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http://dx.doi.org/10.5695/JKISE.2009.42.1.047

Preparation of Cu-Ag Powder having Core-Shell Structure by Electroless Plating Method  

Kim, Jong-Wan (Engineering Research Center for Rapidly Solidified Materials, Chungnam National University)
Lee, Huk-Hee (Korea Research Institute of Chemical Technology)
Won, Chang-Whan (Engineering Research Center for Rapidly Solidified Materials, Chungnam National University)
Publication Information
Journal of the Korean institute of surface engineering / v.42, no.1, 2009 , pp. 47-52 More about this Journal
Abstract
Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.
Keywords
Silver; Copper; Electroless plating; Reduction; Core-shell;
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