• 한국세라믹학회지
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• 제26권6호
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• pp.747-754
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• 1989

The effects of CuO and SiO2 on the sintered density, grain growth and magnetic properties of Sr-ferrite were investigated. The sintered density of Sr-ferrite is increased with increasing the amount of CuO or SiO2 addition. The grain of Sr-ferrite grow uniformly with the addition of CuO, so remanence increases and coercivity decreases. The addition of SiO2 increase coercivity but does not affect remanence prominently. The sintering temperature above 125$0^{\circ}C$ and SiO2 addition above 0.8wt% causes abnormal grain growth in Sr-ferrite. When CuO and SiO2 are added simultaneouly, remanence does not decrease but coercivity shows low value.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1200-1204
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• 2003

In this study, in order to develop the low temperature sintering ceramics for multi-layer piezoelectric transformer, PSN-PZT system ceramics were manufactured as a function of CuO addition and their dielectric and piezoelectric characteristics were Investigated. CuO addition facilitated densification at low temperature due to the effect of Cu$_2$O-PbO liquid phase. Through the X-ray diffraction pattern study, absence of second phase unwanted was confirmed. Among the specimen to which CuO was added, the 0.6wt% CuO added specimen sintered at 900$^{\circ}C$ and 920$^{\circ}C$ showed the most excellent mechanical quality factor and electromechanical coupling factor, respectively. Besides the densification accelerator, CuO acted as a accepter and increased mechanical quality. Compared with the specimen with no addition sintered at 1150$^{\circ}C$ , the 0.6wt% CuO added specimen sintered at 920$^{\circ}C$ showed the appropriate dielectric and piezoelectric characteristics for multi-layer piezoelectric transformer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.701-704
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• 2003

In this study, to develop the low temperature sintering ceramics for multilayer piezoelectric transformer, PSN-PNN-PZT system ceramics were manufactured as a function of CuO addition. Its dielectric and piezoelectric characteristics were investigated. With increasing the amount of CuO addition, grain size was increased and density increased until 0.3wt% CuO. Taking into consideration electromechanical coupling factor(kp) of 0.53, mechanical quality factor(Qm) of 423 and ${\epsilon}r$ of 1759, it can be cincluded that the CuO 0.5wt% added composition sintered at $920^{\circ}C$ is suitable for piezoelectric transformer application if Qm is improved.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• 한국주조공학회지
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• 제34권3호
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• pp.100-106
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• 2014

In recent years, Mg and its alloys have attracted a great deal of attention due to their low density, relatively excellent castability, and straightforward recyclability. Mg alloys have been widely applied to various industrial fields, and are representatively used in automotive and electronic parts. According to previous researches, the electrical conductivity of Mg alloys greatly decreases with increasing Al content. However, with the addition of Zn and/or Cu, the electrical conductivity of Mg alloys is maintained or slightly increased, and improved mechanical properties are obtained as well. On this basis, Mg-Zn-Cu alloys have been investigated in the present study with a focus on the effect of adding Zn and Cu on the electrical conductivity. The Zn and Cu contents ranged from 4 to 6wt.% and 0 to 1.5wt.%, respectively. Ternary Mg-Zn-Cu alloys have been prepared by gravity casting in a steel mold. In the as-casting condition, the electrical conductivity of Mg-Zn-Cu alloys showed a linear increasing trend with decreasing Zn and increasing Cu contents. Furthermore, impact values of Zn = -1.5 and Cu = 2.5 were determined for these alloys by electrical conductivity tests.

• Journal of Ceramic Processing Research
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• 제19권5호
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• pp.434-438
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• 2018

The sintering behavior of $BaFe_{12}O_{19}$ with the addition of one and three weight % of $CuWO_4$ as a liquid phase sintering aid is studied. Samples are sintered in the temperature range $900-1250^{\circ}C$ and the effect of $CuWO_4$ addition on density, microstructure, phase composition and magnetic properties is examined. Compared to $BaFe_{12}O_{19}$ with no sintering aid addition, addition of 1 wt % $CuWO_4$ retards densification. Addition of 3 wt % $CuWO_4$ promotes densification at lower sintering temperatures but retards densification at temperatures > $1050^{\circ}C$. Three wt % $CuWO_4$ addition induces the formation of $BaWO_4$ and $Ba_3WFe_2O_9$ secondary phases at temperatures ${\geq}1100^{\circ}C$. Addition of $CuWO_4$ causes a decrease in saturation magnetization, remanent magnetization and coercivity.

• Advances in materials Research
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• 제1권1호
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• pp.83-92
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• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• 한국재료학회지
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• 제29권3호
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• pp.150-154
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• 2019

This study investigates the effect of MnO2 and CuO as acceptor additives on the microstructure and piezoelectric properties of $0.96(K_{0.5}Na_{0.5})_{0.95}Li_{0.05}Nb_{0.93}Sb_{0.07}O_3-0.04BaZrO_3$, which has a rhombohedral-tetragonal phase boundary composition. $MnO_2$ and CuO-added $0.96(K_{0.5}Na_{0.5})_{0.95}Li_{0.05}Nb_{0.93}Sb_{0.07}O_3-0.04BaZrO_3$ ceramics sintered at a relatively low temperature of $1020^{\circ}C$ show a pure perovskite phase with no secondary phase. As the addition of $MnO_2$ and CuO increases, the sintered density and grain size of the resulting ceramics increases. Due to the difference in the amount of oxygen vacancies produced by B-site substitution, Cu ion doping is more effective for uniform grain growth than Mn ion doping. The formation of oxygen vacancies due to B-site substitution of Cu or Mn ions results in a hardening effect via ferroelectric domain pinning, leading to a reduction in the piezoelectric charge coefficient and improvement of the mechanical quality factor. For the same amount of additive, the addition of CuO is more advantageous for obtaining a high mechanical quality factor than the addition of $MnO_2$.

• 한국재료학회지
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• 제12권6호
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• pp.436-441
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• 2002

Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.

• 한국세라믹학회지
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• 제16권4호
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• pp.225-236
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• 1979

The effect of $Ti^{+4}$ addition on the sinterability, microstructure, and temperature dependence of electromechanical coupling factor of magnetostrictive Ni-Cu-Co ferrite was investigated. The density of Ni-Cu-Co ferrite slightly increased by 2.0 mole % addition of either $TiO_2$ or $Fe_2TiO_4$, but tended to decrease by more than 2.0 mole % addition of $TiO_2$ or $Fe_2TiO_4$. As the content of either $TiO_2$ or $Fe_2TiO_4$ increased, the magnetocrystalline anisotropy compensation temperature also increased. Microstructure studies showed the stable grains when Ni-Cu-Co ferrite was sintered above 1, 20$0^{\circ}C$.