• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.549-556
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• 2014

This paper proposes a highly power-efficient single-inductor multiple-outputs (SIMO) DC-DC converter with a gate charge sharing method in which gate charges of output switches are shared to improve the power efficiency and to reduce the switching power loss. The proposed converter was fabricated by using a $0.18{\mu}m$ CMOS process technology with high voltage devices of 5 V. The input voltage range of the converter is from 2.8 V to 4.2 V, which is based on a single cell lithium-ion battery, and the output voltages are 1.0 V, 1.2 V, 1.8 V, 2.5 V, and 3.3 V. Using the proposed gate charge sharing method, the maximum power efficiency is measured to be 87.2% at the total output current of 450 mA. The measured power efficiency improved by 2.1% compared with that of the SIMO DC-DC converter without the proposed gate charge sharing method.

• 전자공학회논문지SC
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• 제43권2호
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• pp.33-39
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• 2006

본 논문에서는 휴대용 적외선 야시경의 소형 경량화 및 저전력을 위한 전자회로부를 설계하였다. 설계한 전자회로부는 전압자동변환부와 전원공급부로 구성한다. 전압자동변환부는 배터리, 스위치부, 승압부, 전압선택부 등으로 구성한다. 전원공급부는 고광원 감지회로, 배터리 전압감지회로, 적외선 발광회로, 연결감지회로, 공급제어회로 등으로 구성한다. 설계한 전자회로부의 성능은 AN/PVS-14에 비하여 소모전력 및 상온 연속사용 시간에서 우수하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권4호
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• pp.249-256
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• 2009

As a wireless handset deals with multiple application standards concurrently, RF transmitters and power amplifiers are required to be more power efficient and reconfigurable. In this paper, we review the recent advances in the design of the power amplifiers and transmitters. Then, the systematic design approaches to improve the performance with the digital baseband signal processing are introduced for the next generation mobile handset.

• 전기학회논문지
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• 제67권11호
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• pp.1542-1548
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• 2018

When any faults occurred in electrical railway system, operators need to analysis it quickly and accurately. Existing COMTRADE based analysis tools are not enough to analysis faults occurred in electrical railway system. In this paper, it presents some functions to fault analysis for electrical railway system based on fault data formatted COMTRADE. These functions are implemented in PSCAD/EMTDC and it can be shown that analyzed results against actual electrical fault cases which were occurred in the electrical railway power system.

• 전력전자학회논문지
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• 제17권1호
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• pp.48-56
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• 2012

This paper deals with power electronic converter education program using LabVIEW. LabVIEW is a graphic based programming language with easy debugging, which is suitable for education program that can be used to study and figure out the operation of power electronic converters. When LabVIEW is employed as a simulation program of the operation of power electronic converters, the resulting program has the advantage such that the effects of the change of control variables and circuit parameters on the various variables such as the output voltage and the inductor current etc can be directly displayed without any separate compiling procedure. This paper shows the design procedure and the characteristics of the power electronics education program implemented by LabVIEW focusing on DC-DC converter among power electronic converters.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.499-502
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• 2004

A two-stage Class E power amplifier operated at 2.44GHz is designed in 0.25-$\mu$m CMOS process for Class-l Bluetooth application. The power amplifier employs c1ass-E topology to exploit its soft-switching property for high efficiency. A preamplifter with common-mode configuration is used to drive the output-stage of Class-E type. The amplifier delivers 20-dBm output power with 70$\%$ PAE (power -added-efficiency) at 2-V supply voltage.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2008년도 Asian Magnetics Conference
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• pp.214.1-214.1
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• 2008

• 센서학회지
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• 제31권1호
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• Journal of international Conference on Electrical Machines and Systems
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• 제2권4호
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• pp.441-446
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• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

• Journal of Power Electronics
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• 제9권2호
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• pp.308-319
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• 2009

An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.