• 전기학회논문지P
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• 제58권3호
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• pp.310-315
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• 2009

This investigation was performed to study the characteristics of electricity and heat transfer that occur in the cylinder of electrode type humidifier during the process of water evaporation. Measurements were made to obtain the amount of water evaporation, the consumption of electric power, electrical conductivity, etc according to the materials and shapes of electrode. When the humidifier was in non-drain controlled mode, the number and amplitude of current cycle per minute increased gradually with the lapse of time, whereas for drain controlled mode, it decreased about 40[%] after draining water. It was found that for non-drain controlled mode, the thermal efficiency of humidifier which used SS400, STS316 and wire net electrode type was about 95~96[%] and it was 2~4[%] higher than that of drain controlled mode. Also, it was shown that the thermal efficiency of humidifier which used neighboring six-phase electrode balanced electrically was 4[%] higher than that of existing six-phase type.

• 대한전자공학회논문지SD
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• 제44권11호
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• pp.43-50
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• 2007

ITO(Indium Tin Oxide) 전극 형성방법은 ITO 박막 자체의 전기 광학적 특성 뿐 아니라 ITO를 전극으로 하는 청색 발광 다이오드(파장 469nm)의 전기 광학적 특성 및 신뢰성에도 큰 영향을 미침을 확인하였다. 세 가지 ITO 전극 형성 방법 즉 electron beam evaporation법과 sputtering법, 그리고 electron beam evaporation법으로 먼저 증착한 뒤에 sputtering법으로 증착한 hybrid법 등을 사용하여 청색 발광 다이오드를 제작한 다음에 ITO 박막의 특성과 aging에 따른 발광 다이오드의 전기 광학적 특성 변화를 고찰하였다. 그 결과, ITO 전극을 sputtering 또는 electron beam evaporation 방법으로 형성한 발광 다이오드는 각각 sputtering damage의 문제와 전기저항이 증가하는 문제점을 안고 있음을 발견하였다. 그리고 이 문제점들을 hybrid 방법으로 해결하였다.

• Current Photovoltaic Research
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• 제7권1호
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• pp.15-20
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• 2019

Most high-efficiency n-type silicon solar cells are based on the high quality surface passivation and ohmic contact between the emitter and the metal. Currently, various metalization methods such as screen printing using metal paste and physical vapor deposition are being used in forming electrodes of n-type silicon solar cell. In this paper, we analyzed the degradation factors induced by the front electrode formation process using e-beam evaporation of double passivation structure of p-type emitter and $Al_2O_3/SiN_x$ for high efficiency solar cell using n-type bulk silicon. In order to confirm the cause of the degradation, the passivation characteristics of each electrode region were determined through a quasi-steady-state photo-conductance (QSSPC).

• Journal of the Korean Physical Society
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• 제73권9호
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• pp.1346-1350
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• 2018

An electrode-evaporation technology on both the top and bottom sides of the bare vertical-type single chip separated from the traditional substrate by cooling, was developed for III-nitride vertical-type single chip LEDs with thick GaN epilayer. The post-process of the cooling step was followed by sorting the bare vertical-type single chip LEDs into the holes in a pocket-type shadow mask for deposition of the electrodes at the top and bottom sides of bare vertical-type single chip LEDs without the traditional substrate for electrode evaporation technology for vertical-type single chip LEDs. The variation in size of the hole between the designed shadow mask and the deposited electrodes owing to the use of the designed pocket-type shadow mask is investigated. Furthermore, the electrical and the optical properties of bare vertical-type single chip LEDs deposited with two different shapes of n-type electrodes using the pocket-type shadow mask are investigated to explore the possibility of the e-beam evaporation method.

• 방사선산업학회지
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• 제5권1호
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• pp.95-99
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• 2011

The electrical and mechanical properties of electrode for radiation detection are very important. In general, Au electrode and CZT crystal are combined to form ohmic contacts, and the best energy resolution is shown at the Au electrode. The metal contacts are fabricated by electroless deposition method, sputtering deposition method and thermal evaporation method. The electrode fabrication is easy with use of the thermal evaporation method, while an adhesive strength is weak. Thus interface materials such as Ag, Al and Ni were investigated to overcome defects generated by the this method. The thickness of the interface material between the Au electrode and the CZT crystal was 100 Angstroms, the Au electrode with thickness of 400 Angstroms was deposited. The Al+Au electrode is shown that the results of current-voltage and radiation response are similar to results of Au electrode.

• 전기학회논문지
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• 제59권4호
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• pp.754-758
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• 2010

In general, Dye-sensitized Solar Cells(DSCs) consist of the nanocrystalline titanium dioxide($TiO_2$) layer which is fabricated on a transparent conductive oxide(TCO) layer such as $F/SnO_2$ glass, a dye adhered to the $TiO_2$, an electrolyte solution and platinum-coated TCO. Among these components, two TCO substrates are estimated to be about 60% of the total cost of the DSCs. Currently novel TCO-less structures have been investigated in order to reduce the cost. In this study, TCO-less DSCs consisting of titanium electrodes were investigated. The titanium electrode is deposited on top of the porous $TiO_2$ layer using electron-beam evaporation process. The porosity of the titanium electrode was found out by the SEM analysis and dye adhesion. As a result, when the thickness of the titanium electrode increased, the surface resistance decreased and the conversion efficiency increased relatively.

• 한국재료학회지
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• 제28권4호
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• pp.235-240
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• 2018

We propose a speedy two-step deposit process to form an Au electrode on hole transport layer(HTL) without any damage using a general thermal evaporator in a perovskite solar cell(PSC). An Au electrode with a thickness of 70 nm was prepared with one-step and two-step processes using a general thermal evaporator with a 30 cm source-substrate distance and $6.0{\times}10^{-6}$ torr vacuum. The one-step process deposits the Au film with the desirable thickness through a source power of 60 and 100 W at a time. The two-step process deposits a 7 nm-thick buffer layer with source power of 60, 70, and 80 W, and then deposits the remaining film thickness at higher source power of 80, 90, and 100 W. The photovoltaic properties and microstructure of these PSC devices with a glass/FTO/$TiO_2$/perovskite/HTL/Au electrode were measured by a solar simulator and field emission scanning electron microscope. The one-step process showed a low depo-temperature of $88.5^{\circ}C$ with a long deposition time of 90 minutes at 60 W. It showed a high depo-temperature of $135.4^{\circ}C$ with a short deposition time of 8 minutes at 100 W. All the samples showed an ECE lower than 2.8 % due to damage on the HTL. The two-step process offered an ECE higher than 6.25 % without HTL damage through a deposition temperature lower than $88^{\circ}C$ and a short deposition time within 20 minutes in general. Therefore, the proposed two-step process is favorable to produce an Au electrode layer for the PSC device with a general thermal evaporator.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.312-312
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• 2013

GaN based light emitting diodes (LEDs) are important devices that are being used extensively in our daily life. For example, these devices are used in traffic light lamps, outdoor full-color displays and backlight of liquid crystal display panels. To realize high-brightness GaN based LEDs for solid-state lighting applications, the development of p-type ohmic electrodes that have low contact resistivity, high optical transmittance and high refractive index is essential. To this effect, indiumtin oxide (ITO) have been investigated for LEDs. Among the transparent electrodes for LEDs, ITO has been one of the promising electrodes on p-GaN layers owing to its excellent properties in optical, electrical conductivity, substrate adhesion, hardness, and chemical inertness. Sputtering and e-beam evaporation techniques are the most commonly used deposition methods. Commonly, ITO films on p-GaN by sputtering have better transmittance and resistivity than ITO films on p-GaN by e-bam evaporation. However, ITO films on p-GaN by sputtering have higher specific contact resistance, it has been demonstrated that this is due to possible plasma damage on the p-GaN in the sputtering process. In this paper, we have investigated the advanced sputtering using plasma damage-free p-electrode. Prepared the ITO films on the GaN based LEDs by e-beam evaporation, normal sputtering and advanced sputtering. The ITO films on GaN based LEDs by sputtering showed better transmittance and sheets resistance than ITO films on the GaN based LEDs by e-beam evaporation. Finally, fabricated of GaN based LEDs by using advanced sputtering. And compared the electrical properties (measurement by using C-TLM) and structural properties (HR-TEM and FE-SEM) of ITO films on GaN based LEDs produced by e-beam evaporation, normal sputtering and advanced sputtering. As a result, It is expected to form plasma damage free-electrode, and better light output power and break down voltage than LEDs by e-beam evaporation and normal sputter.

• 한국유체기계학회 논문집
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• 제11권4호
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• pp.7-13
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• 2008

The computational investigation is performed to find out the interaction of arc plasmas with surrounding materials and the thermal flow characteristics in a PASB (Puffer-Assisted Self-Blast) chamber, which is one of new breaking concepts in $SF_6$ switchgears. It is very important to define the flow and mass transfer happened during the full arcing history for further understanding complex physics inside the chamber. In this study, we have considered two diffusion processes by the hot arc plasma, one is PTFE nozzle ablation and the other is Cu electrode evaporation, simultaneously. It was found that the principle of the pressure-rise inside the chamber is confirmed by the computational results and the increase of the electrical conductivity of the residual gas near current zero is critical to the chamber design.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1462-1465
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• 2004

A new method to fabricate metal electrodes on side wall of the microchannel is presented. Coulter counter allows to count the number of cell passing through the microchannel by detecting impedance variation between two electrodes. The relative position of two electrodes is important for sensitivity of impedance measurement. 100nm thick Al electrodes are deposited on the channel side wall by means of shadow evaporation.