• Journal of Sensor Science and Technology
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• v.11 no.6
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• pp.358-364
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• 2002

In this paper, we used U.V.(wavelength, 355nm) laser for adjusting Pt thin films temperature sensor to $100{\Omega}$ at $0^{\circ}C$. Internationally, A-class tolerance of temperature sensor is $0.06{\Omega}$ at $0^{\circ}C$. This is under value of $0.15^{\circ}C$, actually, so high-fine trimming technology is essential to this process. The width of trimmed lines was about $10{\mu}m$ and the best trimming of Pt thin films of $1{\sim}1.5{\mu}m$ was carried out with power : 35mW, rep. rate frequency : 200Hz and bite size : $1.5{\mu}m$. And using photolithography process, 96 resistors were fabricated in $2"{\times}2"$ substrate as the proportion of $79{\sim}90{\Omega}$ and $91{\sim}102{\Omega}$ is 42.7% and 57.3%, respectively. As result of trimming resistors to the target value of $109.73{\Omega}$ at $25^{\circ}C$, 82.3% of resistors had the tolerance within ${\pm}0.30{\Omega}$ and the others(17.7%) were within ${\pm}0.06{\Omega}$ of A-class tolerance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.1
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• pp.50-60
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• 2018

In this paper, we developed a broadband multi-layered radome applicable for high-power applications. In this regard, we presented the wave propagation characteristics of the broadband multi-layered radome with the ABCD matrix and obtained the optimal thickness and the material constant for each layer by an optimization algorithm called "particle swarm optimization," implemented by a commercial numerical modeling tool. Further, we redesigned it in view of mechanical properties to reflect environmental conditions such as wind, snow, and ice. The power transmission property was reanalyzed based on the recalculated data of each layer's thickness to consider the limitations of the fabrication of a large structure. Under the condition of a peak electric field strength that is 10 dB above the critical electric field strength in air breakdown, we analyzed the air breakdown by radio frequency(RF) in the designed radome using the commercial full-wave electromagnetic tool. The radome was manufactured and tested by continuous wave(CW) RF small signal and large signal in an anechoic chamber. The test results showed good agreement with those attained by simulation.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.33-38
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• 2011

The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3$ powers were fabricated by mechanical alloying and hot-pressed at temperatures of $350{\sim}550^{\circ}C$. Themoelectric properties of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ were characterized as a function of the hot-pressing temperature. With increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$, the Seebeck coefficient and the electrical resistivity decreased from 237 ${\mu}V/K$ to 210 ${\mu}V/K$ and 2.25 $m{\Omega}-cm$ to 1.34 $m{\Omega}-cm$, respectively. The power factor of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ became larger from $24.95{\times}10^{-4}W/m-K^2$ to $32.85{\times}10^{-4}W/m-K^2$ with increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$. Among the specimens hot-pressed at $350{\sim}550^{\circ}C$, the $(Bi_{0.2}Sb_{0.8})_2Te_3$ hot-pressed at $500^{\circ}C$ exhibited the maximum dimensionless figure-of-merit of 1.09 at $25^{\circ}C$ and 1.2 at $75^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.409-409
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• 2014

Recently hexagonal boron nitride (h-BN), III-V compound of boron and nitrogen with strong covalent $sp^2$ bond, is a 2 dimensional insulating material with a large direct band gap up to 6 eV. Its outstanding properties such as strong mechanical strength, high thermal conductivity, and chemical stability have been reported to be similar or superior to graphene. Because of these excellent properties, h-BN can potentially be used for variety of applications such as dielectric layer, deep UV optoelectronic device, and protective transparent substrate. Ultra flat and charge impurity-free surface of h-BN is also an ideal substrate to maintain electrical properties of 2 dimensional materials such as graphene. To synthesize a single or a few layered h-BN, chemical vapor deposition method (CVD) has been widely used by using an ammonia borane as a precursor. Ammonia borane decomposes into hydrogen (gas), monomeric aminoborane (solid), and borazine (gas) that is used for growing h-BN layer. However, very active monomeric aminoborane forms polymeric aminoborane nanoparticles that are white non-crystalline BN nanoparticles of 50~100 nm in diameter. The presence of these BN nanoparticles following the synthesis has been hampering the implementation of h-BN to various applications. Therefore, it is quite important to grow a clean and high quality h-BN layer free of BN particles without having to introduce complicated process steps. We have demonstrated a synthesis of a high quality h-BN monolayer free of BN nanoparticles in wafer-scale size of $7{\times}7cm^2$ by using CVD method incorporating a simple filter system. The measured results have shown that the filter can effectively remove BN nanoparticles by restricting them from reaching to Cu substrate. Layer thickness of about 0.48 nm measured by AFM, a Raman shift of $1,371{\sim}1,372cm^{-1}$ measured by micro Raman spectroscopy along with optical band gap of 6.06 eV estimated from UV-Vis Spectrophotometer confirm the formation of monolayer h-BN. Quantitative XPS analysis for the ratio of boron and nitrogen and CS-corrected HRTEM image of atomic resolution hexagonal lattices indicate a high quality stoichiometric h-BN. The method presented here provides a promising technique for the synthesis of high quality monolayer h-BN free of BN nanoparticles.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.16 no.12
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• pp.1336-1347
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• 1991

In this paper, The PC interface for packet terminal of ISDN is designed and implemented in order to build packet communication networks which share computer resources and exchange informations between computer in the ISDN environment. The PC interface for packet terminal of ISDN constitutes S interface handler part which controls functions of ISDN layer1 and layer 2, constitutes packet handler part which controls services of X.25 protocol in the packet level.Where, The function of ISDN layer1 provides rules of electrical and mechanical characteristics, services for ISDN layer 2. The function of ISDN layer 2 provides function of LAPD procedure, services for X.25 The X.25 specifies interface between DCE and DTE for terminals operrating in the packet mode. The S interface handler part is orfanized by Am 79C30 ICs manufactured by Advanecd Micro Devices. ISDN packet handler part is organiged by AmZ8038 for FIFO for the purpose of D channel. The common signal procedure for D channel is controlled by Intel's 8086 microprocessor. The S interface handler part is based on ISDN layer1,2 is controlled by mail box in order to communicate between layers. The ISDN packet handler part is based on module in the X.25 lebel. The communication between S interface handler part and ISDN packet handler part is organized by interface controller.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.20-34
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• 2023

Single or multi-layered two-dimensional (2D) materials, with thicknesses in the order of a few nanometers, have garnered substantial attention across diverse research domains owing to their distinct properties, including electrical conductivity, flexibility, and optical transparency. These materials are frequently subjected to repetitive mechanical actions in applications like electronic skin (E-Skin) and smart textiles. Moreover, they are often exposed to external factors like temperature, humidity, and pressure, which can lead to a deterioration in component durability and lifespan. Consequently, significant research efforts are directed towards developing self-healing properties in these components. Notably, recent investigations have revealed promising outcomes in the field of self-healing composite materials, with Ti₃Ci₂Ti_x MXene being a prominent component among the myriad of available 2D materials. In this paper, we aim to introduce various synthesis methods and characteristics of Ti₃Ci₂Ti_x MXene, followed by an exploration of self-healing application technologies based on Ti₃Ci₂Ti_x MXene.

• Journal of Intelligence and Information Systems
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• v.29 no.4
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• pp.165-184
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• 2023

Recently, Deep learning analysis of unstructured text data using language models, such as Google's BERT and OpenAI's GPT has shown remarkable results in various applications. Most language models are used to learn generalized linguistic information from pre-training data and then update their weights for downstream tasks through a fine-tuning process. However, some concerns have been raised that privacy may be violated in the process of using these language models, i.e., data privacy may be violated when data owner provides large amounts of data to the model owner to perform fine-tuning of the language model. Conversely, when the model owner discloses the entire model to the data owner, the structure and weights of the model are disclosed, which may violate the privacy of the model. The concept of offsite tuning has been recently proposed to perform fine-tuning of language models while protecting privacy in such situations. But the study has a limitation that it does not provide a concrete way to apply the proposed methodology to text classification models. In this study, we propose a concrete method to apply offsite tuning with an additional classifier to protect the privacy of the model and data when performing multi-classification fine-tuning on Korean documents. To evaluate the performance of the proposed methodology, we conducted experiments on about 200,000 Korean documents from five major fields, ICT, electrical, electronic, mechanical, and medical, provided by AIHub, and found that the proposed plug-in model outperforms the zero-shot model and the offsite model in terms of classification accuracy.

• Korean Chemical Engineering Research
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• v.56 no.4
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• pp.577-584
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• 2018

This study was conducted to investigate the potential of chicken feather (CF), which is a by-product in poultry industry, as a partial substitute of wood fiber in the production of wood-based fiberboard. Keratin-type protein constituted the majority of CF, and its appearance did not differ from that of wood fiber. When the formaldehyde (HCHO) adsorptivities of CF compared by its pretreatment type, feather meal (FM), which was pretreated CF with high temperature and pressure and then grounded, showed the highest HCHO adsorptivity. In addition, there was no difference between the adsorbed HCHO amounts, which was measured by dinitrophenylhydrazine method, of scissors-chopped CF and CF beated with an electrical blender. Mechanical properties and HCHO emission of medium-density fiberboards (MDF), which were fabricated with wood fiber and 5 wt% CF, beated CF or FM based on the oven-dried weight of wood fiber, were not influenced by the pretreatment type of CF. However, when the values compared with those of MDF made with just wood fiber, thickness swelling and HCHO emission of the MDF were improved greatly with the addition of CF, beated CF or FM. Based on the results, it might be possible to produce MDF with improved dimensional stability and low HCHO emission if CF, beated CF or FM is added partially as a substitute of wood fiber in the manufacturing process of MDF produced with the conventional urea-formaldehyde resin of $E_1$ grade. However, the use of CF or FM in the production of MDF has a low economic feasibility at the current situation due to the securing difficulty and high cost of CF. In order to enhance the economic feasibility, it requires to use CF produced at small to medium-sized chicken meat plants. More importantly, it is considered that the technology developed from this research has a great potential to make provision for the prohibition of animal-based feed and to dispose environmentally avian influenza-infected poultry.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.18 no.2
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• pp.157-167
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• 2020

Removing radioactive concrete is crucial in the decommissioning of nuclear power plants. However, this process generates radioactive aerosols, exposing workers to radiation. Although large amounts of radioactive concrete are generated during decommissioning, studies on the internal exposure of workers to radioactive aerosols generated from the cutting of radioactive concrete are very limited. In this study, therefore, we calculate the internal radiation doses of workers exposed to radioactive aerosols during activities such as drilling and cutting of radioactive concrete, using previous research data. The electrical-mobility-equivalent diameter measured in a previous study was converted to aerodynamic diameter using the Newton-Raphson method. Furthermore, the specific activity of each nuclide in radioactive concrete 10 years after nuclear power plants are shut down was calculated using the ORIGEN code. Eventually, we calculated the committed effective dose for each nuclide using the IMBA software. The maximum effective dose of ¹⁵²Eu constituted 83.09% of the total dose; moreover, the five highest-ranked elements (¹⁵²Eu, ¹⁵⁴Eu, ⁶⁰Co, ²³⁹Pu, ⁵⁵Fe) constituted 99.63%. Therefore, we postulate that these major elements could be measured first for rapid radiation exposure management of workers involved in decommissioning of nuclear power plants, even if all radioactive elements in concrete are not considered.

• Journal of the Korea Society of Computer and Information
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• v.19 no.4
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• pp.1-8
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• 2014

As cores in multi-core processors are integrated in a single chip, power density increased considerably, resulting in high temperature. For this reason, many research groups have focused on the techniques to solve thermal problems. In general, the approaches using mechanical cooling system or DTM(Dynamic Thermal Management) have been used to reduce the temperature in the microprocessors. However, existing approaches cannot solve thermal problems due to high cost and performance degradation. However, floorplan scheme does not require extra cooling cost and performance degradation. In this paper, we propose the diverse floorplan schemes in order to alleviate the thermal problem caused by the hottest unit in multi-core processors. Simulation results show that the peak temperature can be reduced efficiently when the hottest unit is located near to L2 cache. Compared to baseline floorplan, the peak temperature of core-central and core-edge are decreased by $8.04^{\circ}C$, $8.05^{\circ}C$ on average, respectively.