• Transactions on Electrical and Electronic Materials
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• v.9 no.4
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• pp.169-172
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• 2008

We attempted to fabricate carbon nanotube field effect transistor (CNT-FET) using single walled carbon nanotube(SWNT) on the heavily doped Si substrate used as a bottom gate, source and drain electrode were fabricated bye-beam lithography on the 500 nm thick $SiO_2$ gate dielectric layer. We investigated electrical and physical properties of this CNT-FET using Scanning Probe Microscope(SPM) and conventional method based on tungsten probe tip technique. The gate length of CNT-FET was 600 nm and the diameter of identified SWNT was about 4 nm. We could observed gating effect and typical p-MOS property from the obtained $V_G-I_{DS}$ curve. The threshold voltage of CNT-FET is about -4.6V and transconductance is 47 nS. In the physical aspect, we could identified SWNT with phase mode of SPM which detecting phase shift by force gradient between cantilever tip and sample surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.123-130
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• 2013

Zirconia is well known in industrial applications for its mechanical characteristics. DLC (diamond-like carbon) have high elastic modulus, high electric resistivity, high dielectric constant, high wear resistance, low friction coefficient, bio compatibility, chemically inert and thermally stable. Because of all these physical and chemical properties these types of coatings have become key procedure for thin coating. Friction coefficient of DLC films is already evaluated and the current work is a further advancement by calculating the fracture toughness and wear resistance of these coatings. In the present study DLC thin film coatings are developed on $ZrO_2$ alloy surface using Plasma Enhanced Chemical Vapor Deposition (PECVD) method. Vicker hardness test is employed and it was concluded that, DLC coatings increase the Vickers hardness of ceramics.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.237-240
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• 2004

Sulfur Hexafluoride, SF6 is widely used for leak detection and as a gaseous dielectric in transformers, condensers and circuit breakers. SF6 gas is also effective as a cleanser in the semiconductor industry. This paper presents a numerical study of the sealing force of disk type seal in SF6 gas safety valve. The sealing force on the disk seal is analyzed by the FEM method based on the Taguch's experimental design technique. Disk seals in SF6 gas safety valve are designed with 9 design models based on 3 different contact length, compressive ratio and gas pressure. The calculated results of Cauchy stress and strain showed that the sealing characteristics of Teflon PTFE is more effective compared to that of FKM(Viton), which is related to the stiffness of the materials. And also, the contact length of the disk seal is important design parameter for sealing the SF6 gas leakage in the safety valve.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.75-79
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• 1993

The Thermally Stimulated Current(TSC) method has been allied to study the influence of the structural change and interface on the electrical properties of epoxy composites. Three DGBA- MeTHPA matrix model samples mixed different ratios arts silica(SiO$_2$) filled sample and silaln treating-filled sample have been studied. Above room temperature, the relaxation mode ${\alpha}$ peak associated with T$\_$g/ has been located at 110$^{\circ}C$. Below glass transition temperature(T$\_$g/), three relaxation modes are observed in all samples : a ${\beta}$ mode situated at 10$^{\circ}C$, a ${\gamma}$ mode located at -40$^{\circ}C$ and a $\delta$mode appeared in -120$^{\circ}C$, which may be due to segmental motion, side chains, substitution and terminal groups. The analysis of its fine structure indicates that constitution of elementary processes is characterized by the activation energy and relaxation time. Also the change of the molecular structure and their thermal motion are compared with the relaxation mode and conduction mechanism in TSC spectra through the dielectric properties and FTIR measurements.

• Electrical & Electronic Materials
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• v.6 no.2
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• pp.122-128
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• 1993

본 연구에서는 0.45Pb(Fe$_{1}$2/Nb$_{1}$2/)O$_{3}$- (0.55-xPb(Fe$_{2}$3/W$_{1}$3/)O$_{3}$ (x=0.20, 0.25, 0.30) 세라믹을 950~990[.deg.C]에서 2시간 유지시켜 일반소성법으로 제작하였다. 제작된 시편에 대해 적층 세라믹 캐패시터로의 응용가능성을 고찰하기 위해 조성비와 소결온도에 따른 구조적, 유전적 특성을 조사하였다. PMN의 첨가량이 증가할수록 결정립 크기는 감소하였으며 상전이 온도는 증가하였다. 소결밀도는 970[.deg.C]에서 소결된 0.45PFN-0.30PFW-0.25PMN 시편에서 7.86[g/cm$_{3}$]의 최대값을 나타내었다. 유전상수는 990[.deg.C]에서 소결된 0.45PFN-0.25PFW-0.30PMN 시편에서 20,751의 최대값을 나타내었으며 유전손실은 모든 조성에서 5[%]이상을 나타내었다.

• Electrical & Electronic Materials
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• v.11 no.10
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• pp.46-52
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• 1998

In this study, polarization switching characteristics of Pb(ZrxTil-x)O3 (PZT) thin films were investigated. Switching times(ts) were found to be decreased as the Zr mol% was increased. But, the switching peak currents(Imax) showed the largest value at 50 mol% Zr. As a result of this experiment, ts was found to be depended on the remanent polarization and coercive field and also Imax strongly depended on the dielectric constant of PZT thin films. In order to investigate the partial switching kinetics of PZT thin films, short and relatively small voltage pulses were applied to the MFM(metalferroelectric metal) PZT capacitors and polarization switching curves were measured with a variation of the total width of the applied pulses. Also, the switching curves were measured at different applied voltages(4, 8, 10, 12 and 14 volts). As the applied voltages increased, ts and Imax were found to be decreased and increased, respectively. In case of fatigued specimen which we applied $\pm$10 volts square pulse for 1010 cycles, ts and Imax were found to be shorter and smaller than those of virgin specimens. This is due to the decrease of the remanent polarization and the increase of the coercive field.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.57-58
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• 2006

In MIM (metal insulator metal) capacitor, Ru (ruthenium) has been suggested as new bottom electrode due to its excellent electrical performance, a low leakage of current and compatibility to the high dielectric constant materials. In this case of Ru bottom electrode, CMP (chemical mechanical planarization) process was needed m order to planarize and isolate the bottom electrode. In this study, the effect of chemical A on polishing and etching behavior was investigated as functions of chemical A concentration, abrasive particle and pressure. Chemical A was used as oxidant and etchant. The thickness of passivation layer on the treated Ru surface increased with the increase of chemical A concentration. The etch rate and removal rate of Ru were increased by the addition of chemical A. The removal rate was highest m slurry of pH 9 with the addition of 0.1 M chemical A and 2 wt% alumina at 4 psi. The maximum removal rate is about 80 nm/min.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.41-41
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• 2006

Step and Flash Imprint Lithography is an interesting low cost alternative to traditional microlithographic processes that offers the ability to efficiently produce nanostructures at unprecedented resolution. New photopolymerizable formulations are required to enable this process. This paper will describe progress in the design and development of acrylate and vinyl ether based platforms for this application together with efforts to prepare photopolymerizable, thermally stable, magterials with low dielectric constants for use in an efficient new method for fabricating the interconnect structures in microprocessors.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.781-784
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• 2002

Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. For the purpose of microassembly, theoretical understanding is required for the Adhesion phenomenon. Authors have developed a force measurement system in an ultra-high vacuum chamber of Auger electron spectroscopy. The force between arbitrary combination of materials can be measured at a pressure less than 100 nPa after and before Ar ion sputtering and chemical analysis for several atomic layers of the surface. The results are successfully interpreted with a theory of contact mechanics. Since surface energy is quite important in the interpretation, electronic theory is used to evaluate the surface energy. In the manipulation of small objects, the adhesional force is always attractive. Repulsive force is essential for the manipulation. It can be generated by Coulomb interaction. The voltage required for detachment is theoretically analyzed and the effect of boundary conditions on the detachment is obtained. The possibility and limitations of micro-manipulation using both the adhesion phenomenon and Coulomb interaction are theoretically clarified. Its applicability to nano-technology is found to be expected.

• Nuclear Engineering and Technology
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• v.52 no.7
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• pp.1503-1510
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• 2020

Ultra-low noise charge sensitive amplifiers (CSAs) based on various types of circuit board substrates, such as FR4, Teflon, and ceramics (Al₂O₃) with two different designs, PA1 and PA2, have been developed. They were tested to see the noise effect from the dielectric loss of the substrate capacitance before and after irradiation. If the electronic noise from the CSAs is to be minimized and the energy resolution enhanced, the shaping time has to be optimized for the detector, and a small feedback capacitance of the CSA is favorable for a better SNR. Teflon- and ceramic-based PA1 design CSAs showed better noise performance than the FR4-based one, but the Teflon-based PA1 design showed better sensitivity than ceramic based one at a low detector capacitance (<10 pF). In the PA2 design, the equivalent noise and the sensitivity were 0.52 keV FWHM for a silicon detector and 7.2 mV/fC, respectively, with 2 ㎲ peaking time and 0.1 pF detector capacitance. After 10, 100, 10³, 10⁴, and 10⁵ Gy irradiation the ENC and sensitivity characteristics of the developed CSAs based on three different substrate materials are also discussed.