• Title/Summary/Keyword: Dimensional Control

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Implementation of LabVIEW®-based Joint-Linear Motion Blending on a Lab-manufactured 6-Axis Articulated Robot (RS2) (LabVIEW® 기반 6축 수직 다관절 로봇(RS2)의 이종 모션 블랜딩 연구)

  • Lee, D.S.;Chung, W.J.;Jang, J.H.;Kim, M.S.
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.2
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    • pp.318-323
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    • 2013
  • For fast and accurate motion of 6-axis articulated robot, more noble motion control strategy is needed. In general, the movement strategy of industrial robots can be divided into two kinds, PTP (Point to Point) and CP (Continuous Path). Recently, industrial robots which should be co-worked with machine tools are increasingly needed for performing various jobs, as well as simple handling or welding. Therefore, in order to cope with high-speed handling of the cooperation of industrial robots with machine tools or other devices, CP should be implemented so as to reduce vibration and noise, as well as decreasing operation time. This paper will realize CP motion (especially joint-linear) blending in 3-dimensional space for a 6-axis articulated (lab-manufactured) robot (called as "RS2") by using LabVIEW$^{(R)}$ (6) programming, based on a parametric interpolation. Another small contribution of this paper is the proposal of motion blending simulation technique based on Recurdyn$^{(R)}$ V7 and Solidworks$^{(R)}$, in order to figure out whether the joint-linear blending motion can generate the stable motion of robot in the sense of velocity magnitude at the end-effector of robot or not. In order to evaluate the performance of joint-linear motion blending, simple PTP (i.e., linear-linear) is also physically implemented on RS2. The implementation results of joint-linear motion blending and PTP are compared in terms of vibration magnitude and travel time by using the vibration testing equipment of Medallion of Zonic$^{(R)}$. It can be confirmed verified that the vibration peak of joint-linear motion blending has been reduced to 1/10, compared to that of PTP.

Effects of Uncertainty in Graupel Terminal Velocity on Cloud Simulation (싸락눈 종단 속도의 불확실성이 구름 모의에 미치는 영향)

  • Lee, Hyunho;Baik, Jong-Jin
    • Atmosphere
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    • v.26 no.3
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    • pp.435-444
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    • 2016
  • In spite of considerable progress in the recent decades, there still remain large uncertainties in numerical cloud models. In this study, effects of uncertainty in terminal velocity of graupel on cloud simulation are investigated. For this, a two-dimensional bin microphysics cloud model is employed, and deep convective clouds are simulated under idealized environmental conditions. In the sensitivity experiments, the terminal velocity of graupel is changed to twice and half the velocity in the control experiment. In the experiment with fast graupel terminal velocity, a large amount of graupel mass is present in the lower layer. On the other hand, in the experiment with slow graupel terminal velocity, almost all graupel mass remains in the upper layer. The graupel size distribution exhibits that as graupel terminal velocity increases, in the lower layer, the number of graupel particles increases and the peak radius in the graupel mass size distribution decreases. In the experiment with fast graupel terminal velocity, the vertical velocity is decreased mainly due to a decrease in riming that leads to a decrease in latent heat release and an increase in evaporative cooling via evaporation, sublimation, and melting that leads to more stable atmosphere. This decrease in vertical velocity causes graupel particles to fall toward the ground easier. By the changes in graupel terminal velocity, the accumulated surface precipitation amount differs up to about two times. This study reveals that the terminal velocity of graupel should be estimated more accurately than it is now.

Double Side SMT and Molding Process Development for mPossum Package

  • Kim, ByongJin;Cho, EunNaRa;Kim, ChoongHoe;Lee, YoungWoo;Lee, JaeUng;Ryu, DongSu;Jung, GyuIck;Kang, DaeByoung;Khim, JinYoung;Yoon, JuHoon;Kim, Sun-Joong
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.43-48
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    • 2016
  • 3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

Kinematic Analysis of the Quadruped Robot Using Computer Graphics (컴퓨터 그래픽스를 이용한 사각보행로보트의 기구적 해석)

  • Choi, Byoung-Wook;Lim, Joon-Hong;Chung, Myung-Jin;Bien, Zeung-Nam
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.25 no.10
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    • pp.1173-1182
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    • 1988
  • The stability, energetic efficiency and walking volume are affected by the geometric structure of legs of a walking robot. A quadruped walking robot is considered to have large stability margin among the walking robots and pantograph leg permits large walk stroke and mutually independent vertical and horizontal movements, but the kinematic characteristics are difficult to analyze. Graphical method may be useful to characterize three dimensional legged motion of the pantograph mechanism. We present the modelling method for three different quadruped robots with pantograph legs that have different joints mechanism. The modeled robots are animated by a path that is planned with respect to the center of body. In particular, graphical animation incorporates leg control to rotation and side walking and uses the window of Sun-3 system for displaying joint information.

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Design and Fabrication of a Processing Element for 2-D Systolic FFT Array (고속 퓨리어변환용 2차원 시스토릭 어레이를 위한 처리요소의 설계 및 제작)

  • Lee, Moon-Key;Shin, Kyung-Wook;Choi, Byeong-Yoon;,
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.3
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    • pp.108-115
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    • 1990
  • This paper describes the design and fabrication of a processing element that will be used as a component in the construction of a two dimensional systolic for FFT. The chip performs data shuffling and radix-2 decimation-in-time (DIT) butterfly arithmetic. It consists of a data routing unit, internal control logic and HBA unit which computes butterfly arithmetic. The 6.5K transistors processing element designed with standard cells has been fabricated with a 2u'm double metal CMOS process, and evaluated by wafer probing measurements. The measured characteristics show that a HBA can be computed in 0.5 usec with a 20MHz clok, and it is estimated that the FFT of length 1024 can be transformed in 11.2 usec.

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Image Compression System Implementation Based on DWT (DWT 기반 영상압축 시스템 구현)

  • 서영호;최순영;김동욱
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.40 no.5
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    • pp.332-346
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    • 2003
  • In this paper, a system which can compress and reconstruct the digital image was implemented using 2 dimensional DWT(Discrete Wavelet Transform). The proposed system consists of the FPGA board tocompress the image and the application software(S/W) to reconstruct it. First the FPGA receives the image from AID converter and compresses the image using wavelet transform. The compressed data is transferred into the PC using the PCI interface. The compressed image is reconstructed by an application S/W inside the PC. The image compressor can compress about 60 fields per second, in which the image format was NTSC YCbCr(4:2:2) and the image size was 640${\times}$240 pixels per field. The designed hardware mapped into one FPGA occupying 11,120 LAB (Logic Array Block) and 27,456 ESB(Embedded System Block) in APEX20KC EP20K1000B652-7. It globally uses 33MHz clock and the memory control part uses 100MHz.

DRAM Package Substrate Using Via Cutting Structure (비아 절단 구조를 사용한 DRAM 패키지 기판)

  • Kim, Moon-Jung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.7
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    • pp.76-81
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    • 2011
  • A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.

Improvement of Connector Performance Using Analysis of Characteristic Impedance (특성임피던스 분석을 사용한 커넥터 성능향상)

  • Yang, Jeong-Kyu;Kim, Moon-Jung
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.48 no.9
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    • pp.47-53
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    • 2011
  • The signal transmission properties of the connector such as insertion loss and return loss are investigated using analysis procedure of S-parameter simulation, equivalent model extraction, and characteristic impedance calculation. S-parameter simulation is performed by connector's modeling and solving based on 3-dimensional finite element method. The connector's equivalent model of ${\pi}$ type is are proposed and extracted with an optimization process of circuit analysis simulator. The characteristic impedance of the connector is calculated with results of circuit analysis simulation and S-parameter data. According to the connector's characteristic impedance, it's revised design is carried out. In this work, the connector's effective contact area is increased and its body is applied as a high dielectric material in order to increase its capacitance and then obtain impedance matching. Therefore, return loss of the connector is improved by approximately 10 dB due to its design revision.

Stability of PS Opals in Supercritical Carbon Dioxide and Synthesis of Silica Inverse Opals

  • Yu, Hye-Min;Kim, Ah-Ram;Moon, Jun-Hyuk;Lim, Jong-Sung;Choi, Kyu-Yong
    • Bulletin of the Korean Chemical Society
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    • v.32 no.7
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    • pp.2178-2182
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    • 2011
  • Recently, the synthesis of ordered macroporous materials has received much attention due to its potential use as photonic band gap materials.$^1$ In this study, we have used the three-dimensional (3D) latex array template impregnated with benzenesulfonic acid (BSA), which is capable of catalyzing the reaction using tetraethyl orthosilicate (TEOS) as a precursor and distilled water. The polystyrene (PS) templates were reacted with TEOS in $scCO_2$ at 40 $^{\circ}C$ and at 80 bar. In the reactor, TEOS was filtrated into the PS particle lattice. After the reaction, porous silica materials were obtained by calcinations of the template. The stability test of the PS template in pure $CO_2$ was conducted before the main experiment. Scanning electron microscopy (SEM) images showed that the reaction in $scCO_2$ takes place only on the particle surface. This new method using $scCO_2$ has advantages over conventional sol-gel processes in its capability to control the fluid properties such as viscosity and interfacial tension. It has been found that the reaction in $scCO_2$ occurs only on the particle surface, making the proposed technique as more rapid and sustainable method of synthesizing inverse opal materials than conventional coating processes in the liquid phase and in the vapor phase.

Self-organization Scheme of WSNs with Mobile Sensors and Mobile Multiple Sinks for Big Data Computing

  • Shin, Ahreum;Ryoo, Intae;Kim, Seokhoon
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.14 no.3
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    • pp.943-961
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    • 2020
  • With the advent of IoT technology and Big Data computing, the importance of WSNs (Wireless Sensor Networks) has been on the rise. For energy-efficient and collection-efficient delivery of any sensed data, lots of novel wireless medium access control (MAC) protocols have been proposed and these MAC schemes are the basis of many IoT systems that leads the upcoming fourth industrial revolution. WSNs play a very important role in collecting Big Data from various IoT sensors. Also, due to the limited amount of battery driving the sensors, energy-saving MAC technologies have been recently studied. In addition, as new IoT technologies for Big Data computing emerge to meet different needs, both sensors and sinks need to be mobile. To guarantee stability of WSNs with dynamic topologies as well as frequent physical changes, the existing MAC schemes must be tuned for better adapting to the new WSN environment which includes energy-efficiency and collection-efficiency of sensors, coverage of WSNs and data collecting methods of sinks. To address these issues, in this paper, a self-organization scheme for mobile sensor networks with mobile multiple sinks has been proposed and verified to adapt both mobile sensors and multiple sinks to 3-dimensional group management MAC protocol. Performance evaluations show that the proposed scheme outperforms the previous schemes in terms of the various usage cases. Therefore, the proposed self-organization scheme might be adaptable for various computing and networking environments with big data.