Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지
DOI QR코드

DOI QR Code

Preparation of Cu-Ag Powder having Core-Shell Structure by Electroless Plating Method

무전해 도금법을 이용한 코어 셸 구조의 Cu-Ag분말 제조

  • Kim, Jong-Wan (Engineering Research Center for Rapidly Solidified Materials, Chungnam National University) ;
  • Lee, Huk-Hee (Korea Research Institute of Chemical Technology) ;
  • Won, Chang-Whan (Engineering Research Center for Rapidly Solidified Materials, Chungnam National University)
  • 김종완 (충남대학교 급속응고신소재연구소) ;
  • 이혁희 (한국화학연구원) ;
  • 원창환 (충남대학교 급속응고신소재연구소)
  • Published : 2009.02.28
Download PDF
⟨ Previous Next ⟩

Abstract

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

Keywords

References

  1. Shaochun Tang, Yuefeng Tang, Shaopeng Zhu, Haiming Lu, and Xiangkang Meng, Journal of Solid State Chemistry 180 (2007) 2871 https://doi.org/10.1016/j.jssc.2007.08.022
  2. S. Prathap Chandran, J. Ghatak, and P. V. Satyam, Murali Sastry, Journal of Colloid and Interface Science, 312 (2007) 498
  3. D. H. Chen and S. R. Wang, Materials Chemistry and Physics, 100 (2006) 468 https://doi.org/10.1016/j.matchemphys.2006.01.027
  4. D. Russev, D. Raclev, and S. Kava, J. Met. Finish, 81, (1983) 27
  5. X. R. Xu, X. J. Luo, H. R. Zhuang, W. L. Li, and B. L. Zhang, Materials Letters, 57 (2003) 3987 https://doi.org/10.1016/S0167-577X(03)00252-0
  6. H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, and C. O. Kim, Surface & Coatings Technology, 201 (2006) 3788 https://doi.org/10.1016/j.surfcoat.2006.03.025
  7. E. Takeshima, K. Takatsu, Y. Kojima, and T. Fujji, US Patent No. 4, 954 (1990) 235
  8. S. Tojan Djokic, M. Dubois, and R. H. Lepard, US Patent No. 5, 945 (1999) 158
  9. T. Hayashi, Shimonoseki, US Patent No. 5, 178 (1993) 909
  10. D. M. Makowiecki, J. A. Kerns, C. S. Alford, and M. A. Mckernan, US Patent No: 6, 355 (2002) 146 B1
  11. Z. Xu, X. Z. Yu, and Z. G. Shen, China Particuology, 5 (2007) 345 https://doi.org/10.1016/j.cpart.2007.06.004