• Title/Summary/Keyword: Electro-Oxidation

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Wastewater Treatment Process Study for Used Diaper Recycling (사용 후 기저귀 재활용을 위한 폐수처리방안 연구)

  • Kim, Kyung Shin;Lee, Ho Sun
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.47 no.2
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    • pp.24-33
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    • 2015
  • This study aims to suggest wastewater treatment options for diaper recycling by identifying characteristic analysis of wastewater from diaper recycling process and efficiency evaluation of wastewater treatment units. The wastewater characteristic analysis showed that the concentration of organic pollutants and ionic materials were very high comparing to seawater. Through the investigation of similar wastewater treatment, six treatment units were identified to reduce pollutants. It is found UF(ultra-filtration), DAF(dissolved air flotation), fenton oxidation, electro-coagulation and chemical-coagulation are effective in reducing organic pollutants while membrane system and ion exchanger are effective in reducing ionic materials. Even though the target of water quality should be secured in terms of managing organic pollutants level, the application of treatment unit for reducing ionic material needs lots of considerations. This result suggests that reuse of pulping wastewater after controlling organic pollutants is better than direct discharge of pulping wastewater. To select the appropriate wastewater treatment unit, an economic analysis about operation condition, wastewater flow, cost, efficiency should be considered.

The Comparative Study of Different Membranes for Electrolytic Cell for the Hydrogen Peroxide Generation (과산화수소 발생을 위한 전해셀용 양성자 교환 막의 비교)

  • You, Sun-Kyung;Kim, Han-Joo;Kim, Tae-Il;Tsurtsumia, Gigla;Park, Soo-Gil
    • Journal of the Korean Electrochemical Society
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    • v.10 no.4
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    • pp.235-238
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    • 2007
  • There is great interest in the applicability of generated hydrogen peroxide to a variety of industrial processes, usually involving oxidation of organics. Hydrogen peroxide is now employed for the bleaching as well as mechanical and chemical treatment in the pulp and paper industries. It addition, it is considered as an agent to displace the traditional alkaline treatments with chlorine-based chemicals. This paper reports a comparative study of $H_2O_2$ electogeneration on gas-diffusion electrode in divided cell with several $Nafion^{(R)}$ proton-exchange membranes, Russian cation-exchange membrane MK-40 and SPEEK membrane. The influence of different PEMs on electro-chemical cell voltage, current efficiency and energy consumption of hydrogen peroxide generation has been studied.

Direct Bonding Characteristics of 2" 3C-SiC Wafers for Harsh Environment MEMS Applications (극한 환경 MEMS용 2" 3C-SiC기판의 직접접합 특성)

  • 정귀상
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.8
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    • pp.700-704
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    • 2003
  • This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 % and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

Cu Diffusion Behavior of Ni-B Diffusion Barrier Fabricated by Electroless Deposition (무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동)

  • Choi, Jae-Woong;Hwang, Gil-Ho;Han, Won-Kyu;Lee, Wan-Hee;Kang, Sung-Goon
    • Korean Journal of Materials Research
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    • v.15 no.9
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    • pp.577-584
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    • 2005
  • Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

A Study on the Microstructure Formation of Sn Solder Bumps by Organic Additives and Current Density (유기첨가제 및 전류밀도에 의한 Sn 솔더 범프의 미세조직 형성 연구)

  • Kim, Sang-Hyeok;Kim, Seong-Jin;Shin, Han-Kyun;Heo, Cheol-Ho;Moon, Seongjae;Lee, Hyo-Jong
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.1
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    • pp.47-54
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    • 2021
  • For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.

An On-chip ESD Protection Method for Preventing Current Crowding on a Guard-ring Structure (가드링 구조에서 전류 과밀 현상 억제를 위한 온-칩 정전기 보호 방법)

  • Song, Jong-Kyu;Jang, Chang-Soo;Jung, Won-Young;Song, In-Chae;Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.12
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    • pp.105-112
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    • 2009
  • In this paper, we investigated abnormal ESD failure on guard-rings in the smart power IC fabricated with $0.35{\mu}m$ Bipolar-CMOS-DMOS (BCD) technology. Initially, ESD failure occurred below 200 V in the Machine Model (MM) test due to current crowding in the parasitic diode associated with the guard-rings which are generally adopted to prevent latch-up in high voltage devices. Optical Beam Induced Resistance Charge (OBIRCH) and Scanning Electronic Microscope (SEM) were used to find the failure spot and 3-D TCAD was used to verify cause of failure. According to the simulation results, excessive current flows at the comer of the guard-ring isolated by Local Oxidation of Silicon (LOCOS) in the ESD event. Eventually, the ESD failure occurs at that comer of the guard-ring. The modified comer design of the guard-ring is proposed to resolve such ESD failure. The test chips designed by the proposed modification passed MM test over 200 V. Analyzing the test chips statistically, ESD immunity was increased over 20 % in MM mode test. In order to avoid such ESD failure, the automatic method to check the weak point in the guard-ring is also proposed by modifying the Design Rule Check (DRC) used in BCD technology. This DRC was used to check other similar products and 24 errors were found. After correcting the errors, the measured ESD level fulfilled the general industry specification such as HBM 2000 V and MM 200V.

Degradation Behavior of Eutectic and Pb-free Solder Plated Ribbon in Crystalline Silicon Photovoltaic Module (유무연 용융도금 리본에 따른 결정질 실리콘 태양전지 모듈 열화거동)

  • Kim, Ju-Hee;Kim, A Yong;Park, Nochang;Ha, Jeong Won;Lee, Sang Guon;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.32 no.6
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    • pp.75-81
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    • 2014
  • Usage of heavy metal element (Pb, Hg and Cd etc.) in electronic devices have been restricted due to the environmental banning of the European Union, such as WEEE and RoHS. Therefore, it is needed to develop the Pb-free solder plated ribbon in photovoltaic (PV) module. This study described that degradation characteristics of PV module under damp heat (DH, $85^{\circ}C$ and 85% R.H.) condition test for 1,000 h. Solar cell ribbons were utilized to hot dipping plate with Pb-free solder alloys. Two types of Pb-free solder plated ribbons, Sn-3.0Ag-0.5Cu (SAC305) and Sn-48Bi-2Ag, and an electroless Sn-40Pb solder hot dipping plated ribbon as a reference sample were prepared to evaluate degradation characteristics. To detect the degradation of PV module with the eutectic and Pb-free solder plated ribbons, I-V curve, electro-luminescence (EL) and cross-sectional SEM analysis were carried out. DH test results show that the reason of maximum power (Pm) drop was mainly due to the decrease fill factor (FF). It was attributed to the crack or oxidation of interface between the cell and the ribbon. Among PV modules with the eutectic and Pb-free solder plated ribbon, the PV module with SAC305 ribbon relatively showed higher stability after DH test than the case of PV module with Sn-40Pb and Sn-48Bi-2Ag solder plated ribbons.

An Oxalic Acid Sensor Based on Platinum/Carbon Black-Nickel-Reduced Graphene Oxide Nanocomposites Modified Screen-Printed Carbon Electrode

  • Income, Kamolwich;Ratnarathorn, Nalin;Themsirimongkon, Suwaphid;Dungchai, Wijitar
    • Journal of Electrochemical Science and Technology
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    • v.10 no.4
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    • pp.416-423
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    • 2019
  • A novel non-enzymatic oxalic acid (OA) sensor based on the platinum/carbon black-nickel-reduced graphene oxide (Pt/CBNi-rGO) nanocomposite is reported. The nanocomposites were prepared by the ethylene glycol reduction method. Their morphology and chemical composition were characterized by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and transmission electron microscopy (TEM). The results clearly demonstrated the formation of the Pt/CB-Ni-rGO nanocomposite. The electrocatalytic activity of the Pt/CB-Ni-rGO electrode was investigated by cyclic voltammetry. It was determined that the appropriate amount of Pt enhanced the catalytic activity of Pt for oxalic acid electro-oxidation. Moreover, the modified electrode was determined to be highly selective for oxalic acid without interference from compounds commonly found in urine including uric acid and ascorbic acid. The chronoamperometric signal gave a wide linearity range of 20 μM-60 mM and the detection limit (3σ) was found to be 2.35 μM. The proposed method showed high selectivity, stability, and good reproducibility and could be used with micro-volumes of sample for the detection of oxalic acid. Finally, the oxalic acid content in artificial and control urine samples were successfully determined by our proposed electrode.

Characteristic of Oxidants Production and Dye Degradation with Operation Parameters of Electrochemical Process (전기화학적 공정의 운전인자에 따른 산화제 생성과 염료 분해 특성)

  • Kim, Dong-Seog;Park, Young-Seek
    • Journal of Environmental Science International
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    • v.18 no.11
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    • pp.1235-1245
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    • 2009
  • The purpose of this study is to investigate electro-generation of free Cl, $ClO_2$, $H_2O_2$ and $O_3$ and degradation of Rhodamine B in solution using Ru-Sn-Sb electrode. Electrolysis was performed in one-compartment reactor using a dimensionally stable anode(DSA) of Ru-Sn-Sb/Ti as the working electrode. The effect of applied current (0.5-3 A), electrolyte type (NaCl, KCl, HCl, $Na_2SO_4$ and $H_2SO_4$) and concentration (0.5-2.5 g/L), air flow rate (0-3 L/min) and solution pH (3-11) was evaluated. Experimental results showed that concentration of 4 oxidants was increased with increase of applied current, however optimum current for RhB degradation was 2 A. The generated oxidant concentration and RhB degradation of the of Cl type-electrolyte was higher than that of the sulfate type. The oxidant concentration was increased with increase of NaCl concentration and optimum NaCl dosage for RhB degradation was 1.75 g/L. Optimum air flow rate for the oxidants generation and RhB degradation was 2 L/min. $ClO_2$ and $H_2O_2$ generation was decreased with the increase of pH, whereas free Cl and $O_3$ was not affected by pH. RhB degradation was increase with the pH decrease.

Effects of Operating Parameters on Electrochemical Degradation of Rhodamine B and Formation of OH Radical Using BDD Electrode (BDD 전극을 이용한 OH 라디칼 생성과 염료 분해에 미치는 운전인자의 영향)

  • Park, Young-Seek;Kim, Dong-Seog
    • Journal of Environmental Science International
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    • v.19 no.9
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    • pp.1143-1152
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    • 2010
  • The purpose of this study is to degradation of Rhodamine B (RhB, dye) and N, N-Dimethyl-4-nitrosoaniline (RNO, indicator of the electro-generation of OH radical) in solution using boron doped diamond (BDD) electrode. The effects of applied current (0.2~1.0 A), electrolyte type (NaCl, KCl, and $Na_2SO_4$) and electrolyte concentration (0.5~3.0 g/L), solution pH (3~11) and air flow rate (0~4 L/min) were evaluated. Experimental results showed that RhB and RNO removal tendencies appeared with the almost similar thing, except of current. Optimum current for RhB degradation was 0.6 A, however, RNO degradations was increased with increase of applied current. The RhB and RNO degradation of Cl type electrolyte were higher than that of the sulfate type. The RhB and RNO degradation were increased with increase of NaCl concentration and optimum NaCl dosage was 2.5 g/L. The RhB and RNO concentrations were not influenced by pH under pH 7. Optimum air flow rate for the oxidants generation and RhB and RNO degradation were 2 L/min. Initial removal rate of electrolysis process was expressed Langmuir - Hinshelwood equation, which is used to express the initial removal rate of UV/$TiO_$2 process.