• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.34-40
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• 2012

We have developed a highly sensitive inspection technique based on an electron beam inspection for detecting the contact failure of a poly-Si plugged layer. It was difficult to distinguish the contact failure from normal landing plugs with high impedance. Normally, the thermal annealing method has been used to decrease the impedance of poly-Si plugs and this method increases the difference of charged characteristics and voltage contrast. However, the additional process made the loss of time and broke down the device characteristics. Here, the interval scanning method without thermal annealing was effectively applied to enhance the difference of surface voltage between well-contacted poly-Si plugs and incomplete contact plugs. It is extremely useful to detect the contact failures of non-annealed plug contacts with high impedance.

• Journal of People, Plants, and Environment
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• v.23 no.2
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• pp.171-178
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• 2020

The present study was conducted to determine the effects of electron beam irradiation on the postharvest quality of cut flowers. Cut flowers were irradiated with electron beam at 100, 200, 400, 600, 800, 1,000, and 2,000 Gy with a 10 MeV linear electron beam accelerator to evaluate their irradiation tolerance. Postharvest quality was determined by monitoring fresh weight loss, flower longevity, flower diameter, flowering rate, visual quality of flowers and leaves, and chlorophyll content. Cut flowers showed a radiation-induced damage with increasing the irradiation dose. Flower longevity and fresh weight of cut flowers decreased when the irradiation dose was increased. Flower bud opening was also inhibited in a dose-dependent manner. The effective irradiation doses for 10% reduction of postharvest quality (ED₁₀) values were 144.4, 451.6, and 841.2 Gy in the 'Medusa' lily, 'Montezuma' carnation, and 'Rosina White' eustoma, respectively. Although tolerance of cut flowers to electron beam irradiation vary according to species, cultivars, or maturity stage conditions, it is conceivable that 'Montezuma' carnation and 'Rosina White' eustoma could be tolerated and maintained overall postharvest quality up to 400 Gy, the generic irradiation dose approved by the Animal and Plant Health Inspection Service (APHIS) and the International Plant Protection Convention (IPPC) for postharvest phytosanitary treatments.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.402-409
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• 2013

An innovative application of voltage-contrast (VC) inspection allowed inline detection of NMOS leakage in dense SRAM cells is presented. Cell sizes of SRAM are continual to do the shrinkage with bit density promotion as semiconductor technology advanced, but the resulting challenges include not only development of smaller-scale devices, but also intra-devices isolation. The NMOS leakage caused by the underneath n+/P-well shorted to the adjacent PMOS/N-well was inspected by the proposed electron-beam (e-beam) scan in which VC images were compared during the in-line process step of post contact tungsten (W) CMP (Chemical Mechanical Planarization) instead of end-of-line electrical test, which has a long response time. A series of experiments based on the mechanism for improving the intra-well isolation was performed and verified by the inline VC inspection. An optimal process-integration condition involved to the tradeoff between the implant dosage and photo CD was carried out.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1803-1811
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• 2011

We have analyzed the electrical defect detection mechanism using low energy microcolumn on the TFT substrate for TFT-LCD. In this study, we have acquired the SEM images of the various pixel defects for 7-inch TFT substrate by scanning of low energy electron beam in the high vacuum chamber. Futhermore, we have interpreted the defect detection mechanism through the correlations between the SEM images and electrical behaviors of the defective pixels. As a result, we obtained consistent results as the follows. We can confirm that the SEM images using low energy electron beam are significantly affected by the space charge effect.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.5
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• pp.8-14
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• 2008

For nondestructive inspection of electron beam (EB) welding part in automotive power transmission assembly, a pulse-echo ultrasonic testing apparatus in water immersion has been applied using the ultrasonic waves with a frequency of 10MHz. However various problems have appeared during the ultrasonic inspection, which led to some significant mistakes in automatic quality evaluation of the welding parts. Experimental study showed that the state of water couplant medium containing some amount of contaminants, rusts and anti-corrosion agents had considerable influences on the reduction of ultrasonic amplitudes during wave propagation. The amplitude reduction depending on the coupling medium state could bring about some mis-diagnoses for defects in the welding parts. The results proposed that for a reliable inspection of defects in welds the state of water medium should be kept in about 15 volume fractions (vol.%) of anti-corrosion agents and in minimized contaminants.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.793-796
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• 2005

In this paper, we propose a method which can improve uniformity of a miniaturized electron beam array for inspection of very small pattern with high speed using vertical interconnection. This method enables the individual control of columns so that it can reduce the deviation of beam current, beam size, scan range and so on. The test device that used vertical interconnection method was fabricated by multiple wafer bonding and metal reflow. Two silicon and one glass wafers were bonded and metal interconnection by melting of electroplated AuSn was performed. The contact resistance was under $10{\Omega}$.

• Korean Journal of Computational Design and Engineering
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• v.3 no.1
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• pp.22-30
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• 1998

The deflection yoke (DY) controls the direction of the electron beam that falls on the screen of the television monitor. Its quality depends on the shape and density of coils wound around the DY coil separator. Winding frames are used to make these coils, and therefore, their shapes are essential in making quality coils. A reverse engineering(RE) is applied to create the 3D model of the winding frame. It considerably shortens the design verification time and shows the level of accuracy that is feasible in the production mode. The paper explains each step of the reverse engineering process in detail.

• Journal of the Korean Society of Radiology
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• v.14 no.4
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• pp.455-465
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• 2020

The purpose of this study is to evaluate the photoneutron characteristics generated by the linear accelerator target and collimator. The computer simulation design firstly, consisted of a target, a single material target and a composite material target. Secondly, it consisted of a cone beam and a fan beam depending on the type of the collimator. Finally, the material of the fan beam collimator is composed of a single material composed of only lead (Pb) and a composite material collimator composed of tungsten (W) and lead (Pb). The research method calculated the photoneutron production rate and energy spectrum using F2 tally from the surface of a virtual sphere at a distance of 100 cm from the target. As a result, firstly the photoneutron production rate was 20% difference, depending on the target. Secondly, depending on the type of the collimator, there was a 10% difference. Finally, depending on the collimator material, there was a 40% difference. In the photoneutron energy spectrum, the average photoneutron flux tended to be similar to the photoneutron production rate. As a result, it was confirmed that the 9 MeV linear accelerator photoneutron are production increased more by the collimator than by the target, and by the material, not the type of the collimator. Selecting and operating targets and collimator with low photoneutron production will be the most active radiation protection. Therefore, it is considered that this research can be a useful data for introducing and operating and radiation protection of a linear accelerator for container security inspection.

• Journal of Mechanical Science and Technology
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• v.16 no.12
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• pp.1627-1632
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• 2002

In this paper, a simplified ultrasonic CT system, which uses the information in three directions, that is, 90°, ＋45° and －45°about the inspection plane, is applied to the high strength steel, and the frequency analysis method for enhancing the C scan or CT image is developed. This frequency analysis method is based on the frequency response property of the material. By comparing the magnitudes in the frequency domain, the special frequency which shows a significant difference between the welded joint and base material was found and used to obtain a C scan or CT image. Experimental results for several kinds of specimens, having a welded joint by electron beam welding, a weld joint by arc welding, on a fatigue crack, showed that the obtained C scan or CT image has better resolution than the results of previous experiments using the maximum value of the received waveform.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1998.04a
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• pp.302-307
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• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.