• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.6
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• pp.539-546
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• 2014

This paper describes an ultra-precision electronic clinometer, which is based on the capacitive-based fluid type, for detection of small inclination angles. The main parts of the clinometer low-noise electronics are two capacitance measurement circuits for converting the capacitances of the capacitors of the clinometer into voltages, and a differential amplifier for obtaining the difference of the capacitances, which is proportional to the input inclination angle. A 16 bit analog to digital (AD) converter is also embedded into the same circuit board, whose output is sent to a PC via RS-232C, for achieving a small noise level down to tens of ${\mu}v$. A compensation method, which is referred to as the delay time method for shortening the stabilization time of the sensor was also discussed. Experimental results have shown the possibility of achieving a measurement resolution of $0.0001^{\circ}$ as well as the quick measurement with the delay time method.

• Current Optics and Photonics
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• v.1 no.2
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• pp.90-94
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• 2017

Visible light identification (VLID) is a user identification system for a door lock application using smartphone that adopts visible light communication (VLC) technology with the objective of high security, small form factor, and cost effectiveness. The user is verified by the identification application program of a smartphone via fingerprint recognition or password entry. If the authentication succeeds, the corresponding encoded visible light signals are transmitted by a light emitting diode (LED) camera flash. Then, only a small size and low cost photodiode as an outdoor interface converts the light signal to the digital data along with a comparator, and runs the authentication process, and releases the lock. VLID can utilize powerful state-of-the-art hardware and software of smartphones. Furthermore, the door lock system is allowed to be easily upgraded with advanced technologies without its modification and replacement. It can be upgraded by just update the software of smartphone application or replacing the smartphone with the latest one. Additionally, wireless connection between a smartphone and a smart home hub is established automatically via Bluetooth for updating the password and controlling the home devices. In this paper, we demonstrate a prototype VLID door lock system that is built up with LEGO blocks, a photodiode, a comparator circuit, Bluetooth module, and FPGA board.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.411-414
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• 2008

The study is about simulation of optical circuit for oneself performance evaluation of Fiber Optic Gyro(FOG) closed-loop controller board. The Fiber Optic Interferometer Simulator is used a digital signal processing for cosine response specificity output of fiber optic coil about input rate. Response specificity of the fiber optic coil is $Vo(t)=K3[1+\cos\{K1(Vm(t)-Vm(t-{\tau}))+K2\}]$. Also the Fiber Optic Interferometer Simulator is able to confirm a output value with K1, K2 and K3 input. The fiber Optic Interferometer Simulator is able to oneself performance evaluation without fiber optical circuit. Because, it is the very same cosine response specificity of real fiber optic coil about input rate.

• Transactions on Electrical and Electronic Materials
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• v.17 no.5
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• pp.280-288
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• 2016

Microelectronic product consumers may already be expecting another paradigm shift with smarter phones over smart phones, but the current status of microelectronic manufacturing engineering education (MMEE) in universities hardly makes up the pace for such a fast moving technology paradigm shift. The purpose of MMEE is to educate four-year university graduates to work in the microelectronics industry with up-to-date knowledge and self-motivation. In this paper, we present a comprehensive curriculum for a four-year university degree program in the area of microelectronics manufacturing. Three hands-on experienced-based courses are proposed, along with a methodology for undergraduate students to acquire hands-on experience, towards integrated circuits (ICs) design, fabrication and packaging, are presented in consideration of manufacturing engineering education. Semiconductor device and circuit design course for junior level is designed to cover how designed circuits progress to micro-fabrication by practicing full customization of the layout of digital circuits. Hands-on experienced-based semiconductor fabrication courses are composed to enhance students’ motivation to participate in self-motivated semiconductor fab activities by performing a series of collaborations. Finally, the Microelectronics Packaging course provides greater possibilities of mastered skillsets in the area of microelectronics manufacturing with the fabrication of printed circuit boards (PCBs) and board level assembly for microprocessor applications. The evaluation of the presented comprehensive curriculum was performed with a students’ survey. All the students responded with “Strongly Agree” or “Agree” for the manufacturing related courses. Through the development and application of the presented curriculum for the past six years, we are convinced that students’ confidence in obtaining their desired jobs or choosing higher degrees in the area of microelectronics manufacturing was increased. We confirmed that the hypothesis on the inclusion of handson experience-based courses for MMEE is beneficial to enhancing the motivation for learning.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.827-830
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• 2011

In this paper, a wind speed & direction module and the DSP(Digital Signal Processor) sensor interface circuit board are proposed. This DSP system accepts and process the informations from a wind speed & direction module, the atmospheric pressure sensor, the ambient air temperature sensor and transfers it to the PC monitering system. Especially, a wind speed & direction module and a DSP hardware are directly designed and applied. A wind speed & direction module have a construction that it have four film type RTD(Resistive Temperature Detectors) or film type Piezo sensors adhered around the circular metal body for obtaining vector informations about wind. By this structure, the module is enabled precise measurement having a robustness about vibration, humidity, corrosion. A sensor signal processing circuit is using TMS320F2812 TI(Texas Instrument) Corporation high speed DSP.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.6
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• pp.478-486
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• 2017

In this paper, we propose an algorithm for the wideband beamforming in a conformal phased array antenna by compensating the errors. For the wideband beamforming, we used the True Time Delay(TTD), which was fabricated on the RF circuit board to obtain long delay lines. Beamforming errors in the conformal array antenna are the mutual coupling between the array elements, the dispersive error in the TTD circuit, and the quantization error by the digital control. We apply the compensation algorithm to the conformal phased array antenna of wideband 2~4 GHz, and verify the usefulness by comparing the results with the experiment results.

• ETRI Journal
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• v.38 no.5
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• pp.981-987
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• 2016

We present a cost-effective dual polarization quadrature phase-shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two $90^{\circ}$ optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of $2%-{\Delta}$. Two four-channel spot-size converter integrated waveguide-photodetector (PD) arrays are bonded on PD carriers for transverse-electric/transverse-magnetic polarization, and butt-coupled to a polished facet of the PLC using a simple chip-to-chip bonding method. Instead of a ceramic sub-mount, a low-cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans-impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3-dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of $8.3{\times}10^{-11}$ is achieved at a 112-Gbps back-to-back transmission with off-line digital signal processing.

• Journal of Advanced Navigation Technology
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• v.18 no.6
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• pp.541-545
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• 2014

Rec. ITU-R M.1842-1 is international recommendation for VHF band communication guideline in maritime mobile service RR Appendix 18 channels. In this paper, we simulate 28.8 kbps VHF ${\pi}$/4-DQPSK digital baseband modem compatible with the recommendation, then it is designed and implemented with FPGA. Cazac sequence is used as a preamble since packet format is not defined untill now in the recommendation. Baseband modem is designed by VHDL language and implemented on NEXYS4 development platform having Atrix7 FPGA chip from Xilinx. For wireless communication test of total prototype system, ADC/DAC board is implemented and EV9730 RF module is utilized. From the experimental results, implemented FPGA modem shows spectral bandwidth of 25 kHz and successful data exchanges between tx and rx communication platform.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• The Transactions of the Korean Institute of Power Electronics
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• v.10 no.6
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• pp.578-586
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• 2005

Recently, due to the launch of digital broadcasting service, the demand of Flat Panel Display (FPD) is sharply rising. Among them, the PDP is expected to be one of the most promising digital displays of next generation because of its large screen size, high resolution, thinness and board field of view. Meanwhile, the PDP uses ADS (Address Display-period Separation) scheme which divide one subfield into address and sustaining period to express the grey scale of images. Since the output of sustaining power module Is mostly used for sustaining period, the load of the sustaining power module can be considered as a pulsating load. Due to this particular load condition, if the wide ZVS range of the power switches is not guaranteed, the hard switching causes large amount of switching loss and serious thermal problem in power module. In this paper, a high efficiency power conversion circuit for 60' PDP sustaining power module which achieves wide ZVS range with the help of additional ZVS tank is proposed. According to the various gating methods, the different operations of the proposed converter are presented. And, to confirm the properties of the proposed converter, an experimental prototype of 900W power converter is constructed md tested. As a result, more than $92\%$ of high efficiency is obtained at $10\%$ load condition, and the ZVS operation is achieved from full load to $10\%$ load condition.