Preparation of Electroless Copper Plated Activated Carbon Fiber Catalyst and Reactive Evaluation of NO Removal
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Yoon, Hee-Seung
(Department of Chemical Engineering, Chungnam National University)
Oh, Jong Hyun (Department of Chemical Engineering, Chungnam National University) Lee, Hyung Keun (Research Center of greenhouse gas, Korea Institute of Energy Research(KIER)) Jeon, Jong-Ki (Department of Chemical Engineering, Kongju National University) Ryu, Seung Kon (Department of Chemical Engineering, Chungnam National University) |
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4 | Park, S. J. and Shin, J. S., "Influence of Copper Content on NO Removal of the Activated Carbon Fibers Produced by Electroplating," Journal of Colloid and Interface Science, 264, 39-42(2003) DOI ScienceOn |
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10 | Lee, H. K., Shin, M. J., Kim, S. W. and Yeo, W. K., "Effects of Surfactants on Electroless Copper Plating Bath for PCB," J. Korean Institute of Surface Engineering, 26(5), 263-270(1993) 과학기술학회마을 |
11 | Choi, S. D. and Park, B. D., "Effects of Stabilizing Additives on Electroless Copper Deposition," J. Korean Institute of Surface engineering, 25(4), 173-180(1992) 과학기술학회마을 |
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Gregorio, M., Raquel, A. and Antonio, B. F., "Low Temperature SCR of NOx with |
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