Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Past and Present Research Topics within the Korean Micoelectronics and Packaging Using Social Network Analysis

미래를 향하는 한국 마이크로 패키징 학회지의 과거와 현재 연구영역에 관한 연구

  • Lee, Hyunjoung (Institute of Green Technology, Yonsei University) ;
  • Sohn, Il (Department of Material Science and Engineering, Yonsei University)
  • 이현정 (연세대학교 그린기술연구원) ;
  • 손일 (연세대학교 공과대학 신소재공학과)
  • Received : 2015.08.31
  • Accepted : 2015.09.24
  • Published : 2015.09.30
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Abstract

After its inception in 1994, the Journal of the Microelectronics and Packaging Society has continued to make significant strides in the number and quality of publications within its field. The interest in the microelectronics and packaging research has become more critical as consumer electronic products continue its increasing trend towards thinner and lighter devices that tests the boundaries of electronic devices. This study utilizes social network analysis of all published literature in the Journal for the past 22 years. Using the keywords and abstracts available within each individual article, the publications within the Journal has focused on major topics covering (1) flip chip, (2) reliability, (3) Cu, (4) IMC (intermetallic compounds), and (5) thin film. Using the social network relationship between keywords within articles, flip chip was closely associated with reliability, BGA (ball grid array), contact resistance, electromigration in many of the published research works within the Journal. From the centrality analysis, it was found that flip chip, reliability, Cu, thin film, IMC, and RF (radio frequency) to have a high degree of centrality suggesting these key areas of research have relatively high connectivity with other research topics within the Journal and is central to many of the research fields within the micro-electronics and packaging area. The cohesiveness analysis showed research clustering of five major cohesive sub-groups and was mapped to better understand the major area of research within this field. Research within the field of micro-electronics and packaging converges many disciplines of science and engineering. The continued evolution within this field requires an understanding of the rapidly changing industry environment and the consumer needs.

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