups and was mapped to better understand the major area of research within this field. Research within the field of micro-electronics and packaging converges many disciplines of science and engineering. The continued evolution within this field requires an understanding of the rapidly changing industry environment and the consumer needs.

• 마이크로전자및패키징학회지
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• 제24권3호
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• pp.1-6
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• 2017

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

• 펄프종이기술
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• 제39권2호
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• pp.45-53
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• 2007

When micro flute corrugated paperboards are used for food packaging, they necessarily need to meet the requirements for the distribution, transportation, and storage of food. The requirements could vary ac-cording to the contents in the packaging boxes. Microflute corrugated packaging paperboard for hot foods such as just-made coffee and hamburger requires to have a decent resistance property against high temperature. Along with a recent trend for small-quantity-multi-item upgraded packaging, semiconductor products and consumer-electronic appliances become to be packed using the environmental friendly micro flute corrugated paperboard. In this case, the electric resistance property of the microflute corrugated paperboard becomes important. This study was carried out to investigate on the thermal conductivity and electric resistance properties of micro flute corrugated paperboard.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.417-418
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• 2008

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.73-73
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• 2004

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.61-73
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.