• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.47-50
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• 2003

For large-scale systems which are composed of interconnections of many lower-dimensional subsystems, decentralized control is preferable since it can alleviate the computational burden, avoid communication between different subsystems, and make the control more feasible and simpler. A power system is such a large-scale system where generators are interconnected through transmission lines. Decentralized control is therefore considered for power systems. In this paper, a robust decentralized excitation control scheme for interactions is proposed to enhance the transient stability of multimachine power systems. First we employ a DFL(Direct Feedback Linearization) compensator to rancel most of the nonlinearities; however, the resulting model still contains nonlinear interconnections. Therefore, we design a robust controller in order to deal with Interconnection terms. In this procedure, an upper bound of interconnection terms is estimated by an estimator. The resulting adaptive scheme guarantees the uniform ultimate boundedness of the closed-loop dynamic systems in the presence of the uncertainties.

• ETRI Journal
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• v.10 no.2
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• pp.13-19
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• 1988

This paper describes on the interworking services. interworking issues and the design concepts in the Interworking System (IWS) between Pubilc Switched Telephone Network (PSTN) and Packet Switched Data Network (PSDN), which has been developed at the Electronics and Tedecommunications Research Institute (ETRI). As a gateway between PSTN and PSDN, IWS provides the interconnection between PSTN and PSDN. In addition to the provision of basic interconnection services (i.e. dial-in/dial-out services), IWS provides the Maintenance and Administration (M&A) services for system itself and the supplementary services such as the call barring, direct call and closed user group. The architecture of IWS is based on the multiprocessor system with single system bus. And a multiprocessor real time kernel is used to support the inter-board communication as well as the inter-process commmunications. Especially, the operation and maintenance functions of IWS are treated in detail.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• Journal of the korean Society of Automotive Engineers
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• v.15 no.1
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• pp.89-99
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• 1993

In this research, important mechanical characteristics of Compliant Press-Fit Pin and PHT are studied through the analysis of deformation mechanisms of Press-Fit Pin and by elastic-plastic finite element method. The direct data for the optimal design of pin was obtained without interfere with the criterion on insertion force and retention force. Also, the insertion force and retention force of new type pin were measured by precision type tensile testing machine and it revealed good agreement with analytical results. In conclusion, it is believed that above results will contribute satisfactorily to the practical design of Press-Fit Pin.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.29 no.2
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• pp.47-53
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• 2015

The study concerning about the grid connection of the large-capacity energy storage system(ESS) is increasing. However, the transient study such as lightning or switching surge necessarily occurred at power system with ESS has been hardly performed. Therefore, this paper performs the analysis of lightning surge in distribution system with ESS using electromagnetic transient program(EMTP). The battery model in Matlab/Simulink is modeled by EMTP, which is the specialized software for power system transient study. Also, the bi-directional power electronics for interconnection of the battery and distribution system are modeled by EMTP. When the lightning is occurred at interconnection point of ESS, this paper simulates the existence of ESS and operation conditions of ESS and analyzes the surge in distribution system and ESS according to the various conditions.

• East Asian Journal of Business Economics (EAJBE)
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• v.2 no.3
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• pp.33-42
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• 2014

The main purpose of this study intends to study the theoretical interconnection between human response capability and customer relationship management advantage while considering the essential role of service application of information technology as direct, indirect (mediating), and interactive (moderating) influences in the theory. Based on the study sample, the new findings help comprehend the overall interconnected relationship which includes the direct and indirect (mediating) effects of information technology service capability and human response capability as well as their interaction (moderation) on customer relationship management advantage. The new insights interprets the two capabilities (human and information technology) are vital to business because they are the foundation set of service resources significantly to enhance customer relationship management advantage.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.16-16
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• 2014

본 논문에서는 polymer 기판 위에 direct inkjet patterning을 효율적으로 수행하기 위하여 기판 표면의 chemical bonding과 morphology를 in-line system 적용이 가능한 near atmospheric pressure plasma (N-APP)를 이용 하여 기판을 modifying 시켰다. modified substrate 위에 inkjet printing을 이용하여 metal interconnection을 하였다. 그 결과 기존 기판에서의 line width 보다 얇은 선폭을 획득 하였고 adhesion이 향상 되었다.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.10
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• pp.981-985
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• 2007

We present a MEMS-based portable Direct Methanol Fuel Cell (micro-DFMC), featured by a platinum sputtered microcolumn electrode and a built-in fuel chamber containing a limited amount of methanol fuel. Also presented is a micro-DMFC stack structure having a common electrolyte sandwiched by the microcolumn electrodes. The single cells with ME16 and PE16 electrodes show the maximum power densities of $31.04{\pm}0.29{\mu}W/cm^2$ and $9.75{\pm}0.29{\mu}W/cm^2$, respectively; thus indicating the microcolumn electrode (ME16) generates the power density (3.2 times) higher than the planar electrode (PE16). The single cell tests of ME16 and ME4 electrodes (Fig.8) show the maximum power of $31.04{\pm}0.29{\mu}W/cm^2$, and $25.23{\pm}2.7{\mu}W/cm^2$, respectively; thus demonstrating the increased window frame reduces the normalized standard power deviation (standard deviation over the average power). The normalized deviation of 0.11 in ME4 cell has been reduced to 0.01 in ME16 cell due to the increased window frames. The maximum power density of 4-cell stack is 15.7 times higher than that of the single cell. 4-cell stack produces the power capacity of 20.3mWh/g during 980min operation at the voltage of 450mV with the load resistance of $800{\Omega}$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.7
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• pp.64-72
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• 1992

The capacitance for three-dimensional (3D) VLSI interconnection line is calculated. Capacitance is obtained by solving integral equation that is the product of Green's function and surface charge density. Surface charge density is assumed that constant in each subarea, and subarea is devided by rectangular size in interconnetion surfaces. Up to date, so this integral method using Green's function is calculated by Fourier integral transformation, that it cannot help making an error. In this paper, it is proposed to use direct integration instead of Fourier integral method. And we proved accuracy of this paper in comparision with conventional results.