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http://dx.doi.org/10.5781/KWJS.2009.27.3.023

Electrically Conductive Adhesive using Low-melting-point Alloy and Bonding Process using Them  

Yim, Byung-Seung (중앙대학교 기계공학부)
Jeon, Sung-Ho (중앙대학교 기계공학부)
Kim, Jong-Min (중앙대학교 기계공학부)
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Journal of Welding and Joining / v.27, no.3, 2009 , pp. 23-31 More about this Journal
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