Electroless Nickel Plating on Porous Carbon Substrate |
Chun, So-Young
(Dept. of Materials Science and Engineering, Hongik University)
Rhyim, Young-Mok (Dept. of Materials Test and Characterization Group, Korea Institute of Materials Science) Kim, Doo-Hyun (Dept. of Materials Test and Characterization Group, Korea Institute of Materials Science) Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University) |
1 | F. Wang, S. Arai, M. Endo, "The Preparation of Multi-walled Carbon Nanotubes with a Ni-P Coating by an Electroless Deposition Process", Carbon, 43, 1716 (2005). DOI ScienceOn |
2 | J.I. Park, J.W. Kim, J.S. Lee, "Improvement of Platinum Particle Dispersion on Porous Electrode for Phosphoric Acid Fuel Cell", J. Korean Ind. & Eng. Chem., 1(2), 224 (1990). |
3 | K.R. Kull, M.L.Steen, E.R.Fisher, "Surface Modification with Nitrogen-Containing Plasmas to Produce Hydrophilic, Lowfouling Membranes", J. Membrane Sci., 246, 203 (2005). DOI ScienceOn |
4 | N.I. Kim, S.S. Jang, Electroless plating, pp. 3-20 DongHwa Technology publishing Co., (1996). |
5 | J.S. Kim, E.K. Hur, "Thermal and Adhesive Properties of Cu Interconnect Deposited by Electroless Plating", J. Microelectron. Packag. Soc., 8(2), 100 (2001). |
6 | K. K. Kar, D. Sathiyamoorthy, "Influence of Process Parameters for Coating of Nickel-Phosphorous on Carbon Fibers", J. of Materials Processing Technology, 209, 3022 (2009). DOI ScienceOn |
7 | X.C. Wang, W.B. Cai, W.J. Wang, H.T. Liu, Z.Z. Yu, "Effects of Ligands on Electroless Ni-P Alloy Plating from Alkaline Citrate-Ammonia Solution", Surface and Coatings Technology, 168, 300 (2003). DOI |
8 | K.S. Lee, H.H Cho, "Numerical Analysis of Molten Carbonate Fuel Cell Stack Using Computational Fluid Dynamics", J. of the Kor. Electrochem. Soc., 8(4), 155 (2005). 과학기술학회마을 DOI |
9 | J. Larminie, A. Dicks, "Fuel Cell Systems Explained", 2nd ed., pp. 187-201, Willey (2003). |
10 | J.H. Lee, I.G. Lee, T. Kang, N.S. Kim, S.Y. Oh, "Electrochemical Study of UBM Ni prepared by Electroless Plating", J. Microelectron. Packag. Soc., 10(2), 118 (2003). |
11 | I.H. Jee, "Studies on Characteristics of Electroless Copper Plating for ULSI Conducting Layer Application", p.40, Hongik University, Seoul (2000). |