• 센서학회지
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• 제26권2호
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• pp.122-127
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• 2017

Graphene grown on copper-foil substrates by chemical vapor deposition (CVD) has been attracting interest for sensor applications due to an extraordinary high surface-to-volume ratio and capability of large-scale device fabrication. However, CVD graphene has a polycrystalline structure and a high density of grain boundaries degrading its electrical properties. Recently, processes such as electropolishing for flattening copper substrate has been applied before growth in order to increase the grain size of graphene. In this study, we systemically analyzed the effects of the process condition of electropolishing copper foil on the quality of CVD graphene. We observed that electropolishing process can reduce surface roughness of copper foil, increase the grain size of CVD graphene, and minimize the density of double-layered graphene regions. However, excessive process time can rather increase the copper foil surface roughness and degrade the quality of CVD graphene layers. This work shows that an optimized electropolishing process on copper substrates is critical to obtain high-quality and uniformity CVD graphene which is essential for practical sensor applications.

• 한국진공학회지
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• 제8권3B호
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• pp.322-326
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• 1999

We have investigated the growing process of a silicon film on the $CeO_2/Si$ surface. The silicon was deposited by using electron beam deposition method. The $CeO_2$(111) film was grown on a (111)-oriented silicon substrate at $700^{\circ}C$ at oxygen [partial pressure of $5\times10^{-5}$ Torr. To investigate the condition of epitaxial growth of si films on the $CeO_2/Si$ substrate, we deposited Si at various temperature니 The overlayer silicon was characterized by using x-ray diffraction(XRD). double crystal x-ray diffraction (DCXRD), and transmission electron microscopy (TEM). At temperature higher than $690^{\circ}C$, $CeO_2$ layer was observed at the $CeO_2/Si$ interface, which was formed by chemical reaction with silicon and oxygen dissociated from $CeO_2$. When silicon was deposited on the $CeO_2/Si$ at $620^{\circ}C$, silicon grew epitaxially along the (111)-direction.

• International Journal of Automotive Technology
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• 제8권6호
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• pp.667-674
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• 2007

Various types of NOx storage catalysts for NGV's were designed, manufactured, and tested in this work on a model gas test bench. As in most of other studies on NOx storage catalyst, alkaline earth metal barium(Ba) was used as the NOx adsorbing substance. The barium-based experimental catalysts were designed to contain different amounts of Ba and precious metals at various ratios. Reaction tests were performed to investigate the NOx storage capacity and the NOx conversion efficiency of the experimental catalysts. From the results, it was found that when Ba loading of a catalyst was increased, the quantity of NOx stored in the catalyst increased in the high temperature range over 350. With more Ba deposition, the NOx conversion efficiency as well as its peak value increased in the high temperature range, but decreased in the low temperature range. The best of de-NOx catalyst tested in this study was catalyst B, which was loaded with 42.8 g/L of Ba in addition to Pt, Pd and Rh in the ratio of 7:7:1. In the low temperature range under $450^{\circ}C$, the NOx conversion efficiencies of the catalysts were lower when $CH_4$, instead of either $C_3H_6$ or $C_3H_8$, was used as the reductant.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.229-229
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• 2010

We report a high crystalline nonpolar a-plane (11-20) GaN on r-plane (1-102) sapphire substrates with $+0.15^{\circ}$, $-0.15^{\circ}$, $+0.2^{\circ}$, $-0.2^{\circ}$ and $+0.4^{\circ}$ misoriented by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 5 periods the nonpolar a-plane InGaN/GaN (a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN layers with double crystal x-ray diffraction. The FWHM values of $+0.4^{\circ}$ misoriented sapphire substrate were decreased down to 426 arc sec for $0^{\circ}$ and 531 arc sec for $-90^{\circ}$, respectively. Also, the samples were characterized by photoluminescence (PL).

• 전자공학회논문지A
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• 제29A권9호
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• pp.36-45
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• 1992

The Modified Multi-Quantum Well(MMQWAl) structures have been grown by Mental-Organic chemical Vapor Deposition(MOCVD) method and stripe type MMQW laser diodes have been investigated. In the case of GaAs/AlGaAs superlattice and quantum well growth by MOCVD, the periodicity, interface abruptess, Al compositional uniformity and layer thickness have been confirmed though the shallow angle lapping technique, double crystal x-ray diffractometry (DCXD) and photoluminescence (PL) measurement. stripe-type MMQW laser diodes have been fabricated using the process technology of photolithography, chemical etching, ohmic contact, back side removing and cleaving. As the result of the electrical and opticalmeasurement of these laser diodes, we have achieved the series resistance of $1[\Omega}~2{\Omega}$ by current-voltage measurements, the threshold current of 200-300mA by currnt-light measurements and the lasing wavelength of 8000-8400$\AA$ by lasing spectrum measurements.

• Transactions on Electrical and Electronic Materials
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• 제1권4호
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• pp.11-15
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• 2000

This paper presents a process optimization of antireflection (AR) coating on crystalline Si solar cells. Theoretical and experimental investigations were performed on a double-layer AR(DLAR) coating of MgFe$_2$/GeO$_2$. We investigated GeO$_2$ films as an AR layer because they have a proper refractive index of 2.46 and demonstrate the same lattice constant as Si substrate. RF sputter grown GeO$_2$ film showed deposition temperature strong dependence. The GeO$_2$ at 400$\^{C}$ exhibited a strong (111) preferred orientation and the lowest surface roughness of 6.87 $\AA$. Refractive index of MgFe$_2$film was measured as 1.386 for the most of growth temperature. An optimized DLAR coating showed a reflectance as low as 2.04% in the wavelengths ranged from 0.4 ㎛ to 1.1 ㎛. Solar cells with a structure of MgFe$_2$/GeO$_2$/Ag/N$\^$+//p-type Si/P$\^$+//Al were investigated with the without DLAR coatings. We achieved the efficiency of solar cells greater than 15% with 3.12% improvement with DLAR coatings. Further details about MgFe$_2$,GeO$_2$ films, and cell fabrication parameters are presented in this paper.

• 한국진공학회지
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• 제20권4호
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• pp.288-293
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• 2011

본 논문은 InGaN/GaN 다중양자우물 구조를 가지는 녹색 발광다이오드의 활성층 내 인듐(In) 조성비와 piezoelectric field에 대한 전계 흡수 현상을 연구하였다. 활성층 내 결정학적 성질과 In 조성비는 double crystal X-ray diffraction 측정으로 분석하였으며, $1{\times}1\;mm^2$ 대면적 칩을 제작하여 발광특성을 조사하였다. 또한, 활성층 내 piezoelectric field는 electro-reflectance spectroscopy로부터 측정한 compensation voltage를 이용해 계산하였고, 인가전압에 따른 photocurrent의 변화를 측정함으로써 녹색 발광 소자의 전기 광학적 특성을 분석하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.80-81
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• 2012

Recently, one of the critical issues in the etching processes of the nanoscale devices is to achieve ultra-high aspect ratio contact (UHARC) profile without anomalous behaviors such as sidewall bowing, and twisting profile. To achieve this goal, the fluorocarbon plasmas with major advantage of the sidewall passivation have been used commonly with numerous additives to obtain the ideal etch profiles. However, they still suffer from formidable challenges such as tight limits of sidewall bowing and controlling the randomly distorted features in nanoscale etching profile. Furthermore, the absence of the available plasma simulation tools has made it difficult to develop revolutionary technologies to overcome these process limitations, including novel plasma chemistries, and plasma sources. As an effort to address these issues, we performed a fluorocarbon surface kinetic modeling based on the experimental plasma diagnostic data for silicon dioxide etching process under inductively coupled C4F6/Ar/O2 plasmas. For this work, the SiO2 etch rates were investigated with bulk plasma diagnostics tools such as Langmuir probe, cutoff probe and Quadruple Mass Spectrometer (QMS). The surface chemistries of the etched samples were measured by X-ray Photoelectron Spectrometer. To measure plasma parameters, the self-cleaned RF Langmuir probe was used for polymer deposition environment on the probe tip and double-checked by the cutoff probe which was known to be a precise plasma diagnostic tool for the electron density measurement. In addition, neutral and ion fluxes from bulk plasma were monitored with appearance methods using QMS signal. Based on these experimental data, we proposed a phenomenological, and realistic two-layer surface reaction model of SiO2 etch process under the overlying polymer passivation layer, considering material balance of deposition and etching through steady-state fluorocarbon layer. The predicted surface reaction modeling results showed good agreement with the experimental data. With the above studies of plasma surface reaction, we have developed a 3D topography simulator using the multi-layer level set algorithm and new memory saving technique, which is suitable in 3D UHARC etch simulation. Ballistic transports of neutral and ion species inside feature profile was considered by deterministic and Monte Carlo methods, respectively. In case of ultra-high aspect ratio contact hole etching, it is already well-known that the huge computational burden is required for realistic consideration of these ballistic transports. To address this issue, the related computational codes were efficiently parallelized for GPU (Graphic Processing Unit) computing, so that the total computation time could be improved more than few hundred times compared to the serial version. Finally, the 3D topography simulator was integrated with ballistic transport module and etch reaction model. Realistic etch-profile simulations with consideration of the sidewall polymer passivation layer were demonstrated.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.308-308
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• 2013

본 연구에 염료감응형 태양전지(Dye Sensitized Solar Cells; DSSCs)의 광전변환효율을 높이기 위해 작업전극에 새로운 구조의 광투과층 및 산란층을 도입하였다. DSSCs 작업전극의 빛을 투과시키는 투과층에 크기가 10 nm 이하의 nanoparticle $TiO_2$를 적용하고, 투과된 빛이 산란되어 많은 전자가 여기 될 수 있도록 기존의 큰 입자 사이즈였던 산란층을 이용하는 대신 $TiO_2$ nanorod 및 nanotube 형태의 구조를 도입하여 기존의 작업전극과 비교하였다. 산란층에서 방향성을 가지는 rutile 상의 $TiO_2$는 저온에서 안정적인 anatase 상의 $TiO_2$보다 화학적으로 안정하며, 높은 산란율을 가지고, 광에 의해 여기된 전자를 직접적으로 집전전극에 전달해 줌으로서 소자의 효율을 증가시킨다고 보고되고 있다. Rutile 상의 $TiO_2$ 층 제작 시 수열합성법을 이용하면 nanorod 모양의 $TiO_2$층을 형성할 수 있고, 이와 같은 방법으로 성장시킨 산란층에 전기영동법의 식각 효과를 사용하면 nanotube 모양의 $TiO_2$층을 성장시킬 수 있어 산란효과의 극대화 및 전극의 표면적을 넓히는 장점이 있다. 각각의 방법을 이용하여 만든 구조 위에 입자 크기 10 nm의 $TiO_2$를 Dr blade 방법으로 도포하여 double layer (산란층+흡수층)로 구성된 작업 전극을 이용한 DSSCs를 제작한 후 I-V curve와 EIS (Electrochemical Impedance Spectroscopy)를 측정하여 효율 및 전기화학적 특성을 분석하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.147-147
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• 2011

High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.