• Proceedings of the Korean Environmental Sciences Society Conference
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• 2008.11a
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• pp.510-514
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• 2008

본 연구에서는 전극의 특성에 따른 돈사유래 축산폐수의 ECO 공법에 의한 처리특성을 평가하기 위해 ECO 시스템 모듈내 Fe-Fe 및 Al-Al 계열의 용해성 전극과 Al-SUS, Ir-SUS 등 불용성 전극을 대상으로 5$\sim$20mA/cm$^2$의 전류밀도하에서 축산폐수내 유기물 및 영양염류의 제거특성을 평가하여 다음과 같은 결론을 얻을 수 있었다. 1. 전기응집산화에 의한 축산폐수의 처리시 수중 유기물질 및 영양염류의 제거효율은 전류밀도의 증가에 비례하여 증가한다. 2. 불용성 전극조합 및 불용성-용해성 전극조합은 전류밀도가 높을수록 수중 유기물 및 오염물질 제거효율이 안정되고, 용해성 전극은 15mA/cm$^2$ 이하의 저 전류밀도의 조건하에서 전류밀도의 증가에 따라 안정된 제거효율 향상을 기대할 수 있다. 3. 불용성전극 조합인 Ir-SUS 전극조합을 사용하여 축산폐수를 처리할 경우 COD$_{Mn}$ 제거효율을 약 10% 향상시킬 수 있으며, TN 20mA/cm$^2$에서 Al-Al 전극조합과 TP 15mA/cm$^2$ 이하에서 Fe-Fe 전극조합은 제거효율이 저하되는 경향이 나타난다.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.2
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• pp.24-33
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• 2015

This study aims to suggest wastewater treatment options for diaper recycling by identifying characteristic analysis of wastewater from diaper recycling process and efficiency evaluation of wastewater treatment units. The wastewater characteristic analysis showed that the concentration of organic pollutants and ionic materials were very high comparing to seawater. Through the investigation of similar wastewater treatment, six treatment units were identified to reduce pollutants. It is found UF(ultra-filtration), DAF(dissolved air flotation), fenton oxidation, electro-coagulation and chemical-coagulation are effective in reducing organic pollutants while membrane system and ion exchanger are effective in reducing ionic materials. Even though the target of water quality should be secured in terms of managing organic pollutants level, the application of treatment unit for reducing ionic material needs lots of considerations. This result suggests that reuse of pulping wastewater after controlling organic pollutants is better than direct discharge of pulping wastewater. To select the appropriate wastewater treatment unit, an economic analysis about operation condition, wastewater flow, cost, efficiency should be considered.

• Journal of the Korean Electrochemical Society
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• v.10 no.4
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• pp.235-238
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• 2007

There is great interest in the applicability of generated hydrogen peroxide to a variety of industrial processes, usually involving oxidation of organics. Hydrogen peroxide is now employed for the bleaching as well as mechanical and chemical treatment in the pulp and paper industries. It addition, it is considered as an agent to displace the traditional alkaline treatments with chlorine-based chemicals. This paper reports a comparative study of $H_2O_2$ electogeneration on gas-diffusion electrode in divided cell with several $Nafion^{(R)}$ proton-exchange membranes, Russian cation-exchange membrane MK-40 and SPEEK membrane. The influence of different PEMs on electro-chemical cell voltage, current efficiency and energy consumption of hydrogen peroxide generation has been studied.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.577-584
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• 2005

Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.47-54
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• 2021

For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.12
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• pp.105-112
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• 2009

In this paper, we investigated abnormal ESD failure on guard-rings in the smart power IC fabricated with $0.35{\mu}m$ Bipolar-CMOS-DMOS (BCD) technology. Initially, ESD failure occurred below 200 V in the Machine Model (MM) test due to current crowding in the parasitic diode associated with the guard-rings which are generally adopted to prevent latch-up in high voltage devices. Optical Beam Induced Resistance Charge (OBIRCH) and Scanning Electronic Microscope (SEM) were used to find the failure spot and 3-D TCAD was used to verify cause of failure. According to the simulation results, excessive current flows at the comer of the guard-ring isolated by Local Oxidation of Silicon (LOCOS) in the ESD event. Eventually, the ESD failure occurs at that comer of the guard-ring. The modified comer design of the guard-ring is proposed to resolve such ESD failure. The test chips designed by the proposed modification passed MM test over 200 V. Analyzing the test chips statistically, ESD immunity was increased over 20 % in MM mode test. In order to avoid such ESD failure, the automatic method to check the weak point in the guard-ring is also proposed by modifying the Design Rule Check (DRC) used in BCD technology. This DRC was used to check other similar products and 24 errors were found. After correcting the errors, the measured ESD level fulfilled the general industry specification such as HBM 2000 V and MM 200V.

• Applied Chemistry for Engineering
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• v.35 no.4
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• pp.296-302
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• 2024

An ionic conjugated polymer-iron (III) chloride composite was prepared via in-situ quaternization polymerization of 2-ethynylpyridine (2EP) using iron (III) chloride. Various instrumental methods revealed that the chemical structure of the resulting conjugated polymer (P2EP)-iron (III) chloride composite has the conjugated backbone system having the designed pyridinium ferric chloride complexes. The polymerization mechanism was assumed to be that the activated triple bond of 2-ethynylpyridinium salt, formed at the first reaction step, is easily susceptible to the step-wise polymerization, followed by the same propagation step that contains the propagating macroanion and monomeric 2-ethynylpyridinium salts. The electro-optical and electrochemical properties of the P2EP-FeCl₃ composite were studied. In the UV-visible spectra of P2EP-FeCl₃ composite, the absorption maximum values were 480 nm and 533 nm, and the PL maximum value was 598 nm. The cyclic voltammograms of the P2EP-FeCl₃ composite exhibited irreversible electrochemical behavior between the oxidation and reduction peaks. The kinetics of the redox process of composites were found to be very close to a diffusion-controlled process from the plot of the oxidation current density versus the scan rate.

• Journal of Welding and Joining
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• v.32 no.6
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• pp.75-81
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• 2014

Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.

• Journal of Electrochemical Science and Technology
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• v.10 no.4
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• pp.416-423
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• 2019

A novel non-enzymatic oxalic acid (OA) sensor based on the platinum/carbon black-nickel-reduced graphene oxide (Pt/CBNi-rGO) nanocomposite is reported. The nanocomposites were prepared by the ethylene glycol reduction method. Their morphology and chemical composition were characterized by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and transmission electron microscopy (TEM). The results clearly demonstrated the formation of the Pt/CB-Ni-rGO nanocomposite. The electrocatalytic activity of the Pt/CB-Ni-rGO electrode was investigated by cyclic voltammetry. It was determined that the appropriate amount of Pt enhanced the catalytic activity of Pt for oxalic acid electro-oxidation. Moreover, the modified electrode was determined to be highly selective for oxalic acid without interference from compounds commonly found in urine including uric acid and ascorbic acid. The chronoamperometric signal gave a wide linearity range of 20 μM-60 mM and the detection limit (3σ) was found to be 2.35 μM. The proposed method showed high selectivity, stability, and good reproducibility and could be used with micro-volumes of sample for the detection of oxalic acid. Finally, the oxalic acid content in artificial and control urine samples were successfully determined by our proposed electrode.