• ETRI Journal
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• v.24 no.6
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• pp.462-464
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• 2002

This paper presents a serial interface circuit that permits selection of the amount of data converted from serial-to-parallel and parallel-to-serial and overcomes the disadvantages of the conventional serial input/output interface. Based on the selected data length operating mode, 8 bit or 16 bit serial-to-parallel and 8 bit or 16 bit parallel-to-serial conversion takes place in data blocks of the selected data length.

• ETRI Journal
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• v.31 no.4
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• pp.351-356
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• 2009

We present a simple semiconductor process to fabricate nanogap arrays for application in molecular electronics and nano-bio electronics using a combination of freestanding silicon nanowires and angle evaporation. The gap distance is modulated using the height of the silicon dioxide, the width of the Si nanowires, and the evaporation angle. In addition, we fabricate and apply the nanogap arrays in single-electron transistors using DNA-linked Au nanoparticles for the detection of DNA hybridization.

• ETRI Journal
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• v.31 no.6
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• pp.765-769
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• 2009

In this paper, we present the fabrication of 40 Gb/s traveling-wave electroabsorption modulator-integrated laser (TW-EML) modules. A selective area growth method is first employed in 40 Gb/s EML fabrication to simultaneously provide active layers for lasers and modulators. The 3 dB bandwidth of a TW-EML module is measured to be 34 GHz, which is wider than that of a lumped EML module. The 40 Gb/s non-return-to-zero eye diagram shows clear openings with an average output power of +0.5 dBm.

• ETRI Journal
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• v.33 no.4
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• pp.637-640
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• 2011

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.

• ETRI Journal
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• v.33 no.6
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• pp.969-972
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• 2011

This letter presents a CMOS RF front-end operating in a subthreshold region for low-power Band-III mobile TV applications. The performance and feasibility of the RF front-end are verified by integrating with a low-IF RF tuner fabricated in a 0.13-${\mu}m$ CMOS technology. The RF front-end achieves the measured noise figure of 4.4 dB and a wide gain control range of 68.7 dB with a maximum gain of 54.7 dB. The power consumption of the RF front-end is 13.8 mW from a 1.2 V supply.

• ETRI Journal
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• v.28 no.4
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• pp.513-516
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• 2006

Experimental demonstration of bipolar spectral encoding code-division multiple-access with modified pseudorandom noise codes is presented. Bipolar spectral encoding is achieved with an erbium-doped fiber amplifier amplified spontaneous emission source and arrayed waveguide gratings. The bit-error rate performance of 1.25 Gbps signal transmission over 80 km single mode fiber is measured in a multiple-user environment.

• ETRI Journal
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• v.28 no.3
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• pp.364-366
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• 2006

This letter introduces an efficient transmission of traffic information through a terrestrial digital multimedia broadcasting system, which is a multimedia and mobility empowered option of the European digital audio broadcasting system. By adapting Korean characteristic traffic information into the transport protocol expert group messages in the traffic information delivery, a highly efficient traffic information system was implemented and tested in Korea.

• ETRI Journal
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• v.27 no.5
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• pp.484-490
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• 2005

We fabricated 40 Gb/s front-end optical receivers using spot-size converter integrated waveguide photodiodes (SSC-WGPDs). The fabricated SSC-WGPD chips showed a high responsivity of approximately 0.8 A/W and a 3 dB bandwidth of approximately 40 GHz. A selective wet-etching method was first adopted to realize the required width and depth of a tapered waveguide. Two types of electrical pre-amplifier chips were used in our study. One has higher gain and the other has a broader bandwidth. The 3 dB bandwidths of the higher gain and broader bandwidth modules were about 32 and 42 GHz, respectively. Clear 40 Gb/s non-return-to-zero (NRZ) eye diagrams showed good system applicability of these modules.

• ETRI Journal
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• v.25 no.3
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• pp.149-155
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• 2003

A self-pulsating multisection distributed-feedback laser diode (DFB LD) can potentially realize all-optical clock extraction. This device generally consists of three sections, two DFB sections and one waveguide section. The most important variable in this device is detuning, which is the relative spectral position between the stop bands of two DFB sections. We fabricated a novel structure in which two gratings were located one over and one under the active layers. Each grating structure was independently defined in processing so that detuning, which is the prerequisite for self-pulsation, could be easily controlled. Observing various self-pulsating phenomena in these devices under several detuning conditions, we characterized the phenomena as dispersive Q-switching, mode beating, and self-mode-locking.

• ETRI Journal
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• v.32 no.2
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• pp.342-344
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• 2010

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.