• 제목/요약/키워드: EBSD

검색결과 180건 처리시간 0.021초

A Study on the Surface Characteristics of Dual Phase Steel by Electron Backscatter Diffraction (EBSD) Technique

  • Jeong, Bong-Yong;Ryou, Min;Lee, Chongmu;Kim, Myung Ho
    • Transactions on Electrical and Electronic Materials
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    • 제15권1호
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    • pp.20-23
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    • 2014
  • Dual phase steels have a microstructure comprising of a polygonal ferrite matrix together with dispersed islands of martensite. There are clear differences between the image quality (IQ) map of the dual phase and the corresponding ferritic/pearlitic structures, both in the as-heat treated and cold rolled conditions. Electron backscatter diffraction (EBSD) techniques were used to study the evolution substructure of steel due to plastic deformation. The martensite-ferrite and ferrite-pearlite interfaces were observed. The interface can be a source of mobile dislocations which the bands seem to originate from the martensite islands. In particular, the use of image quality is highlighted.

투과전자현미경과 전자후방산란회절을 이용한 AlN의 미세구조 분석 (Microstructure analyses of aluminum nitride (AlN) using transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD))

  • 주영준;박청호;정주진;강승민;류길열;강성;김철진
    • 한국결정성장학회지
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    • 제25권4호
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    • pp.127-134
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    • 2015
  • AlN 단결정은 넓은 밴드갭(6.2 eV), 높은 열 전도도($285W/m{\cdot}K$), 높은 비저항(${\geq}10^{14}{\Omega}{\cdot}cm$), 그리고 높은 기계적 강도와 같은 장점들 때문에 차세대 반도체 적용을 위한 많은 흥미를 끈다. 벌크 AlN 단결정 또는 박막 템플릿(template)들은 주로 PVT(Physical vapor transport)법, 플럭스(flux)법, 용액 성장(solution growth)법, 그리고 증기 액상 증착(HVPE)법에 의해 성장된다. 단결정이 성장하는 동안에 발생하는 결함들 때문에 상업적으로 어려움을 갖게 된 이후로 결함들 분석을 통한 결정 품질 향상은 필수적이다. 격자결함 밀도(EPD)분석은 AlN 표면에 입자간 방위차와 결함이 존재하고 있는 것을 보여준다. 투과전자현미경(TEM)과 전자후방산란회절(EBSD)분석은 전체적인 결정 퀄리티와 다양한 결함의 종류들을 연구하는데 사용된다. 투과전자현미경(TEM)관찰로 AlN의 형태가 적층 결함, 전위, 이차상 등에 의해 크게 영향을 받는 것을 알 수 있었다. 또한 전자후방산란회절(EBSD)분석은 전위의 생성을 유도하는 성장 결함으로서 AlN의 zinc blende 폴리모프(polymorph)가 존재하고 있는 것을 나타내고 있었다.

EBSD측정에 의한 반복겹침접합압연된 무산소동의 두께방향으로의 미세조직 변화 분석 (Microstructural Evolution Analysis in Thickness Direction of An Oxygen Free Copper Processed by Accumulative Roll-Bonding Using EBSD Measurement)

  • 이성희;임차용
    • 한국재료학회지
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    • 제24권11호
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    • pp.585-590
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    • 2014
  • Microstructural evolution in the thickness direction of an oxygen free copper processed by accumulative rollbonding (ARB) is investigated by electron back scatter diffraction (EBSD) measurement. For the ARB, two copper alloy sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked and roll-bonded by about 50% reduction rolling without lubrication at an ambient temperature. The bonded sheet is then cut to the two pieces of the same dimensions and the same procedure was repeated on the sheets up to eight cycles. The specimen after 1 cycle showed inhomogeneous microstructure in the thickness direction so that the grains near the surface were finer than those near the center. This inhomogeneity decreased with an increasing number of ARB cycles, and the grain sizes of the specimens after 3 cycles were almost identical. In addition, the aspect ratio of the grains decreased with an increasing number of ARB cycles due to the subdivision of the grains by shear deformation. The fraction of grains with high angle grain boundaries also increased with continuing process of the ARB so that it was higher than that of the low angle grain boundaries in specimens after 3 cycles. A discontinuous dynamic recrystallization occurred partially in specimens after 5 cycles.

열처리에 따른 Cu 전해도금막의 미세구조 및 물리적성질 변화 (The Microstructure and physical properties of electroplated Cu films)

  • 권덕렬;박현아;김충모;이종무
    • 한국진공학회지
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    • 제13권2호
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    • pp.72-78
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    • 2004
  • TaN막 위에 magnetron sputtering으로 증착 시킨 Cu seed 막을 Cu 전해도금을 하기에 앞서 ECR plasma 장치로 전처리 세정하였다. 이때 Cu 막을 200∼$500^{\circ}C$로 변화시키면서 알곤 또는 질소 분위기에서 RTA(rapid themal annealing) 방법으로 열처리하였다. Cu seed 막 위에 전해도금법으로 형성한 Cu 막을 열처리했을 때 미세구조와 물리적 특성변화를 XRD(x-ray diffraction), EBSD(electron back-scattered diffraction), AFM(atomic force microscopy) 분석을 이용하여 조사하였다. $400^{\circ}C$보다 높은 온도에서 재결정이 일어났으며, 열처리 온도를 증가함에 따라 Cu막의 비저항이 감소하고 (111) 우선배향성이 증가하는 경향을 나타냈다. 최소의 비저항과 부드러운 표면 및 (111) 배향성이 뛰어난 Cu막을 얻기 위한 최적의 열처리 조건은 $400^{\circ}C$의 질소분위기에서 120초간 RTA처리를 하는 것으로 판단된다. 이 조건하에서 전해도금된 Cu막의 비저항(resistivity)과 표면 거칠기(surface roughness)는 각각 1.98$\mu$O-cm 및 17.77nm였다.

Technical Investigation into the In-situ Electron Backscatter Diffraction Analysis for the Recrystallization Study on Extra Low Carbon Steels

  • Kim, Ju-Heon;Kim, Dong-Ik;Kim, Jong Seok;Choi, Shi-Hoon;Yi, Kyung-Woo;Oh, Kyu Hwan
    • Applied Microscopy
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    • 제43권2호
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    • pp.88-97
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    • 2013
  • Technical investigation to figure out the problems arising during in-situ heating electron backscatter diffraction (EBSD) analysis inside scanning electron microscopy (SEM) was carried out. EBSD patterns were successfully acquired up to $830^{\circ}C$ without degradation of EBSD pattern quality in steels. Several technical problems such as image drift and surface microstructure pinning were taking place during in-situ experiments. Image drift problem was successfully prevented in constant current supplying mode. It was revealed that the surface pinning problem was resulted from the $TiO_2$ oxide particle formation during heating inside SEM chamber. Surface pinning phenomenon was fairly reduced by additional platinum and carbon multi-layer coating before in-situ heating experiment, furthermore was perfectly prevented by improvement of vacuum level of SEM chamber via leakage control. Plane view in-situ observation provides better understanding on the overall feature of recrystallization phenomena and cross sectional in-situ observation provides clearer understanding on the recrystallization mechanism.

Three-Dimensional Automated Crystal Orientation and Phase Mapping Analysis of Epitaxially Grown Thin Film Interfaces by Using Transmission Electron Microscopy

  • Kim, Chang-Yeon;Lee, Ji-Hyun;Yoo, Seung Jo;Lee, Seok-Hoon;Kim, Jin-Gyu
    • Applied Microscopy
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    • 제45권3호
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    • pp.183-188
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    • 2015
  • Due to the miniaturization of semiconductor devices, their crystal structure on the nanoscale must be analyzed. However, scanning electron microscope-electron backscatter diffraction (EBSD) has a limitation of resolution in nanoscale and high-resolution electron microscopy (HREM) can be used to analyze restrictive local structural information. In this study, three-dimensional (3D) automated crystal orientation and phase mapping using transmission electron microscopy (TEM) (3D TEM-EBSD) was used to identify the crystal structure relationship between an epitaxially grown CdS interfacial layer and a $Cu(In_xGa_{x-1})Se_2$ (CIGS) solar cell layer. The 3D TEM-EBSD technique clearly defined the crystal orientation and phase of the epitaxially grown layers, making it useful for establishing the growth mechanism of functional nano-materials.

High-Temperature Deformation Behavior of MnS in 1215MS Steel

  • Huang, Fei-Ya;Su, Yen-Hao Frank;Kuo, Jui-Chao
    • Metals and materials international
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    • 제24권6호
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    • pp.1333-1345
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    • 2018
  • The effect of manganese sulfide (MnS) inclusions on the machinability of free-cutting steel is based on their morphology, size and distribution. Furthermore, the plasticity of MnS is high during the hot working caused different characterization of MnS. In this study, the deformation behavior of MnS in 1215MS steel after a thermomechanical process was investigated at 1323 K. The microstructures of MnS inclusions were characterized by optical microscopy, scanning electron microscopy, energy-dispersive spectrometry, and electron backscattering diffraction (EBSD). As the thickness reduction of the inclusions increased from 10 to 70%, their average aspect ratio increased from 1.20 to 2.39. In addition, the deformability of MnS inclusions was lower than that of the matrix. The possible slip systems of A, B, C, and D plane traces were (${\bar{1}}0{\bar{1}}$)[${\bar{1}}01$], ($10{\bar{1}}$)[101], (011)[$01{\bar{1}}$], and (110)[$1{\bar{1}}0$]. Furthermore, the EBSD measurements suggested that slip planes in MnS inclusions occur on {110} planes.

단결정 AlN의 미세구조 분석 및 어닐링 공정이 결정성에 미치는 영향 (Microstructural analysis of the single crystalline AlN and the effect of the annealing on the crystalline quality)

  • 김정운;배시영;정성민;강승민;강성;김철진
    • 한국결정성장학회지
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    • 제28권4호
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    • pp.152-158
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    • 2018
  • PVT(Physical vapor transport)법은 고품질의 대면적 웨이퍼를 생산하기에 이점을 가져 질화물계 반도체의 상용화를 위해 많은 연구가 진행되고 있는 단결정 성장 방법이다. 하지만 복잡한 공정 변수들로 인하여 비평형적인 성장 조건을 갖게 될 경우 수많은 결함들이 발생하게 된다. 결정성장 후 어닐링 공정은 결정성 개선을 위해 널리 사용된다. 효과적인 결정성 개선을 위해서는 적절한 온도, 압력과 시간을 설정하는 게 중요하다. 본 연구에서는 PVT법으로 성장된 AlN 단결정 및 어닐링 조건에 따른 단결정의 결정 미세구조 변화를 X-ray topography, Electron Backscattered Diffraction(EBSD), Rietveld refinement를 통해 분석하였다. Synchrotron Whitebeam X-ray topography 분석 결과 어닐링을 진행하지 않은 단결정에 2차상 및 sub grain, impurity가 존재하였으며 이로 인해 결정성이 저하되는 것을 확인 할 수 있었다. EBSD 결과 어닐링을 진행한 시편의 경우 결정립수가 증가함과 동시에 basal plane의 뒤틀림이 일어나는 것을 관찰할 수 있었다. Rietveld refinement 결과 일부 격자들이 a, b, c축 방향으로 응력을 받아 변형된 것으로 분석되었다. 이는 어닐링 과정 중 hot zone 내의 상하 온도구배에 의해 발생한 응력으로 결정립 방향의 뒤틀림이 일어날 뿐만 아니라 격자 상수가 달라진 것으로 분석된다.