• Journal of the Korean Society of Visualization
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• v.9 no.2
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• pp.34-39
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• 2011

This paper presents a novel direct fabrication method of the thin metal film RTD temperature sensor array on an arbitrary curved surface by using MEMS technology to measure a distributed temperature field up to $300^{\circ}C$ without disturbing a fluid flow. In order to overcome the difficulty in the three dimensional photography of sensor patterning, the UV pre-irradiated photosensitive dry film resist technology has been developed newly. This method was applied to the fabrication of the temperature sensor array on a glass tube, which is arranged parallel and transverse to a main flow. Gold was used as a temperature sensing material. The resistance change was measured in a thermally controlled oven by increasing the environmental temperature. The linear increase in resistance change and a constant slope were obtained. Also, the sensitivity of each RTD temperature sensor was evaluated.

• Journal of Electrical Engineering and Technology
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• v.7 no.3
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• pp.396-400
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• 2012

Novel fabrication method of nanobridge array of various materials was proposed using suspended silicon nanowire array as a sacrificial template structure. Nanobridges of various materials can be simply fabricated by direct deposition with thermal evaporation on the top of prefabricated suspended silicon nanobridge arrays, which are used as a sacrificial structure. Since silicon nanowire can be easily removed by selective dry etching, nanobridge arrays of an intended material are finally obtained. In this paper, metal nanobridges of Ti/Au, around 50-200 nm in thickness and width, 5-20 ${\mu}m$ in length were fabricated to prove the advantages of the proposed nanowire or nanobridge fabrication method. The nanobridges of Ti/Au after complete removal of sacrificial silicon nanowire template were well-established and bending of nanobridge caused by the tensile stress was observed after silicon removing. Up to 50 nm and 10 ${\mu}m$ of silicon nanowire in diameter and length respectively was also very useful for nanowire templates.

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.98-99
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• 2007

This study has successfully demonstrated the direct fabrication of polymer resistors using ink-jet printing technology as an alternative patterning to traditional photolithography. The polymer resistors were fabricated just by two layer processes using a ink-jet printer (DMP-2800, Fujifilm Dimatix). First, resistive materials was patterned by a ink-jet printing with the desired width and length. Next, resistor fabrication was completed by printing metal contact pads on the both sides of the polymer resistor. We used poly (3,4-ethylene dioxythiophene) poly(styrenesulfonate)(PEDOT:PSS) for the resistor material and a nano-sized silver colloid for the metal contact pads. We characterized the electrical properties of PEDOT:PSS by measuring sheet resistance and specific resistance on a glass substrate. From analysis of the measured resistances, the electrical resistances of the polymer resistors linearly increased as a function of printed width and length of resistors. The accuracy of the fabricated polymer resistor showed about $0.6{\sim}2.5%$ error for the same dimensions.

• Transactions of Materials Processing
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• v.16 no.7
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• pp.549-554
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• 2007

The objective of this paper is to investigate into the fabrication technology of cores for the injection mould with three-dimensional conformal cooling channels to reduce the cooling time. The location of the conformal cooling channels has been determined through the injection molding analysis. The mould has been manufactured from a hybrid rapid tooling technology, which is combined a direct metal rapid tooling with a machining process. Several injection molding experiments have been performed to examine the productivity and the validity of the designed mould. From the results of the experiments, it has been shown that the proposed mould can mold a final product within a cooling time of 3 seconds and a cycle time of 21 seconds, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.741-744
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• 2001

This paper described on the fabrication of microstructures by DRIE(Deep Reactive Ion Etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -760 mm Hg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing(1000$^{\circ}C$, 60 min.), the SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated microstructures by DRIE as well as a accurate thickness control and a good flatness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.739-742
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• 2002

This paper described on the fabrication of microstructures by DRIE(deep reactive ion etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing($1000^{\circ}C$, 60 min.), The SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated microstructures by DRIE as well as an accurate thickness control and a good flatness.

• Journal of Welding and Joining
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• v.33 no.6
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• pp.1-5
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• 2015

Additive Manufacturing defines the fabrication of objects by successive consolidation of materials, layer by layer, according to a three-dimensional design. The numerous technologies available today were recently standardized into seven categories based on the general method. Each technology has its own set of advantages and limitations. Though it very much depends on the field of application, major assets of additive manufacturing compared to conventional processing routes are the ability to readily offer complexity (in terms of intricate shape and customization) and significant reduction of waste. On the other hand, additive manufacturing often suffers of relatively low production rates. Anyhow, additive manufacturing technologies is being given outstanding attention. In particular, metal additive manufacturing emerges as of great significance in industries like aerospace, automotive and tooling. The trend progresses toward full production of high value finished products.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.237-240
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• 2004

In this study, we have developed a new $UV(\lambda=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. Also, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.644-647
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• 2003

Resulting from reproducibility and possibility of mass production. many researches to fabricate micro lens array using lithography have been developed. However, it still remains the level of fabricating compensation lens. Therefore, to realize the fabrication of lens having high numerical aperture can be the key technology of ultra slim optical system. Reflow phenomenon have been researched to make lens having high refractive power. And through those researches, the possibility to fabrication of high refractive power lens has been investigated. In this paper, we analyze the effect of many parameters in reflow process to get an aspheric shape with high repeatability. And we make possible to estimate shape error, through we give direct information about decrease in volume of photoresist.