DOI QR코드

DOI QR Code

A Study on Correlation Peel Strength and the Efficiency of Shingled Modules According to Curing Condition of Electrically Conductive Adhesives

슁글드 모듈에서 경화조건에 따른 ECA 접합강도와 효율의 상관관계에 관한 연구

  • Jun, Dayeong (New & Renewable Energy Research Center, Korea Electronic Technology Institute) ;
  • Son, Hyoungin (New & Renewable Energy Research Center, Korea Electronic Technology Institute) ;
  • Moon, Jiyeon (New & Renewable Energy Research Center, Korea Electronic Technology Institute) ;
  • Cho, Seonghyeon (New & Renewable Energy Research Center, Korea Electronic Technology Institute) ;
  • Kim, Sung hyun (New & Renewable Energy Research Center, Korea Electronic Technology Institute)
  • 전다영 (신재생에너지 연구센터, 전자부품연구원) ;
  • 손형진 (신재생에너지 연구센터, 전자부품연구원) ;
  • 문지연 (신재생에너지 연구센터, 전자부품연구원) ;
  • 조성현 (신재생에너지 연구센터, 전자부품연구원) ;
  • 김성현 (신재생에너지 연구센터, 전자부품연구원)
  • Received : 2021.04.07
  • Accepted : 2021.04.29
  • Published : 2021.06.30

Abstract

Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.

Keywords

Acknowledgement

본 연구는 산업통상자원부의 신재생에너지기술개발사업(20203030010300, 20193010014530)의 일환으로 수행되었습니다.

References

  1. Lalaguna, B., Sanchez-Frier, P., Mackel, H., Sanchez, D., Alonso, J., "Evaluation of Stress on Cells During Different Interconnection Processes," 23rd European Photovoltaic Solar Energy Conference, 2706-2708 (2008).
  2. Blakers, A. W., "Shading losses of solar-cell metal grids," Journal of Applied Physics, 71(10), 5237-5241 (1992). https://doi.org/10.1063/1.350580
  3. Klasen, N., Mondon, A., Kraft, A., Eitner, U., "Shingled Cell Interconnection: A New Generation of Bifacial PV-Modules," presented at the 7th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells (2018).
  4. Tonini, D., Cellere, G., Bertazzo, M., Fecchio, A., Cerasti, L., Galiazzo, M., "Shingling Technology For Cell Interconnection: Technological Aspects And Process Integration," Energy Procedia, 150, 36-43 (2018). https://doi.org/10.1016/j.egypro.2018.09.010
  5. Jee, H. S., Choi, W. Y., Lee, J. H., Jeong, C. H., "Characterization of Electrically Conductive Adhesives for Shingled Array Photovoltaic Cells," Current Photovoltaic Research, 5(3), 95-99 (2017).
  6. Theunissen, L., Willems, B., Burke, J., Tonini, D., Galiazzo, M., Henckens, A., "Electrically conductive adhesives as cell interconnection material in shingled module technology," presented at the SiliconPV 2018, The 8th International Conference On Crystalline Silicon Photovoltaics (2018).
  7. Jang, J. J., Park, J. E., Kim, D. S., Choi, W. S., Lim, D., "A Comparison Analysis on the Efficiency of Solar Cells of Shingled Structure with Various ECA Materials," Journal of the Korean Solar Energy Society, 39(4), 1-9 (2019).
  8. Nguyen, H. C., Lee, S. W., Back, J. H., Park, J. W., Kim, H. J., "Curing Behaviours and Adhesion Performance of Thermal Cured Acrylic PSAs Synthesized by UV-polymerization," The Society of Adhesion and Interface, 19(2), 74-82 (2018).