• Proceedings of the PSK Conference
• /
• 2000.10a
• /
• pp.146.3-147
• /
• 2000

• 기계와재료
• /
• v.10 no.3 s.37
• /
• pp.130-140
• /
• 1998

• Proceedings of the IEEK Conference
• /
• 2002.07a
• /
• pp.184-187
• /
• 2002

Two-dimensional (2-D) X-ray computerized tomography (CT) equipments are widely used in industrial and medical fields, and nowadays studies on reconstruction algorithm for 3-D cone-beam acquisition systems are active for better utilization. The authors recent-By have proposed a fast reconstruction aigorithm using tree-structured filter bank for 2-D C1, and shown the algorithm is applicable to an approximate reconstruction of 3-D CT. For exact 3-D CT reconstruction, however, we have to backproject 1-D signal into 3-D space. This paper proposes a fast implementation method for this back-projection by use of tree-structured filter bank. and shows the proposed method works approximately 700 times faster than the direct one with almost same reconstruction image quality.

• Journal of Agricultural Extension & Community Development
• /
• v.27 no.3
• /
• pp.125-134
• /
• 2020

The regional centrality plays a very important role in national and regional planning and it is measured by data such as people, goods, and information flows among regions. The inter-regional flows are usually considered by only direct flows, yet indirect flows, which are generated accordingly from direct flows, are not critically considered. Most centrality studies have also hardly reflected the indirect flow in the network analysis. This study demonstrates the significance of the indirect flows to enhance accuracy of the regional centrality. The nationwide dataset of inter-regional commuter traffic matrix is used in this study and analysed into two groups; one to consider only direct flow and the other both direct and indirect flows. The results indicate remarkable differences of centrality raking between two groups such as Yeongam of Jeonnam Province(+60th), Eumseong of Chungbuk Province(+57th), Gwacheon of Gyeonggi Province (-35th), and Nowon of Seoul (-32nd). It clearly shows the significant influence of indirect flow for regional centrality study. This also reveals regional centrality ranking in Korea by considering direct and indirect flows of commuters. Jung, Gangnam, and Jongno of Seoul are categorized in the highest rank group and Ulleung of Gyeongbuk, Ongjin of Incheon, and Jindo of Jeonnam are in the lowest group. The top group includes seven districts of Seoul, two of Busan, and one of Gyeonggi Province. The bottom group includes mostly island and costal areas. As this study shows an accurate method of centrality measurement, it has a significant implication to lead an effective regional planning.

• Journal of the Korean Society of Propulsion Engineers
• /
• v.23 no.3
• /
• pp.76-87
• /
• 2019

A direct connected test was conducted for a supersonic combustor with a cavity-type flame holder. Liquid hydro-carbon fuel was injected in different types of injectors: inclined and aeroramp injectors, for the flow condition of Mach 4 at an altitude of 20 km. The static pressure on the combustor wall along the axis and the total pressure at the exit of combustor were measured to analyze the combustion characteristics at various fuel flow rates.

• Journal of Welding and Joining
• /
• v.30 no.3
• /
• pp.26-31
• /
• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.24 no.5 s.176
• /
• pp.1215-1230
• /
• 2000

Parallel Approaches using Cray T3E which is NIPP (Massively Parallel Processors) machine are presented for the efficient computation of the finite element analysis of 3-D shape rolling processes. D omain decomposition method coupled with parallel linear equation solver is used. Domain decomposition is applied for obtaining element tangent stifffiess matrices and residual vectors. Direct and iterative parallel algorithms are used for solving the linear equations. Direct algorithm is_parallel version of direct banded matrix solver. For iterative algorithms, the well-known preconditioned conjugate gradient solver with Jacobi preconditioner is also employed. Moreover a new effective iterative scheme with block inverse matrix preconditioner, which is named by present authors, is presented and its results are compared with the one using Jacobi preconditioner. PVM and MPI are used for message passing and synchronization between processors. The performance and efficiency of each algorithm is discussed and comparisons are made among different algorithms.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.7 no.3
• /
• pp.110-117
• /
• 1998

A continuum-based configuration design sensitivity analysis method is developed for kinematically driven mechanical systems. The configuration design variable for mechanical systems is defined. The 3-1-3 Euler angle is employed as the orientation design variable. Kinematic admissibility conditions of configuration design change. Direct differentiation method is used to derive the governing equations of the design sensitivity. Numerical examples are presented to demonstrate the validity and effectiveness of the proposed method.

• Proceedings of the KWS Conference
• /
• 2007.11a
• /
• pp.229-231
• /
• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• Proceedings of the Korea Society for Simulation Conference
• /
• 1999.10a
• /
• pp.202-209
• /
• 1999

한국전력공사 전력연구원 로봇 원격제어기술과 가상현실기술을 접목하는 과정의 일환으로 로봇작업을 3-D 그래픽으로 시뮬레이션하는 연구를 수행하였다. 본 논문에서는 로봇언어를 이용하여 이동경로를 생성하고 이동된 로봇의 위치와 자세정보를 그래픽변수와 연결하여 가시화하는 일련의 과정을 다룬다. 개발된 시뮬레이션 패키지는 실시간으로 로봇의 움직임을 관찰하는 목적 이외에 로봇작업경로의 생성과 로봇설계 등의 엔지니어링 목적으로도 활용할 수 있는 기능을 갖추고 있다. 이 시스템은 사용자의 편이성과 로봇의 신뢰성 및 가격적인 면 등을 고려하여 팬티엄-II급 산업용 PC와 Windows NT로 구성되어 있고, 그래픽 툴로는 Microsoft가 멀티미디어용으로 개발한 DirectX를 활용하였다. DirectX는 다양한 예제 프로그램을 포함하고 있는 Software Design Tool을 제공하므로 소프트웨어 개발시간을 단축시키는 장점을 가지고 있다.