• Journal of the Korean Ceramic Society
• /
• v.48 no.4
• /
• pp.312-315
• /
• 2011

The effect of slurry composition and wafer flatness on a material removal rate (MRR) and resulting surface roughness which are evaluation parameters to determine the CMP characteristics of the on-axis 6H-SiC substrate were systematically investigated. 2-inch SiC wafers were fabricated from the ingot grown by a conventional physical vapor transport (PVT) method were used for this study. The SiC substrate after the CMP process using slurry added oxidizers into slurry consisted of KOH-based colloidal silica and nano-size diamond particle exhibited the significant MRR value and a fine surface without any surface damages. SiC wafers with high bow value after the CMP process exhibited large variation in surface roughness value compared to wafer with low bow value. The CMPprocessed SiC wafer having a low bow value of 1im was observed to result in the Root-mean-square height (RMS) value of 2.747 A and the mean height (Ra) value of 2.147 A.

• Journal of Sensor Science and Technology
• /
• v.29 no.4
• /
• pp.232-236
• /
• 2020

Three-dimensional (3D) multilayered Pt electrodes were fabricated to develop a porous electrode using a pattern-transfer printing process. The Pt thin films were deposited using a transferred sputtering pattern having a 250 nm line width on the substrate, and the uniform line patterns were efficiently transferred using our proposed method. Temperature-programmed desorption (TPD) analyses were used to evaluate the porosity of the electrodes. It was possible to distinguish between two resolved maxima at 168 and 227 ℃, which could be described in terms of desorption reactions on the Pt (111) planes. The results of the TPD analysis of the 3D and multilayered Pt electrodes prepared through transfer printing were compared to those of an electrode fabricated through screen printing using a commercial Pt-carbon paste commonly used as porous electrodes. It was confirmed that the 3D multilayered electrodes exhibited a desorption concentration approximately 100 times higher than that of the Pt-carbon composite electrode, and the desorption concentration increased by approximately 0.02 mg/mol per layer. The 3D multilayered electrode effectively functions as a porous electrode and a catalyst.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2000.11a
• /
• pp.57-57
• /
• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• Korean Journal of Metals and Materials
• /
• v.46 no.7
• /
• pp.458-463
• /
• 2008

High purity Fe thin films were prepared by the ion beam deposition method with $^{56}Fe^{+}$ions on the Si substrate at the room temperature. The Fe thin films were deposited at the ion energy of 50 eV and 100 eV. Microstructural properties were investigated on the atomic scale using high-resolution transmission electron microscopy (HRTEM). It was found that the Fe thin film obtained with the energy of 50 eV having an excellent corrosion resistance consists of the amorphous layer of ~15 nm in thickness and the bcc crystalline layer of about 30 nm in grain size, while the thin film obtained with the energy of 100 eV having a poor corrosion resistance consists of little amorphous layer and the defective crystalline layer. Furthermore the crystal structures and arrangements of the oxide layers formed on the Fe thin films were analyzed by processing of the HRTEM images. It was concluded that the corrosion behavior of Fe thin films relates to the surface morphology and the crystalline structure as well as the degree of purification.

• Journal of the Korean Professional Engineers Association
• /
• v.24 no.5
• /
• pp.9-14
• /
• 1991

To date Korean electronic industry has held a position of the first rank both in productions and exports among the nation's industries. However, it is gradually losing its competitive foundation in the world market owing both to the weakening in price competition by least developed among developing countries(LDDC) and to the lack in technological competition with industrially advanced countries. Specifically it is worried about an industrial subordination to industrially advanced countries owing to an evasion of components supply, control of amount of materials, and the evasion of kernel technology transfer etc. As the condition has developed, both the government and the electronic industry in July of this year came to jointly establish a research and development center for electronic components for the purpose of rehabilitating the electronic industry and accordingly strengthen the export industry which has been and continuance to be vital to our nation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.321-322
• /
• 2005

In this paper, we dealt with a partial discharge(PD) measurement system that has been accepted as an effective and non-destructive technique for estimating reliabilities of low-voltage electrical and electronic components. Calibration tests on laboratory set-up have shown that the PD measurement system has a stable sensitivity of 37.6 mv/pC. In an application test on photo coupler, we could detect 0.1 pC level of partial discharge at the applied voltage of AC 520 $V_{peak}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.202-202
• /
• 2008

The world gross market of many kinds of electronics, such as TV and mobile phone has been increasing rapidly these days. It is mainly caused by the amazing developments of IT technology during past decade and the changes of individual life style for the better. Thanks to the increases of electronics manufactured in quantity, much more electronic components such as MLCC (multi layer ceramic capacitor) and PCB (printed circuit board), which are our main products, have been needed as a consequence. Though it was reported that total market of electronic components exceeds several hundreds of billion dollars, there are many manufactures struggling for survival in the competition of electronics components. Then the recognition of quality as a key technology has spread and the efforts for high-yield production lines have been kept in many companies. In this paper, our efforts to eliminate the contamination of particles and the diffusion of some volatile organic compounds which is very harmful to workers at production line have been introduced.

• Journal of Power System Engineering
• /
• v.20 no.6
• /
• pp.20-26
• /
• 2016

For power electronic devices, the thermal energy density per unit volume has seen a rapid increase in recent years, owing to the miniaturization and dense integration of electronic components, as well as the continuous development in performance and function. This research examined the validity and reliability of a thermal safety model for managing the heating conditions of TRIAC electronic components. Among the electronic components of a PCB, these can be considered as a heat source. Using the model, the heating conditions of TRIAC components were maintained at their design target levels in the process of developing an LMT motor drive board. In addition, the heating characteristics of the entire PCB were analyzed to verify its thermal safety. Finally, the reliability and validity of the thermal safety model for maintaining the heating conditions of the TRIAC electronic elements at adequate levels was verified using a numerical analysis method.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.57-65
• /
• 2017

The electronic components in mobile device are composed of electronic chips and various other materials. These components become extremely thin and the constituent materials have different coefficient of thermal expansion, so that considerable warpages occurs easily due to temperature change or external load. Shadow $moir{\acute{e}}$ is non-contact, whole field technique for measuring out-of-plane displacement, but the measurement sensitivity is not less than $50{\mu}m/fringe$, which is not suitable for measuring the warpage of the electronic components. In this paper, we implemented a measurement method with enhanced sensitivity of $25{\mu}m/fringe$ by investigating and optimizing various experimental conditions of the shadow $moir{\acute{e}}$. In addition, four $moir{\acute{e}}$ fringe patterns recorded by the phase shift are processes to obtain a $moir{\acute{e}}$ fringe patterns with a sensitivity four times higher. The measurement technique is applied to small electronic components of a smart phone for measuring warpage with a high sensitivity of $5{\mu}m/fringe$ at room temperature and at the temperature of $100^{\circ}C$.

• Proceedings of the IEEK Conference
• /
• 2007.07a
• /
• pp.159-160
• /
• 2007

Two analog predsitorters (PDs) using the mixing operation are proposed to compensate for the memory effects of the power amplifier and then significantly cancel IM3 components with the independent control of IM3 terms. In the first PD, IM3 terms are generated by using mixing operation of low frequency terms. In the second PD, the double mixing operation of the fundamental components is used. For a two-tone signal with 20-MHz tone spacing, the notable IM3 suppression is achieved over a whole output power range.