• 제목/요약/키워드: EMC

검색결과 968건 처리시간 0.032초

A Study on the EMC for Application of Wireless Communication System in Nuclear Power Plants (무선통신시스템 활용을 위한 원자력발전소 EMC 확보방안에 관한 연구)

  • Ko, Do-Young;Bae, Byung-Hwan
    • Proceedings of the KIEE Conference
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    • 대한전기학회 2006년 학술대회 논문집 정보 및 제어부문
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    • pp.500-502
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    • 2006
  • Recently, nuclear power plants have been testing for application of wireless communication system to improve communication easier. Improving the availability of communication in NPPs, plant operation ability and good communication have contributed to the lower reactior trip frequency. In these regards, the possibilities of improvement in communication systems are reviewed detail. Especially, we reviewed the wire communication system, facility effect, regulation and new technologies. In this paper, we described the application of wireless in NPPs by studying EMI/RFI, EMC effect.

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Interconnection structures of bilevel microstriplines using electromagnetic coupling (전자기적 결합을 이용한 이층 마이크로스트립선로의 접속 구조)

  • 박기동;이현진;임영석
    • Journal of the Korean Institute of Telematics and Electronics A
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    • 제32A권8호
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    • pp.47-55
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    • 1995
  • Proximity-coupled open-end microstrip interconnections in bilevel planar structures are investigated through three-dimensional finite-difference time-domain(3D-FDTD) method. Three types of EMC (electromagnetically coupled) microstriplines are considered, collinear lines, transverse lines and modified EMC structure. From the analyzed results, it is found that these EMC interconnections have the coupling coefficient enough to interconnect lines in bilevel structures over a broad-band. The computed results of the modified EMC structure was compared with measurement from physical model and the computed results of via hole interconnection.

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Synthesis of LiDAR-reflective Hollow-structured Black Materials and Recycling of Their Etched Waste for Semiconductor Epoxy Molding Compound (라이다 반사형 중공구조 검은색 물질의 개발 및 코어 에칭 폐액 재활용을 통한 반도체용 에폭시 몰딩 컴파운드 응용)

  • Ha-Yeong Kim;Min Jeong Kim;Jiwon Kim;Suk Jekal;Seon-Young Park;Jong Moon Jung;Chang-Min Yoon
    • Journal of the Korea Organic Resources Recycling Association
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    • 제31권1호
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    • pp.5-14
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    • 2023
  • In this study, LiDAR-reflective black hollow-structured silica/titania(B-HST) materials are successfully synthesized by employing the NaBH4 reduction and etching method on silica/titania core/shell(STCS) materials, which also effectively enhance near-infrared(NIR) reflectance. Moreover, core-etched supernatant solutions are collected and recycled for the synthesis of extracted silica(e-SiO2) process, which successfully applies as filler materials for semiconductor epoxy molding compound(EMC). In detail, B-HST materials, fabricated by the sequential experimental steps of sol-gel, reduction, and sonication-mediated etching method, manifest blackness(L*) of 13.2 similar to black paint and excellent NIR reflectance(31.1%). Consequently, B-HST materials are successfully prepared as LiDAR-reflective black materials. Additionally, core-etched supernatant solution with silanol precursors are employed for synthesis of homogeneous silica filler materials via sol-gel method. As-synthesized silica fillers are incorporated with epoxy resin and carbon black for the preparation of semiconductor EMC. Experimentally synthesized EMC exhibits comparable mechanical-chemical properties to commercial EMC. Conclusively, this study successfully proposes designing procedure and practical experimental method for simultaneously synthesizing the NIR-reflective black materials for self-driving vehicles and EMC materials for semiconductors, which are materials suitable for the industrial 4.0 era, and presented their applicability in future industries.

Highly filled AIN/epoxy composites for microelectronic encapsulation (반도체 봉지용 고충진 AIN/Epoxy 복합재료)

  • 배종우;김원호;황영훈
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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    • pp.131-134
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    • 2000
  • Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

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EMC Compatibility Analysis of CEU EMC test results in the Optical Satellite System (광학위성 카메라전자부 EMC 시험결과의 시스템 양립성 검토)

  • Jang, Jae-Woong;Kim, Tae-Yoon;Lim, Seong-Bin;Moon, Guee-Won
    • Aerospace Engineering and Technology
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    • 제9권2호
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    • pp.161-167
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    • 2010
  • CEU(Camera Electronic Unit) loaded in optical satellite for a high resolution image acquisition is composited with CC(Camera Controlloer), FPA(Focal Plane Assembly) and CEUP(CEU Power supply). EMC test and analysis results are explained in this paper. CE, CS, RE and RS test is performed in the 1st EMC test, RE, RS test which is not complied and influence considerably after shielding structure is performed in the 2nd EMC test. An effect due to the noise of CEU in the GPS/S-band receiving band is analyzed based on 2nd EMC test results. Margin more than 6dB is guaranteed when CEU is shielded.

A Study on Design and Fabrication of Broad-Band EMC Filter for PC (PC용 광대역 EMC 필터의 설계 및 제작에 관한 연구)

  • 김동일;정상욱;김민정;전중성
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 한국항해항만학회 2004년도 춘계학술대회 논문집
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    • pp.11-15
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    • 2004
  • This paper deals with EMC filter for a personal computer( PC). A PC contains many sources of noise inside and out, with many connected cables. High noise levels are also emitted from the PC became of high-speed signals. So radiated noise from the computer body may sometimes cause problems. Therefore, we design and fabricate an electromagnetic compatibility (EMC) filter for PC, which is composed of feed-through capacitors and ferrite beads with high permeability. Through extensive test, the proposed EMC filter is shown to have excellent differential-mode and common-mode noises filtering characteristics above 30 dB in the frequency band from 10 MHz to 1.5 GHz. The immunity characteristics are improved more than 10 to 30 dB over the frequency band from DC to 1.8 GHz

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Specification Establishment and Verification for KSLV-I EMC Control (나로호의 EMC 통제를 위한 규격설정 및 검증)

  • Ji, Ki-Man
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • 제25권3호
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    • pp.311-318
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    • 2014
  • Electromagnetic compatibility(EMC) performance of the first Korea space launch vehicle(KSLV-I) should be ensured and verified in order to guarantee the normal operation among the spacecraft, ground facilities which are installed in the space center, and other wireless communication networks. For the purpose of the EMC performance verification, pertinent EMC test specifications, methods, and procedures for both the subsystems and the system should be established in consideration of operational properties and electromagnetic environmental effects. And it is required to maintain and control the EMC properties consistently in accordance with the determined specifications up to the program closing phase. In this paper, sequential management work conducted during the overall development process of the KSLV-I is explained, and not only the phased EMC test plan for each model of the KSLV-I and its subsystem but also test method, specification, and results of the verification tests are presented. And also, multipaction analysis results are presented.

A Study on the Mechanical Properties of EMC and Thermal Stress Anlaysis in Electronic Packagings (전자패키지용 EMC의 기계적 성질 및 패키지내의 열응력해석)

  • Shin, Dong-Kil;Lee, Jung-Ju
    • Transactions of the Korean Society of Mechanical Engineers A
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    • 제20권11호
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    • pp.3538-3548
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    • 1996
  • In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

A Design Verification for the EQM CBS Ka-band Payload System by EMC Test (EQM 통신방송위성 KA대역 탑재체 시스템의 EMC 시험을 통한 검증)

  • Lee,Ho-Jae;U,Hyeong-Je;Sin,Dong-Hwan;Park,Jong-Heung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • 제31권10호
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    • pp.97-104
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    • 2003
  • This paper addresses EMC test results for the EQM Communications & Broadcasting Satellite(CBS) Ka-band Payload System. The aim of the EMC test is to verify that the payload system has no effect on the other system and is not affected by the external field. The compliance of EMC system requirements was verified by the analysis and measurement of the emission level from the payload system. The variation of performance by noise injection was measured to inspect the susceptibility of the payload system. The analysis and test results also showed that the electromagnetic interference has no serious effect on the overall payload system performance. It is confirmed that the EQM CBS Ka-band payload system can be operable in the space environment from the EMC performance's viewpoint. It is also obtained that better performance can be acquired by improving waveguide design and integration method.

A Stay Time Optimization Model Emergency Medical Center (EMC) (응급의료센터 체류시간 최적화)

  • Kim, Eun-Joo;Lim, Ji-Young;Ryu, Jeong-Soon;Cho, Sun-Hee;Bae, Na-Ri;Kim, Sang-Suk
    • Journal of Korean Academic Society of Home Health Care Nursing
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    • 제18권2호
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    • pp.81-87
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    • 2011
  • Purpose: The aim of this study was to estimate optimization model of stay time in EMC. Methods: Data were collected at an EMC in a hospital using medical records from June to August in 2007. The sample size was 8,378. The data were structured by stay time for doctor visit, decision making, and discharge from EMC. Descriptive statistics were used to find out general characteristics of patients. Average mean and quantile regression models were adopted to estimate optimized stay time in EMC. Results: The stay times in EMC were highly skewed and non-normal distributions. Therefore, average mean as an indicator of optimal stay time was not appropriate. The total stay time using conditional quantile regression model was estimated about 110 min, that was about 166 min shorter than estimated time using average mean. Conclusion: According to these results, we recommend to use a conditional quantile regression model to estimate optimal stay time in EMC. We suggest that this results will be used to develop a guideline to manage stay time more effectively in EMC.

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