• 한국재료학회지
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• 제28권10호
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• pp.601-609
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• 2018

To study the effects of graphite shape and the composite fabricating method on the mechanical properties of graphite/copper (Gr/Cu) composites, a copper composite using graphite flakes or graphite granules as reinforcing phases is fabricated using mechanical mixing or electroless plating method. The mechanical properties of the Gr/Cu composites are evaluated by compression tests, and the compressive strength and elongation of the Gr/Cu composites using graphite granules as a reinforcing phase are compared with those of Cu composites with graphite flakes as a reinforcing phase. The compressive yield strength or maximum strength of the Gr/Cu composites with graphite granules as a reinforcing phase is higher than that of the composites using graphite flakes as a reinforcing phase regardless of the alignment of graphite. The strength of the composite produced by the electroless plating method is higher than that of the composite material produced by the conventional mechanical mixing method regardless of the shape of the graphite. Using graphite granules as a reinforcing phase instead of graphite flakes improves the strength and elongation of the Gr/Cu composites in all directions, and reduces the difference in strength or elongation according to the direction.

• 한국표면공학회지
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• 제42권1호
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• Korean Chemical Engineering Research
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• 제46권5호
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• pp.863-867
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• 2008

피치계 활성탄소섬유가 납사분해 잔사유를 개질하여 용융 방사하고, 산화, 탄화 및 스팀으로 활성화하여 제조되었다. 활성탄소섬유의 표면은 주석-팔라듐을 사용하여 단일 스텝에 의해 예민화 과정을 거쳤다. 예민화된 활성탄소섬유 표면에 무전해도금법을 사용하여 구리를 골고루 담지하였다. 도금시간을 증가시켜서 구리의 담지량을 변화시키고, BET, SEM, XRD 및 ICP를 이용하여 촉매 특성 변화에 미치는 영향을 관찰하였다. 도금시간에 따라 부가된 구리의 양은 증가하나, 기공부피와 비표면적은 감소하였다. 또한 반응 온도가 증가함에 따라 NO 제거 성능이 증가하였다. $300^{\circ}C$ 이상의 반응 온도에서 부가된 구리의 양이 증가하면 표면적의 감소와 구리 분산도의 감소 때문에 NO 제거 성능은 감소하는 결과를 얻었다.

• 한국재료학회지
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• 제23권11호
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.39-42
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• 2004

Carbon nanofiber/Cu composite powder has been fabricated by electroless plating process. Microstructural evolution of the composite powder after heat treatment under vacuum, hydrogen and air environment was investigated. A dispersed carbon nanofiber coated by copper was produced at the as-plated condition. Carbon nanofiber is coated uniformly and densely with the plate shaped copper particles. The copper plates on the carbon nanofiber aggregate during the thermal exposure at elevated temperature in vacuum and hydrogen in order to reduce surface energy. The thermal exposure of the composite powder in air at $400^{\circ}C$ for 3 hours leads to the spherodization of the composite powder owing to oxidation of copper.

• 한국표면공학회지
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• 제25권4호
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• pp.173-180
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• 1992

The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-stabilized baths. The sta-bilizing effects may be attributed to the stability of Cu(II) -complexes. The plating rate is the re-verse order of the bath stability. Accelerative effect of 2-MBT in proper quantity(0.3mg/$\ell$) may be explained by visualizing it absorbed through benzene ring or sulfur atom on portions of the sub-strates. The strong bond of the complexing part of the molecule to nearby chelated copper ions would tend to accelerate plating by making it easier for the Cu2+ -ligand bond to be broken. Sur-face morphologies of copper deposits depend on the bath additives. Electroless copper deposits from the 2-MBT stabilized baths are finer than the deposits from the NaCN- and Thiourea- stabi-lized baths due to the strong adsorption on the substrates.

• 폴리머
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• 제25권2호
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• pp.302-310
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• 2001

무전해도금법을 이용하여 구리/PET 필름 복합재료를 제조하였으며 에칭방법과 촉매액의 조성 및 acceleration 방법을 달리하여 PET 필름과 무전해도금된 구리 피막간의 접착력을 향상시키고자 하였다. HCl 용액으로 에칭된 PET 필름은 NaOH에 의한 것보다 더욱 세밀하게 에칭되어져 구리와 PET 필름간의 접착력은 향상되었으나 전자파 차폐효과는 유사한 경향을 보였다. 촉매액의 조성변화에 따른 영향을 살펴본 결과 PdCl$_2$:SnCl$_2$의 몰비가 1:4에서 1:16으로 증가할수록 PET 필름 위에 적층된 Pd/Sn 콜로이드 입자들의 크기가 감소하며 고르게 분포되는 경향을 보였다. 따라서 이들의 몰비가 증가할수록 구리도금이 균일하고 조밀하게 이루어져 접착력 및 차폐효과가 증가하였다. 또한 NaOH보다 HCl로 acceleration한 경우 촉매 입자의 크기가 작고 더 균일하게 분포되어 우수한 접착력과 도금물성을 나타내었다.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2000년도 추계총회 및 학술발표회
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• pp.20-20
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• 2000

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.54-55
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• 2000

• Korean Chemical Engineering Research
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• 제43권4호
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• pp.495-502
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• 2005

무전해 도금 용액을 이용하여 구리를 직접 텅스텐(Tungsten, W) 기판 위에 도금하였다. 도금 용액의 농도는 각각 $CuSO_4$ 7.615 g/L, EDTA 10.258 g/L, glyoxylic acid 7 g/L로 하였다. 도금 용액의 pH는 11.0에서 12.8까지 변화시켰으며, 용액의 온도는 $60^{\circ}C$로 유지하였다. 도금된 필름의 특성을 조사하기 위하여 X선 회절분석기, 전계 방출 주사 전자 현미경, 주사형 원자력 현미경, X선 광전자 분석기 및 Rutherford backscattering spectroscope(RBS)를 사용하였다. 구리 도금을 위한 가장 좋은 pH 조건은 11.8이였다. 이 용액에서 10분 동안 도금한 경우 둥근 모양의 구리 입자가 균일하게 도금되었으며, 불순물 peak이 없는 순수 구리 peak이였고, 근평균 제곱 표면 거칠기는 약 11 nm가 되었다. 또한, pH 11.8에서 12분 동안 도금한 필름의 두께는 140 nm이었고 도금속도는 약 12 nm/min였다. 무전해 도금 용액의 pH를 12.8로 증가시키면 도금된 구리 필름은 Cu peak 이외에 불순물 peak인 $Cu_2O$가 나타나고 구리 입자 모양도 기다란 직사각형 모양으로 변하였다. 순수 구리의 도금을 위해서는 도금 용액에서 적당한 pH를 유지하여야 한다. 도금된 구리의 농도는 RBS로 측정한 결과 99 atom％였다. 또한, Cu/W 필름은 전기 도금하는 동안 합금 형태를 이루기 때문에 접착성도 좋았다.