• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.1
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• pp.131-138
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• 2001

The performance analysis of an electronic equipment test is very complicate due to the variety o vehicles. In this study, automatic design system for the electronic equipment test has been carried out using the standard load patterns. For the test, standard signal patterns for each item are modeled. The test items can be decided by the user by means of these patterns. Also, engineering software modules are developed and proved to be very efficient for analyzing the test results statistically. Experiments are performed for the test system in the vehicle assembly line. By analyzing the test results, it is found that bad samples can be detected without failure. Also, the engineering software modules provide an analytical tool for the automation of the test process.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.49 no.2
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• pp.147-154
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• 2021

In this paper, the configuration and design of the test equipment are presented to examine the impact of rapid temperature change in cooling-air that may occur during the operation of the fixed wing aircraft Environmental Control System (ECS) on avionic electronic equipment. At the start of the ECS, the temperature of the air supplied by the aircraft ECS may be increased to 5.0℃ per second. In order to ensure operating of the avionic electronic equipment that is mounted on the aircraft and receives cooling-air from the ECS, testing equipment that can implement the cooling-air characteristic test environment is required. During design of test equipment was verified cooling-air rapid rate of temperature change by performing a thermal/flow analysis, performance of the test equipment implemented was verified by applying an avionic electronic equipment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.10
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• pp.1421-1424
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• 2013

The electronic equipment which is exposed to high level pulsed radiation is damaged by Upset, Latchup, and Burnout. Those damages come from the instantaneous photocurrent from electron-hole pairs generated in itself. Such damages appear as losses of a power in military weapon system or as a blackout in aerospace equipment and eventually caused in gross loss of national power. In this paper, we have implemented a RDC(Radiation detection and control module) as a part of the radiation protection technology of the electronic equipment or devices from the pulsed gamma radiation. The RDC, which is composed of pulsed gamma-ray detection sensor, signal processors, and pulse generator, is designed to protect the an important electronic circuits from the a pulse radiation. To verify the functionality of the RDC, LM118s, which had damaged by the pulse radiation, were tested. The test results showed that the test sample applied with the RDC was worked well in spite of the irradiation of a pulse radiation. Through the experiments we could confirm that the radiation protection technology implemented with the RDC had the functionality of radiation protection for the electronic devices.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.3
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• pp.259-262
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• 2013

Multi-site testing is considered as a solution to reduce test costs. This paper presents a new channel sharing architecture that enables I/O pins to share automatic test equipment (ATE) channels using simple circuitry such as tri-state buffers, AND gates, and multiple-input signature registers (MISR). The main advantage of the proposed architecture is that it is implemented on probe cards and does not require any additional circuitry on a target device under test (DUT). In addition, the proposed architecture can perform DC parametric testing of the DUT such as leakage testing, even if the different DUTs share the same ATE channels. The simulation results show that the proposed architecture is very efficient and is applicable to both wafer testing and package testing.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.3
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• pp.91-96
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• 2014

Modern electronic circuits are becoming more vulnerable to damage by surges, and it is required to improve the impulse withstand voltage performance of electrical and electronic equipment. This paper presents the impulse withstand voltage performance of lighting equipment connected to power lines, and the impulse withstand voltage tests for fluorescent lamp, LED lamp and halogen lamp were carried out according to the reference standards under normal service conditions. To conduct performance tests against lightning surge, a combination wave ($1.2/50{\mu}s$ voltage - $8/20{\mu}s$ current) was employed. The test surge was applied between lines or between line and ground of the specimen to be measured. The test surge was applied synchronized at the peak value of the positive and negative AC voltage waves. As a consequence, some specimens satisfied the impulse withstand voltage test criteria, but lighting equipment such as 36W fluorescent lamps, 5W and 5.5W LED lamps and 50W halogen lamp were damaged at the test voltage levels between power lines. It is needed to improve the qualities of lighting equipment to satisfy EMC immunity requirements of equipment for general lighting purposes.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.3
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• pp.333-340
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• 2022

Recently, the use of large-capacity secondary batteries for electric vehicles is rapidly increasing, and accordingly, the demand for technologies and equipment for battery reliability evaluation is increasing significantly. The existing short circuit test equipment for evaluating the stability of the existing secondary battery consists of relays, MCs, and switches, so when a large current is energized during a short circuit, contact fusion failures occur frequently, resulting in high equipment maintenance and repair costs. There was a disadvantage that repeated testing was impossible. In this paper, we developed an electronic short circuit test device that realizes stable switching operation when a large-capacity power semiconductor switch is energized with a large current, and applied smart ICT technology to this electronic short circuit stability test system to achieve high speed and high precision through communication with the master. It is expected that the inspection history management system based on data measurement, database format and user interface will be utilized as essential inspection process equipment.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.15-19
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• 2001

Electronic navigation system onboard have have been developed with recent technology based on new concept such as electronic chart date. The most valuable system of revolution in electronic navigation equipment is ECDIS, which have been developed in order to reduce work load of mariner and give an integrated information by simple means, especially to improve the safety of ship's navigation. In order to be sure the function of ECDIS is satisfied, The international standard have regulated the performance in the standard, so ECDIS should be type approved by the marine equipment authority of each government. There are three basic documents, IEC61174, IEC61162, IEC60945 issued by IMO(International Maritime Organization) which should be used for type approval system of each authority. IEC 61174 include the method of test and required results for operational and functional performance of test equipment. IEC61162 is for sensor interface and IEC60945 is related to the test of environmental condition for general marine radiocommunication equipment. In this paper, we investigate international standard in detail and current approval system of general marine equipment. After that, we present the possible structure of type approval of ECDIS and important considerations of approval system such that ECDIS should be tested as one system not be separated between S/W and H/W.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.17-22
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• 2006

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.