1 |
Y. L. Huang and K. L. Lin, J. Mater. Res. 23, 1057 (2008).
DOI
ScienceOn
|
2 |
Y. Liu, C. Chuang, and K. Lin, J. Mater. Res. 19, 2471 (2004).
DOI
ScienceOn
|
3 |
JESD22-B117A, JEDEC Solid State Tech. Association (2006).
|
4 |
C. J. Zhan, C. C. Chuang, T. C. Chang, and L. C. Shen, Int'l. Microsystems, Packaging, Assembly and Circuits Tech., IMPACT 2007, 66 (2007).
|
5 |
C. Yeh and Y. Lai, Microelectron. and Reliabil. 46, 885 (2006).
DOI
ScienceOn
|
6 |
J. Y. H. Chia, B. Cotterell, and T. C. Chai, Mater. Sci. Eng. A 417, 259 (2006).
|
7 |
F. Song, S. W. R. Lee, K. Newman, B. Sykes, and S. Clark, Proc. 57th Compon. and Tech. Conf., p. 364, IEEE, Reno, USA (2007).
|
8 |
F. Song, S. W. R. Lee, K. Newman, B. Sykes, and S. Clark, Proc. 57th Compon. and Tech. Conf., p. 1504, IEEE, Reno, USA (2007).
|
9 |
Y.G. Lee, H.Y. Lee, J.T. Moon, J.H. Park, S.S.Han, and J.P. Jung, J. Kor. Inst. Mat. & Mater. 47, 580, (2009).
|
10 |
D. Suh, D. Kim, P. Liu, H. Kim, J. Weninger , C. Kumara, A. Prasad, B. Grimsley, and H. Tejada, Mater. Sci. Eng. A 460, 595 (2007).
|
11 |
T. C. Chai, D. Q Yu, J. Lau, W. H. Zhu, and X. R . Zhang, Proc. 58th Electron. Compon. and Tech. Conf., p. 623, IEEE, Florida, USA (2008).
|
12 |
C.R. Siviour, D.M. Williamson, S.J.P. Palmer, S.M. Walley, W.G. Proud, and J.E. Field, Journal de Physique IV. 110, 477 (2003).
DOI
|