• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.215-216
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• 2011

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.978-982
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• 2004

We present high aspect ratio 100nm-scale nickel stamper using e-beam lithography process and Cr/Qz mask for the injection molding process of nano grating patterns. Conventional photolithography blank mask (CrON/Cr/Qz) consists of quartz substrate, Cr layer of UV protection and CrON of anti-reflection layer. We have used Cr/Qz blank mask without anti-reflection layer of CrON which is non-conductive material and ebeam lithography process in order to simplify the nickel electroplating process. In nickel electroplating process, we have used Cr layer of UV protection as seed layer of nickel electroplating. Fabrication conditions of photolithography mask using e-beam lithography are optimized with respect to CrON/Cr/Qz blank mask. In this paper, we have optimized e-beam lithography process using Cr/Qz blank mask and fabricated nickel stamper using Cr seed layer. CrON/Cr/Qz blank mask and Cr/Qz blank mask require optimal e-beam dosage of $10.0{\mu}C/cm^2$ and $8.5{\mu}C/cm^2$, respectively. Finally, we have fabricated $116nm{\pm}6nm-width$ and $240nm{\pm}20nm-height$ nickel grating stamper for the injection molding pattern.

• 한국지반환경공학회 논문집
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• 제13권7호
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• pp.49-54
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• 2012

본 연구에서는 전자빔(E-beam) 공정을 이용한 펜타클로로페놀(Pentachlorophenol, PCP)의 분해 특성을 조사하였다. 이를 위해 주어진 반응시간(0.6 s) 동안 생성될 수 있는 각종 반응성 화학종의 농도를 예측하였으며, PCP 분해에 미치는 pH와 과산화수소의 영향 및 이에 따른 G-value 등을 조사하였다. 실험결과, 전자빔공정에서 PCP의 분해는 pH의 영향을 받지 않았다. 1mM 이하의 과산화수소의 주입은 PCP 분해를 촉진시킬 수 있으나 그 이상의 과산화수소의 주입은 오히려 PCP의 분해를 감소시키거나 부산물의 형성을 유도할 것으로 관찰되었다. 특히, 옥살산과 미확인된 유기염소 성분의 농도를 증가시키는 것으로 나타났다. 그래서 전자빔공정에서 수산화라디칼의 발생원으로써 적절한 농도의 과산화수소 주입이 고려되어야 할 것으로 생각된다.

• 방사선산업학회지
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• 제5권1호
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• pp.41-46
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• 2011

Polyacrylonitrile (PAN) fibers are the most widely used precursor of the materials for carbon fibers. The conventional process of carbon fibers from PAN precursor fiber includes two step; stabilization at low temperature and carbonization at high temperature. Compared to thermal stabilization, the stabilization process by electron beam (E-beam) irradiation is a advanced and brief method. However, a stabilization by E-beam irradiation was required a high dose (over 5,000 kGy) and spend over 1.5 hr (1.14 MeV, 1 mA). In the present work the main goal is exploring a quick stabilization process by cotrolling E-beam currents. The effect of various E-beam currents on stabilization of PAN precursor fiber was studied by gel fraction test, thermo gravimertic analysis (TGA), differential scanning calorimetry (DSC), tensile strength, and scanning electron microscopy (SEM) images.

• 한국지반환경공학회 논문집
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• 제13권10호
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• pp.69-76
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• 2012

본 연구에서는 전자빔공정(Electron beam process, E-beam)에서 생성되는 수산화라디칼의 생성특성을 조사하였고, 이 공정에 첨가제로 과산화수소와 $Fe^{3+}-EDTA$을 이용한 펜타클로로페놀(Pentachlorophenol, PCP)의 분해 특성을 조사하였다. 이를 위해 수산화라디칼의 측정은 벤조산(Benzoic Acid, BA)에 의한 hydroxylation으로 생성된 hydroxybenzoic acid(OHBA)의 농도를 정량화하여 수행하였다. 실험결과, 실제 측정된 수산화라디칼의 농도는 예측된 수산화라디칼에 비해 낮은 농도로 나타났으며, 이것은 아마도 E-beam 에너지의 조사와 동시에 형성되는 다양한 반응성 화학종이 수산화라디칼을 스케빈져(scavening)할 것으로 생각되었다. 특히, 1mM 이하의 과산화수소 주입은 PCP 분해를 촉진시킬 수 있으나 그 이상의 과산화수소의 주입은 오히려 PCP의 분해를 감소시키거나 PCP의 부산물인 염소이온과 Carbon yield(%)를 증가시키는 요인으로 작용하였다. 반면에, $20{\mu}M$의 $Fe^{3+}-EDTA$ 첨가는 효과적으로 PCP를 제거하였고, 이에 따른 G-value도 증가한 것으로 나타났다. OHBA의 형성과 PCP의 분해를 고려하여 보면, 결과적으로 E-beam공정에 가하는 $Fe^{3+}-EDTA$의 첨가는 상대적으로 낮은 세기에서도 효과적으로 PCP를 처리할 수 있을 것으로 생각된다.

• 센서학회지
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• 제14권6호
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• pp.423-429
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• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• 방사선산업학회지
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• 제3권1호
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• pp.7-11
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• 2009

Hard magnet was usually used by coating $SiO_2$ ceramic thick films followed by the thermal annealing process. In this work, the alternative annealing process for NdFeB magnets using e-beam sources (1~2 MeV, 50~400 kGy) was investigated. NdFeB magnets was coated with ceramic thick films using the spray method. The optimal annealing parameter for e-beam source reveals to be 1 MeV and 300 kGy. The sample prepared at 1 MeV and 300 kGy was characterized by the analysis of the surface morphology, film hardness, adhesion and chemical stability. The mechanical property of thick film, especially film hardness, is better than that of thermal annealed samples at $180^{\circ}C$. As a result, e-beam annealing process will be one of candidate and attractive heat treatment process. In future, manufacturing process will be carried out in cooperation with the magnet company.

• 대한기계학회논문집A
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• 제28권11호
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• pp.1794-1798
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• 2004

We present a fabrication method of high aspect ratio 100nm-scale nickel stamper using e-beam writing for the injection molding of optical grating patterns. Conventional nickel stamper is fabricated by nickel electroplating process which is followed by seed layer deposition. In this paper, we have used chrome coated blank mask without anti-reflection layer of CrON in order to simplified electroplating process. In experimental study, we have optimized electron-beam dosage for 100nm-scale optical grating patterns with 2.5-aspect ratio, and fabricated nickel stamper using above grating patterns as PR mold. Fabricated nickel stamper have showed height of 240$\pm$20nm and width of 116$\pm$6nm.

• 폴리머
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• 제36권3호
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• pp.393-400
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• 2012

광전소자 유연기판으로 사용되는 폴리에테르설폰(PES) 필름 위에 E beam을 이용하여 저온 증착된 indium tin oxide(ITO) 박막 특성을 살펴보았다. 증착 시 기판 온도가 증가함에 따라 저온 열처리 과정에서 ITO 결정화가 잘 이루어져 면 저항의 감소와 투과도가 증가됨을 알 수 있었다. 증착 시 사용된 산소 가스는 ITO의 결정화를 촉진시켜 면 저항 감소와 투과도 증가에 도움을 줌을 확인하였다. PES 기판 표면 거칠기가 증가될수록 증착된 ITO의 결정화가 잘 이루어지지 않으며 이는 면 저항의 증가 및 투과도의 감소 요인으로 작용함을 알 수 있었다.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.