Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2006.10a
- /
- Pages.175-177
- /
- 2006
Wetting Characteristic of Solder Particle for Electrically Conductive Adhesive
도전성 접착제에서의 솔더입자의 젖음 특성
- Yang, Gyeong-Cheon ;
- Jo, Sang-Hyeon ;
- Jo, Yun-Seong ;
- Lee, Seon-Byeong ;
-
Lee, Seong-Hyeok
;
-
Sin, Yeong-Ui
;
-
Kim, Jong-Min
- 양경천 (중앙대학교 공과대학 기계공학부) ;
- 조상현 (중앙대학교 공과대학 기계공학부) ;
- 조윤성 (중앙대학교 공과대학 기계공학부) ;
- 이선병 (중앙대학교 공과대학 기계공학부) ;
-
이성혁
(중앙대학교 공과대학 기계공학부)
;
-
신영의
(중앙대학교 공과대학 기계공학부)
;
-
김종민
(중앙대학교 공과대학 기계공학부)
- Published : 2006.10.19
Abstract
Electrically Conductive Adhesives(ECAs) with solderable particles have been developed as an alternative to Pb-free solders. Our previous study proved that good wettability of solder particle is a prerequisite for the establishment of conduction paths. In this paper, two types of ECAs were formulated and the wetting characteristic low-melting-point Sn-In solder on Cu and Ni/Au pads was investigated. It was found that Sn-In solder in the developed resin material with reduction capability shows good wettability, especially on Cu pad.
Keywords