• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.35-40
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• 1997

The present study considers the analysis and control of the bonding process for a LOC DIe Bonder. A mathematical model for describing the bonding process is developed and proved by experiments. A feedback scheme is also applied for system in order to ensure the robustness of the bonding force control. The theoretical and experimental results are proved useful for the design and control of the LOC Die Bonder.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.284-287
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• 1987

In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.261-264
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• 2001

반도체 생산현장에서의 생산성 향상과 집약적 기술의 보유는 장비 도입과 잉여 기술자 또는 숙련기술자를 교육하는 과정을 요구한다. 본 연구에서는 (주)옵토텍과 산학협동의 일환으로 장비의 교육과 관련하여 교육 소요시간을 줄이고, 주요 구동 Procedure를 매개로 하는 구동 인력의 기술력 향상과 구동 안전성을 도모하기 위하여 PCB Automatic Die Bonder(AD809-06, ASM)의 지능형 구동 학습전문화 시스템을 구축하려는 것이다.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.1
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.

• Structural Engineering and Mechanics
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• v.37 no.5
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• pp.475-487
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• 2011

In a flexible multi-body dynamic system the typical topological optimization method for structures cannot be directly applied, as the stiffness varies with position. In this paper, the topological optimization of the flexible multi-body dynamic system is converted into structural optimization using the equivalent static load method. First, the actual boundary conditions of the control system and the approximate stiffness curve of the mechanism are obtained from a flexible multi-body dynamical simulation. Second, the finite element models are built using the absolute nodal coordination for different positions according to the stiffness curve. For efficiency, the static reanalysis method is utilized to solve these finite element equilibrium equations. Specifically, the finite element equilibrium equations of key points in the stiffness curve are fully solved as the initial solution, and the following equilibrium equations are solved using a reanalysis method with an error controlled epsilon algorithm. In order to identify the efficiency of the elements, a non-dimensional measurement is introduced. Finally, an improved evolutional structural optimization (ESO) method is used to solve the optimization problem. The presented method is applied to the optimal design of a die bonder. The numerical results show that the presented method is practical and efficient when optimizing the design of the mechanism.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.17-22
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• 2007

Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.