• Applied Microscopy
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• v.45 no.3
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• pp.170-176
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• 2015

In this work, various electron microscopy and analysis techniques were used to investigate the microstructural evolution of a 9% Cr tempered martensite ferritic (TMF) steel T91 upon ultrasonic nanocrystalline surface modification (UNSM) treatment. The micro-dimpled surface was analyzed by scanning electron microscopy. The characteristics of plastic deformation and gradient microstructure of the UNSM treated specimens were clearly revealed by crystal orientation mapping of electron backscatter diffraction (EBSD), with flexible use of the inverse pole figure, image quality, and grain boundary misorientation images. Transmission electron microscope (TEM) observation of the specimens at different depths showed the formation of dislocations, dense dislocation walls, subgrains, and grains in the lower, middle, upper, and top layers of the treated specimens. Refinement of the $M_{23}C_6$ precipitates was also observed, the size and the number density of which were found to decrease as depth from the top surface decreased. The complex microstructure and microstructural evolution of the TMF steel samples upon the UNSM treatment were well-characterized by combined use of EBSD and TEM techniques.

• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.267-272
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• 2000

Electroplating Cu was deposited on Si(100) wafer after seed Cu was deposited by sputtering first. TaN was deposited as a diffusion barrier before depositing the seed Cu. Electroplating Cu thin films show highly (111)-oriented microstructure for both before and after annealing at $450^{\circ}C$ for 30min and no copper silicide was detected in the same samples, which indicates that TaN barrier layer blocks well the Cu diffusion into silicon substrate. After annealing the electroplating Cu film up to $450^{\circ}C$, the Cu film became columnar from non-columnar, its grain size became larger about two times, and also defects density of stacking faults, twins and dislocations decreased greatly. Thus the heat treatment will improve significantly electromigration property caused by the grain boundary in the Cu thin films.

• Transactions of Materials Processing
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• v.29 no.6
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• pp.323-330
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• 2020

The surface region of a sheet metal may have different characteristics from the inner region because the surface region is less restricted than the interior. In addition, the grains on the free surface are less hardened because of surface adsorption of the dislocations, rather than piling up. In the case of bulk or thick sheet metals, this effect is negligible because the fraction of the surface region is much smaller than that of the inner region. However, this surface effect is important in the case of ultra-thin sheet metals. In order to evaluate the surface effect, tensile and bending tests were performed for the SS304 stainless steel with a thickness of 0.39 mm. The bending force predicted using the tensile behavior is higher than the measurement because of the surface effect. To account for the surface effect, the surface layer model was developed by dividing the sheet section into surface and inner layers. The mechanical behaviors of the two regions were calibrated using the tensile and bending properties. The surface layer model reproduced the bending behavior of the ultra-thin sheet metal.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.569-576
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• 1999

In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

• Korean Journal of Materials Research
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• v.18 no.1
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• pp.51-56
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• 2008

The crystal structures and morphologies of precipitates in $L1_0$-ordered TiAl intermetallics containing nitrogen were investigated by transmission electron microscopy (TEM). Under aging at an approximate temperature of 1073 K after quenching from 1423 K, TiAl hardens appreciably due to the nitride precipitation. TEM observations revealed that needle-like precipitates, which lie only in one direction parallel to the [001] axis of the $L1_0$-TiAl matrix, appear in the matrix preferentially at the dislocations. Selected area electron diffraction (SAED) pattern analyses showed that the needle-shaped precipitate is perovskite-type $Ti_3AlN$ (P-phase). The orientation relationship between the P-phase and the $L1_0$-TiAl matrix was found to be $(001)_P//(001)_{TiAl}\;and\;[010]_P//[010]_{TiAl}$. By aging at higher temperatures or for longer periods at 1073 K, plate-like precipitates of $Ti_2AlN$ (H-phase) with a hexagonal structure formed on the {111} planes of the $L1_0$-TiAl matrix. The orientation relationship between the $Ti_2AlN$ and the $L1_0$-TiAl matrix is $(0001)_H//(111)_{TiAl}\;and\;_H//_{TiAl}$.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.2
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• pp.118-128
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• 1994

Five alloys were selected randomly in the composition range showing the best shape memory effect in Fe-Mn-Si system reported by Murakami. The shape memory effects of those alloys were mainly investigated through the training treatment which consisted of the repetition of 2% tensile deformation at room temperature and subsequent annealing at $600^{\circ}C$ above $A_r$ temperature. At the same deformation degress in rolling $600^{\circ}C$-annealing for 1 hr. showed the best shape memory effect, and 10%-deformation degrees represented maxima of the shpae memory effects at all annealing temperatures, $500^{\circ}C$, $600^{\circ}C$ and $700^{\circ}C$. The shape memory effects of the alloys were increased by increasing training cycle up to 5 cycles. This was because a large number of dislocations introduced by training process gave rise to increase in the austenite yield stress, and acted as nucleation sites for stress induced ${\varepsilon}$ martensite. The thermal cycling treatment, repetition of cooling in nitrogen at $-196{\circ}C$ and heating to $300^{\circ}C$ for 5 min., did not improve the shape memory effect.

• Journal of the Korean Society for Heat Treatment
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• v.17 no.3
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• pp.139-145
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• 2004

Equal channel angular pressing (ECAP) technique had been adapted to the Mg alloy (AZ31) for achieving effective grain refinement through severe deformation. The average grain size of $2.5{\mu}m$ could be obtained after 4 passes. The stability of the ECAPed structure at elevated temperatures was examined by annealing the ECAPed materials over a wide range of temperature between 473 and 748 K. The average activation energy, Q, for static grain growth of 1, 2 and 3 passes was 33.7 kJ/mole (=0.25QL, activation for lattice diffusion). The abnormally low Q value in the lower temperature range may indicate that grain growth occurs in the unrecrystallized microstructure where non-equilibrium grain boundaries containing a large number of extrinsic dislocations exist. The yield stresses of the ECAPed alloys decreased whereas the elongations increased after the ECAP process. These results should be related to the modification of texture for easier slip on basal plane.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.516-523
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• 1994

The interfacial coherency of metal organic chemical vapor deposition grown InGaAsP/InP heterostructure wafers was examined and their influences on the optoelectronic properties were investigated in this study. (400) symmetric and (511) asymmetric reflections were employed to measure the lattice coherency. Existence of misfit dislocations was examined by x-ray topography and reverified by photoluminescence (PL) imaging. PI, measurements were performed, and higher PL intensity was obtained for elastically strained samples and lower intensity for plastically deformed samples. The highest PL intensity was obtained for the sample lattice matched at the growth temperature. PL full-width at half maximum (FWHM) was found to depend on the degree of lattice mismatch. A correlatior between x-ray FWHM and PL intensity was empirically established. The results presented demonstrate that the interfacial coherency is of primary significance in affecting the optoelectronic properties through elastic strain and plastic deformation.

• Advances in nano research
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• v.5 no.4
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• pp.303-311
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• 2017

The continuum elasticity model is applied to investigate quantitatively the growth features and nucleation mechanism of quantum dots, nanopits, and joint QDs-nanopits structures in GaInAlN quasyternary systems. We have shown that for GaInAlN material system at the critical strain of ${\varepsilon}^*=0.039$ the sign of critical energy and volume is changed. We assume that at ${\varepsilon}={\varepsilon}^*$ the mechanism of the nucleation is changed from the growth of quantum dots to the nucleation of nanopits. Obviously, at small misfit (${\varepsilon}$ < ${\varepsilon}^*$), the bulk nucleation mechanism dominates. However, at ${\varepsilon}$ > ${\varepsilon}^*$, when the energy barrier becomes negative as well as a larger misfit provides a low-barrier path for the formation of dislocations, the nucleation of pits becomes energetically preferable. The free energy of mixing for $Ga_{1-x-y}In_xAl_yN$ quasiternary system was calculated and studied and its 3D sketch was plotted.

• Nuclear Engineering and Technology
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• v.53 no.9
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• pp.2960-2967
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• 2021

In this work, a new hardening model is proposed for the depth-dependent hardness of ion-irradiated polycrystals with obvious grain size effect. Dominant hardening mechanisms are addressed in the model, including the contribution of dislocations, irradiation-induced defects and grain boundaries. Two versions of the hardening model are compared, including the linear and square superposition models. A succinct parameter calibration method is modified to parametrize the models based on experimentally obtained hardness vs. indentation depth curves. It is noticed that both models can well characterize the experimental data of unirradiated polycrystals; whereas, the square superposition model performs better for ion-irradiated materials, therefore, the square superposition model is recommended. In addition, the new model separates the grain size effect from the dislocation hardening contribution, which makes the physical meaning of fitted parameters more rational when compared with existing hardness analysis models.