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Electroless Nickel Plating on Porous Carbon Substrate  

Chun, So-Young (Dept. of Materials Science and Engineering, Hongik University)
Rhyim, Young-Mok (Dept. of Materials Test and Characterization Group, Korea Institute of Materials Science)
Kim, Doo-Hyun (Dept. of Materials Test and Characterization Group, Korea Institute of Materials Science)
Lee, Jae-Ho (Dept. of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 75-80 More about this Journal
Abstract
Electroless nickel plating on porous carbon substrate was investigated. The pore sizes of carbon substrates were 16-20 ${\mu}m$ and over 20 ${\mu}m$. The carbon surface was changed from hydrophobic to hydrophilic after immersing the substrate in an ammonia solution for 40 min at $60^{\circ}C$. The contact angle of water was decreased from $85^{\circ}$ to less than $20^{\circ}$ after ammonia pretreatment. The content of phosphorous in nickel deposit was decreased with increasing pH and then deposits became crystallized. The thickness of nickel deposit was increased with increasing pH. The minimum concentration of $PdCl_2$ for the electroless nickel plating was 5 ppm and the thickness of nickel was not significantly affected by the concentration of $PdCl_2$.
Keywords
electroless nickel plating; porous carbon; MCFC; palladium chloride;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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