• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.621-622
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• 2011

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.37-42
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• 2011

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

• Current Photovoltaic Research
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• 제9권2호
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• pp.31-35
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• 2021

Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.

• Journal of Welding and Joining
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• 제27권3호
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• pp.23-31
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• 2009

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.917-918
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• 2009

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.175-177
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• 2006

Electrically Conductive Adhesives(ECAs) with solderable particles have been developed as an alternative to Pb-free solders. Our previous study proved that good wettability of solder particle is a prerequisite for the establishment of conduction paths. In this paper, two types of ECAs were formulated and the wetting characteristic low-melting-point Sn-In solder on Cu and Ni/Au pads was investigated. It was found that Sn-In solder in the developed resin material with reduction capability shows good wettability, especially on Cu pad.

• Current Photovoltaic Research
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• 제5권3호
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• pp.95-99
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• 2017

The interconnecting shingled solar cells method shows extremely high ratio active area per total area and has the excellent potential for high power PV (photovoltaic). Compared to the conventional module, it can have much more active area due to busbar-free structure. The properties of ECA (electrically conductive adhesives) are significant to fabricate the shingled array PV since it should be used in terms of electric and structural connection. Various ECA were tried and characterized to optimize the soldiering conditions. The open circuit voltage of shingled array cells showed a three-fold increase and efficiency was also increased by 1.63%. The shingled array cells used in CE3103WLV showed the highest power and in CA3556HF the lowest curing temperature and very fast curing time.

• Advances in aircraft and spacecraft science
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• 제4권6호
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• pp.729-744
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• 2017

This investigation highlights rationale of electrically conductive nano adhesives for its essential application for Electromagnetic Interference (EMI) Shielding in satellites and Lightning Strike Protection in aircrafts. Carbon Nano Fibres (CNF) were functionalized by electroless process using Tollen's reagent and by Plasma Enhanced Chemical Vapour Deposition (PECVD) process by depositing silver on CNF. Different weight percentage of CNF and silver coated CNF were reinforced into the epoxy resin hardener system. Scanning Electron Microscopy (SEM) micrographs clearly show the presence of CNF in the epoxy matrix, thus giving enough evidence to show that dispersion is uniform. Transmission Electron Microscopy (TEM) studies reveal that there is uniform deposition of silver on CNF resulting in significant improvement in interfacial adhesion with epoxy matrix. There is a considerable increase in thermal stability of the conductive nano adhesive demonstrated by Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA). Four probe conductivity meters clearly shows a substantial increase in the electrical conductivity of silver coated CNF-epoxy composite compared to non-coated CNF-epoxy composite. Tensile test results clearly show that there is a significant increase in the tensile strength of silver coated CNF-composites compared to non-coated CNF-epoxy composites. Consequently, this technology is highly desirable for satellites and EMI Shielding and will open a new dimension in space research.

• 한국전기전자재료학회논문지
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• 제34권6호
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• pp.449-453
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• 2021

Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.

• 대한기계학회논문집A
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• 제32권11호
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• pp.918-923
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• 2008

Since crack detection for laminated composites in-service is effective to improve the structural reliability of laminated composites, it have been tried to detect cracks of laminated composites by various nondestructive methods. An electric potential method is one of the widely used approaches for detection of cracks for carbon fiber composites, since the electric potential method adopts the electric conductive carbon fibers as reinforcements and sensors and the adoption of carbon fibers as sensors does not bring strength reduction induced by embedding sensors into the structures such as optical fibers. However, the application of the electric method is limited only to electrically conductive composite materials. Recently, a piezoelectric method using piezoelectric characteristics of epoxy adhesives has been successfully developed for the adhesive joints because it can monitor continuously the damage of adhesively bonded structures without producing any defects. Polymeric materials for the matrix of composite materials have piezoelectric characteristics similarly to adhesive materials, and the fracture of composite materials should lead to the fracture of polymeric matrix. Therefore, it seems to be valid that the piezoelectric method can be applied to monitoring the damage of composite materials. In this research, therefore, the feasibility study of the damage monitoring for composite materials by piezoelectric method was conducted. Using carbon fiber epoxy composite and glass fiber composite, charge output signals were measured and analyzed during the static and fatigue tests, and the effect of fiber materials on the damage monitoring of composite materials by the piezoelectric method was investigated.