• Journal of the Korean institute of surface engineering
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• v.23 no.3
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• pp.144-149
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• 1990

X-ray phtoelectron spectroscopy has been used to obtain information on the behavior of the Pb catalysis and Sn sensitizer on the bariumtitanate ceramic substrate. SnF2 sensitization and PbCl2 activation process are used are used to prepare nonconductive substrate for electroless plating. This method of surface preparation is compared to Pd-Sn mixed solu tions and Ag pretreatment process. In all the case, the bonding energy is about 487.5eV for Sn and 336.5~337.5eV for Pb.

• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.105-110
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• 2010

Electroless nickel plating on porous carbon substrate for the application of MCFC electrodes was investigated. Acidic and alkaline bath were used for the electroless nickel plating. The pore sizes of carbon substrates were 16-20 ${\mu}m$ and over 20 ${\mu}m$. The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at $60^{\circ}C$. The contact angle of water was decreased from $85^{\circ}C$ to less than $20^{\circ}$ after ammonia pretreatment. The deposition rate in the alkaline bath was higher than that in the acidic bath. The deposition rate was increased with increasing pH in both acidic and alkaline bath. The content of phosphorous in nickel deposit was decreased with increasing pH in both acidic and alkaline bath. The contents of phosphorous is low in alkaline bath. The minimum concentration of $PdCl_2$ for the electroless nickel plating was 10 ppm in alkaline bath and 5 ppm in acidic bath. The thickness of nickel was not affected by the concentration of $PdCl_2$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.75-80
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• 2010

Electroless nickel plating on porous carbon substrate was investigated. The pore sizes of carbon substrates were 16-20 ${\mu}m$ and over 20 ${\mu}m$. The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at $60^{\circ}C$. The contact angle of water was decreased from $85^{\circ}$ to less than $20^{\circ}$ after ammonia pretreatment. The content of phosphorous in nickel deposit was decreased with increasing pH and then deposits became crystallized. The thickness of nickel deposit was increased with increasing pH. The minimum concentration of $PdCl_2$ for the electroless nickel plating was 5 ppm and the thickness of nickel was not significantly affected by the concentration of $PdCl_2$.

• Applied Chemistry for Engineering
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• v.16 no.5
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• pp.641-647
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• 2005

The partial oxidation of methane is one of important processes for hydrogen production. As a membrane reactor, palladium-silver (Pd-Ag) alloy membrane prepared by electroless plating technique was employed for partial oxidation of methane. The experimental variables were reaction temperature, $O_2/CH_4$ mole ratio, $CH_4$ feed rate, and $N_2$ sweep gas flow rate. The methane conversions increased with the reaction temperatures in the range of 350 to $730^{\circ}C$. The highest methane conversion and CO selectivity were obtained at the condition of $O_2/CH_4$ mole ratio of 0.5 and $730^{\circ}C$ using commercially available nickel/alumina catalyst. The Pd-Ag membrane reactor showed higher methane conversions, 10~40% higher, compared to those in a traditional reactor.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Journal of the Korean Applied Science and Technology
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• v.35 no.4
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• pp.1338-1347
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• 2018

In this study, Ti-mesh based electrodes were fabricated for the application of anode to the electrolysis process for wastewater treatment using Pd electroless plating method. The removal performance of the prepared Pd / Ti-mesh electrode was evaluated as representative dye RO16, and the durability and performance were maximized by varying the electrode manufacturing conditions. As a result, it was confirmed that the coating condition had no significant effect on the performance, and that the heat treatment process greatly affected the performance and the durability was improved. In addition, we tried to maximize performance and durability by complexing Ir, Ru, and Ta. However, as the thickness of the layer increased due to the limitation of the coating method, the resistance increased and the performance decreased accordingly.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.181-182
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• 2015

본 실험에서는 PET 위 무전해 도금을 위한 대안 공정 개발을 목적으로 은(Ag)와 과망간산염($MnO_4{^-}$)를 사용하여 기존에 일반적으로 사용된 Sn/Pd의 Sensitization과 Activation process를 대체하는 기술을 연구했다. Palladium(Pd)의 경우 공정비용에서 높은 부분을 차지하기 때문에 이를 대신하여 Ag를 사용했으며, PET 표면의 전처리를 위해 Ultra Violet과 과망간 산염을 이용하여 표면의 친수성을 높였다. 과망간산염을 사용하여 표면을 전처리하는 과정에서 이산화망간($MnO_2$)과 알코올 작용기가 생성되는데 Ag activation 단계에서 촉매 생성에 중간 매개체 역할을 하는 것으로 사료된다. 이와 같은 결론을 도출 하기 위해서 표면 위 Ag의 화학적 구조 및 상 분석을 위해 XPS와 TEM이 사용되었으며 표면에서 Ag는 Ag-O와 같은 Silver oxide의 형태와 Ag-Mn-O와 같은 Compound로 무전해 도금을 위한 촉매 역할 하는 것으로 판단된다.

• Applied Chemistry for Engineering
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• v.17 no.5
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• pp.458-464
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• 2006

The Pd-Ni-Ag alloy composite membrane using modified porous stainless steel (PSS) as a substrate was prepared by a electroless plating technique. In this work, we have introduced the intermediate layer between Pd-based alloy and a metal substrate. As an intermediate layer, the mixtures of nickel powder and inorganic sol such as $SiO_{2}$ sol, $Al_{2}O_{3}$ sol, and $TiO_{2}$ sol were used. The intermediate layers were coated onto a PSS substrate according to various membrane preparation conditions and then $N_{2}$ fluxes through the membranes with different intermediate layers were measured. The surface morphology of the intermediate layer in the mixture of nickel powder and inorganic sol was analyzed using scanning electron microscope (SEM). Finally, the Pd-Ni-Ag alloy composite membrane using the support coated with the mixture of nickel powder and silica as an intermediate layer was fabricated and then the gas permeances for $H_{2}$ and $N_{2}$ through the Pd-based membrane were investigated. The selectivity of $H_2/N_2$ was infinite and the $H_{2}$ flux was $1.39{\times}10^{-2}mol/m^2{\cdot}s$ at the temperature of $500^{\circ}C$ and trans-membrane pressure difference of 1 bar.

• Resources Recycling
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• v.30 no.3
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• pp.47-54
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• 2021

Palladium present in colloidal-type plated spent catalyst solution that is used in electroless plating process has not been recovered but discharged as wastewater so far. Recyclig of paladium in colloidal-type plated spent catalyst solution is achieved with this study. This study presents the estimation of resource consumption and GHG emissions during the recycling and disposal of palladium in the plated spent catalyst solution using life cycle assessment. The reduction of resources and GHG are also estimated. Based on the palladium amount of 1 kg during disposal, the GHG emission amount was estimated to be 9.67E+03 kgCO₂eq., and the amount of resource consumption was 3.94E+01 kgSb-eq. However, GHG emission was 1.96E+03 kgCO₂eq., and the amount of resource consumption was 1.54E+01 kgSb-eq. during recycling. Considering the major substances affecting GHG emissions and amount of resource consumption, CO₂ was found to significantly affect GHG emissions, accounting for 91.42% in disposal and 98.37% in recycling. The major substance affecting the amount of resource consumption was hard coal, which accounted for 40.63% in disposal and 60.73% in recycling. Upon recycling 1 kg palladium, 8,967.17 kgCO₂eq. of greenhouse gas emission was reduced, while the resource consumption was reduced to 10.10 kg Sb-eq. In addition, the direct palladium resource reduction rate due to palladium recycling was 50%.