• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.7
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• pp.407-412
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• 2017

This paper introduces a biocompatible packaging system for implantable medical device having a hermetic sealing, such that a perfect physical and chemical isolation between electronic medical system and human body (including tissue, body fluids, etc.) is obtained. The hermetic packaging includes an electronic MEMS pressure sensor, power charging system, and bluetooth communication system to wirelessly measure variation of capacitance. The packaging was acquired by Quartz direct bonding and $CO_2$ laser welding, with a size of width $ 6cm{\times}length\;10cm{\times}lheight\;3cm$. Hermetic sealing of the packaged system was tested by changing the pressure in a hermetic chamber using a precision pressure controller, from atmospheric to 900 mmHg. We found that the packaged system retained the same count or capacitance values with sensor 1 - 25,500, sensor 2 - 26,000, and sensor 3 - 20,800, at atmospheric as well as 900 mmHg pressure for 5 hours. This result shows that the packaging method has perfect hermetic sealing in any environment of the human body pressure.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.1-5
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• 2004

A multi-layer flexible substrate is composed of copper(Cu)/polyimide that are known as good electrical conductivity, and low dielectric constant, respectively. In this study. conductor line of $5{\mu}m$-pitch was successfully fabricated without non-uniform pattern shape by electroplating copper and coating polyimide on patterned stainless steel. For multi-layer flexible substrate, via holes were drilled by UV laser and filled with electroplating copper and tin. And then, the PI layer with vias and conductor lines was stripped from stainless steel substrate. The PI layers were laminated at once with careful alignment between layers. Solid state reaction between tin and copper during lamination formed the intermetallic compounds of $Cu_6Sn_5$($\eta$-phase) and $Cu_3Sn$($\epsilon$-Phase) and achieved a complete inter-connection by vertically positioning the plugged via holes on via pad. The via formation process has several advantages; such as better electrical property and lower cost than V type via and paste via.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.4
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• pp.237-240
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• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.26 no.1
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• pp.47-53
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• 2015

In this paper, a novel fluid controlled phase tunable line using inkjet printed microfluidic composite right/left-handed(CRLH) transmission line(TL) is proposed. A CRLH-TL prototype has been inkjet-printed on a paper substrate using silver nano particle ink. In addition, a laser-etched microfluidic channel in poly methyl methacrylate(PMMA) has been integrated with the CRLH TL using inkjet-printed SU-8 as a bonding material. The proposed TL provides excellent phase-tuning capability that is dependent on the different fluidic materials used. As the fluid is changed, the proposed TL can have negative-phase, zero-phase, and positive-phase characteristics at 900 MHz and reflection coefficient is maintained to below -10 dB. The performance of the proposed TL is successfully validated using simulation and measurement results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.388-394
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• 2008

For purpose of anti-static film remaining unchanged in the condition of $160^{\circ}C$, organic solvent, acid and base solution $0.01\sim0.03{\mu}m$ particles of Sb doped tin oxide(ATO) were grafted by 3-Glycidyloxypropyltrimethoxysilane(GPTS) for improving interfere bonding force between ATO and epoxy resin. The particles were dispersed in 2-methoxyethanol with YD-I28(Bisphenol A type epoxy resin, Kukdo chemical) and 1-imidazole as hardener. The anti-static solutions were coated on PI film as thickness of $0.1{\mu}m$. Surface resistivity of anti-static film containing conductive polymer became $10^{12}\Omega/\Box$ after 32 hours in $160^{\circ}C$. The surface resistivity of ATO grafted by GPTS / Epoxy coating layer remained as $10^{7.6}\Omega/\Box$ in $160^{\circ}C$ for 7 days. ATO grafted by GPTS / Epoxy coating layer coated on PI film was dipped in acetone for 7 days. The surface resistivity remained unchanged as $10^{7.6}\Omega/\Box$. The anti-static layer dipped in water solutions containing each KOH 10 wt % and $H_2SO_4$ 2 wt% was ultra-sonicated for 10 minutes per once until 30th. The surface resistance of anti-static layer containing ATO grafted by GPTS remained unchanged.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.1
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• pp.28-33
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• 2015

The needle electrode is inserted into the cross-linked polyethylene(XLPE) which is the ultra high voltage cable for electric power. By changing the tilt of the needle electrode, we investigated how the void and the thickness of the insulating layer influence the partial discharge(PD) characteristics and the insulating breakdown. In order to investigate the PD characteristics, The XLPE cable was used to the specimens and the tungsten electrode was used with the needle electrode. And the inner semi-conductive layer material of XLPE cable was used with the negative electrode by bonding with the use of conduction tape. The size of the specimens was manufactured to be $16{\times}40{\times}30[mm^3]$. We confirmed the effect on changing the PD characteristics according to the changing voltage and the tilt of the electrode after applying the voltage on the electrode from 1[kV] to 40[kV] at room temperature. In the PD characteristics, it was confirmed that the PD current of air void specimens with tilt was unstable more than that of no void specimens with tilt. It was also confirmed that the breakdown voltage was decreased because the effect of air void is more active than the change of the needle electrode tilt in the specimen with air void inside the insulation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.18-20
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• 2010

The mechanism for suppression of Ag agglomeration in Ag-Mg alloy ohmic contact to p-GaN is investigated. The Ag-Mg alloy ohmic contact shows low contact resistivity of $6.3\;{\times}\;10^{-5}\;{\Omega}cm^2$, high reflectance of 85.5% at 460 nm wavelength after annealing at $400^{\circ}C$ and better thermal stability than Ag contact The formation of Ga vacancies increase the net hole concentration, lowering the contact resistivity. Moreover, the oxidation of Mg atoms in Ag film increase the work function of Ag-Mg alloy contact and prevents Ag oxidation. The inhibition of oxygen diffusion by Mg oxide suppresses the Ag agglomeration, leading to enhance light reflectance and thermal stability.

• Carbon letters
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• v.21
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• pp.68-73
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• 2017

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10-120 nm and quasi-spherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of $4.8{\mu}m$ by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was $2.092{\times}10^{-6}{\Omega}{\cdot}cm$, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ${\sim}2.049{\times}10^{-6}{\Omega}{\cdot}cm$. The corrosion resistance of the BETF was $9.306{\Omega}$, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.1
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• pp.141-148
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• 2008

This paper presents experimental results on the safety of persons and protection of low-voltage equipments of the sub-station due to a single-phase ground fault in 22.9 kV-Y distribution system. In order to evaluate the hazard voltages and the stress voltage of the low-voltage(LV) equipment due to faults between high-voltage systems and earth based on the newly prescribed KS C IEC 60364 standard series, the verification tests in a 22.9[kV] neutral multiple grounding system were carried out. From the experimental results, we introduce serious problems causing some discomfort when applying KS C IEC 60364 standard series to the existing domestic distribution system and the effective protective measures against temporary overvoltages due to a ground fault in the common grounding which is combined the 22.9 kV-Y grounding and the customer's installation grounding are proposed. As a consequence, it was found that the equipotential bonding is an important prerequisite for the effectiveness of the protective measures for the safety of persons and LV equipment in the combined 22.9 kV-Y and low-voltage grounding system.

• Korean Chemical Engineering Research
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• v.55 no.2
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• pp.253-257
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• 2017

Graphene is a monolayer carbon material which consists of $sp^2$ bonding between carbon atoms. Its excellent intrinsic properties allow graphene to be used in various research fields. Many researchers believe that graphene is suitable for electronic device materials due to its high electrical conductivity and carrier mobility. Through chemical doping, n- or p-type graphene can be obtained, and consequently graphene-based devices which have more comparable structure to common semiconductor-based devices can be fabricated. In our research, we introduced the dielectrophoresis process to the chemical doping step in order to improve the effect of chemical doping of graphene selectively. Under 10 kHz and $5V_{pp}$ (peak-to-peak voltage), doping was conducted and the Au nanoparticles were effectively formed, as well as aligned along the edges of graphene. Effects of the selective chemical doping on graphene were investigated through Raman spectroscopy and the change of its electrical properties were explored. We proposed the method to enhance the doping effect in local region of a graphene layer.