The Effect of Slurry and Wafer Morphology on the SiC Wafer Surface Quality in CMP Process
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Park, Jong-Hwi
(Electronic Ceramics Center (ECC), Department of Materials and Components Engineering, Dong-Eui University)
Yang, Woo-Sung (Electronic Ceramics Center (ECC), Department of Materials and Components Engineering, Dong-Eui University) Jung, Jung-Young (Electronic Ceramics Center (ECC), Department of Materials and Components Engineering, Dong-Eui University) Lee, Sang-Il (Electronic Ceramics Center (ECC), Department of Materials and Components Engineering, Dong-Eui University) Park, Mi-Seon (Electronic Ceramics Center (ECC), Department of Materials and Components Engineering, Dong-Eui University) Lee, Won-Jae (Electronic Ceramics Center (ECC), Department of Materials and Components Engineering, Dong-Eui University) Kim, Jae-Yuk (R&D Center for Advanced Materials, SsangYong Materials Corp.) Lee, Sang-Don (R&D Center for Advanced Materials, SsangYong Materials Corp.) Kim, Ji-Hye (R&D Center for Advanced Materials, SsangYong Materials Corp.) |
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