• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.215-216
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• 2011

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.978-982
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• 2004

We present high aspect ratio 100nm-scale nickel stamper using e-beam lithography process and Cr/Qz mask for the injection molding process of nano grating patterns. Conventional photolithography blank mask (CrON/Cr/Qz) consists of quartz substrate, Cr layer of UV protection and CrON of anti-reflection layer. We have used Cr/Qz blank mask without anti-reflection layer of CrON which is non-conductive material and ebeam lithography process in order to simplify the nickel electroplating process. In nickel electroplating process, we have used Cr layer of UV protection as seed layer of nickel electroplating. Fabrication conditions of photolithography mask using e-beam lithography are optimized with respect to CrON/Cr/Qz blank mask. In this paper, we have optimized e-beam lithography process using Cr/Qz blank mask and fabricated nickel stamper using Cr seed layer. CrON/Cr/Qz blank mask and Cr/Qz blank mask require optimal e-beam dosage of $10.0{\mu}C/cm^2$ and $8.5{\mu}C/cm^2$, respectively. Finally, we have fabricated $116nm{\pm}6nm-width$ and $240nm{\pm}20nm-height$ nickel grating stamper for the injection molding pattern.

• Journal of the Korean GEO-environmental Society
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• v.13 no.7
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• pp.49-54
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• 2012

This study focuses on the decomposition of pentachlorophenol(PCP) by an electron beam (E-beam) process. To attain this objective, we investigated the reactive species generated from E-beam process during irradiation (reaction time 0.6 s) and G-values of PCP decomposition and effects of pH and $H_2O_2$ as an additive. The effect of pH values was independent on the decomposition of PCP. However, during E-beam irradiation a scavenging effect of added $H_2O_2$ (> 1mM) for the decomposition of PCP was shown, which was supported by the decreased amounts of $Cl^-$ produced by the decomposition of PCP. Meanwhile, oxalic acid and unidentified organic chlorine compounds as by-products were increased by the addition of $H_2O_2$. Thus, in order to enhance the efficiency of PCP decomposition, the E-beam process has to consider a proper concentration of $H_2O_2$ as a well-known source of strong oxidant hydroxyl radical.

• Journal of Radiation Industry
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• v.5 no.1
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• pp.41-46
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• 2011

Polyacrylonitrile (PAN) fibers are the most widely used precursor of the materials for carbon fibers. The conventional process of carbon fibers from PAN precursor fiber includes two step; stabilization at low temperature and carbonization at high temperature. Compared to thermal stabilization, the stabilization process by electron beam (E-beam) irradiation is a advanced and brief method. However, a stabilization by E-beam irradiation was required a high dose (over 5,000 kGy) and spend over 1.5 hr (1.14 MeV, 1 mA). In the present work the main goal is exploring a quick stabilization process by cotrolling E-beam currents. The effect of various E-beam currents on stabilization of PAN precursor fiber was studied by gel fraction test, thermo gravimertic analysis (TGA), differential scanning calorimetry (DSC), tensile strength, and scanning electron microscopy (SEM) images.

• Journal of the Korean GEO-environmental Society
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• v.13 no.10
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• pp.69-76
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• 2012

This study focuses both on the quantitative measurement of hydroxyl radicals formed by an electron beam (E-beam) process and on the decomposition of pentachlorophenol(PCP) in the presence of $H_2O_2$ and $Fe^{3+}-EDTA$ as additives. To attain this objective, the quantitative measurement of hydroxyl radical was performed with the hydroylation of benzoic acid (BA), producing hydroxybenzoic acid (OHBA). As a result, the concentrations of hydroxyl radical measured were lower than those of hydroxyl radical predicted. Probably, it indicates that the reactive species generated during E-beam irradiation are able to scavenge the hydroxyl radicals. In particular, the degradation of PCP was promoted by the addition of $H_2O_2$ (< 1mM). On the other hand, its degradation as well as the generation of chloride ions as a by-product was inhibited by the addition of $H_2O_2$ (> 1mM), and thus carbon yield(%) of oxalic acid as a by-product was increased. During E-beam irradiation the addition of $Fe^{3+}-EDTA$ effectively decomposed the PCP, thus increasing the G-values. Considering the formation of OHBA and the decomposition of PCP, these results suggest that the addition of $Fe^{3+}-EDTA$ in the E-beam process can produce the further hydroxyl radicals and enhance the efficiency of PCP decomposition at low dose.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.423-429
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• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• Journal of Radiation Industry
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• v.3 no.1
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• pp.7-11
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• 2009

Hard magnet was usually used by coating $SiO_2$ ceramic thick films followed by the thermal annealing process. In this work, the alternative annealing process for NdFeB magnets using e-beam sources (1~2 MeV, 50~400 kGy) was investigated. NdFeB magnets was coated with ceramic thick films using the spray method. The optimal annealing parameter for e-beam source reveals to be 1 MeV and 300 kGy. The sample prepared at 1 MeV and 300 kGy was characterized by the analysis of the surface morphology, film hardness, adhesion and chemical stability. The mechanical property of thick film, especially film hardness, is better than that of thermal annealed samples at $180^{\circ}C$. As a result, e-beam annealing process will be one of candidate and attractive heat treatment process. In future, manufacturing process will be carried out in cooperation with the magnet company.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.11
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• pp.1794-1798
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• 2004

We present a fabrication method of high aspect ratio 100nm-scale nickel stamper using e-beam writing for the injection molding of optical grating patterns. Conventional nickel stamper is fabricated by nickel electroplating process which is followed by seed layer deposition. In this paper, we have used chrome coated blank mask without anti-reflection layer of CrON in order to simplified electroplating process. In experimental study, we have optimized electron-beam dosage for 100nm-scale optical grating patterns with 2.5-aspect ratio, and fabricated nickel stamper using above grating patterns as PR mold. Fabricated nickel stamper have showed height of 240$\pm$20nm and width of 116$\pm$6nm.

• Polymer(Korea)
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• v.36 no.3
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• pp.393-400
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• 2012

The characteristics of indium tin oxide (ITO) thin film deposited on polyethersulfone (PES) film by low temperature E beam has been studied for the flexible photovoltaic devices. It was found that the substrate temperature in the deposition process affected the crystallization behavior of ITO during the post low temperature annealing process. Higher substrate temperature resulted in the increase of crystallinity of annealed ITO. Consequently, the lowering of sheet resistivity and better transmittance were obtained. Crystallization of ITO during the annealing process was facilitated by using oxygen gas in the deposition process and resulted in the enhancement on sheet resistivity and transmittance of ITO. The surface roughness of PES film prohibited the crystallization of ITO during the annealing process and it caused the increase of sheet resistivity and the decrease of transmittance of ITO.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.