Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2007.11a
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- Pages.229-231
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- 2007
Non-PR direct bumping for 3D wafer stacking
3차원 실장을 위한 Non-PR 직접범핑법
Abstract
Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.