• Transactions of Materials Processing
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• v.32 no.1
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• pp.12-19
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• 2023

The armature core is a part responsible for the skeleton of the steering wheel. Currently, in the case of commercial trucks, the main parts of the parts are manufactured separately and then the product is produced through welding. In the case of this production method, quality and cost problems of the welded parts occur, and an integrated armature core made of magnesium alloy is used in passenger vehicles. However, in the case of commercial trucks, there is no application case and research is insufficient. Therefore, this study aims to develop an all-in-one armature core that simultaneously applies a magnesium alloy material and a die casting method to reduce the weight and improve the quality of the existing steel armature core. The product was modeled based on the shape of a commercial product, and finite element analysis (FEA) was performed through Ls-dyna, a general-purpose analysis program. Through digital image correlation (DIC) and uniaxial tensile test, the accurate physical properties of the material were obtained and applied to the analysis. A total of four types of compression were applied by changing the angle and ground contact area of the product according to the actual reliability test conditions. analysis was carried out. As a result of FEA, it was confirmed that damage occurred in the spoke area, and spoke thickness (t_spoke), base thickness (t_base), and rim and spoke connection (R) were designated as design variables, and the total weight and maximum equivalent stress occurring in the armature core We specify an objective function that simultaneously minimizes . A prediction function was derived using the sequential response surface method to identify design variables that minimized the objective function, and it was confirmed that it was improved by 22%.

• Transactions of the Korean Society of Automotive Engineers
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• v.24 no.5
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• pp.605-611
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• 2016

Mg alloy sheet exhibits significant differences in tensile and compressive yield stress depending on the temperature, as well as variations in its hardening behavior. Such unusual behavior makes it difficult to simulate the forming process of Mg alloy sheets. Results of analysis tend to deviate significantly from the experimental data because commercial software do not completely implement the unusual hardening behavior, yield asymmetry and temperature dependent changes in the Mg alloy's material properties. In the previous study, an in-plane tension-compression cyclic tester was developed to predict the cyclic behavior of Mg alloy sheets at an elevated temperature of up to $250^{\circ}C$. A new constitutive equation was suggested to analyze the unusual behavior, and was implemented in the commercial software in the form of user subroutine. In this paper, a stamping process of Mg seat cushion panel for automotive parts was simulated using the experimental data and user subroutine. Based on the analysis, an optimal temperature condition was determined and a stamping die shape at each step was suggested in the non-isothermal stamping of Mg alloy sheets.

• Journal of the Korea Convergence Society
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• v.13 no.4
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• pp.287-292
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• 2022

In this paper, the stochastic distribution of the springback amount is investigated for the stamping process of a U-channel shaped-product with ultra-high strength steel. Using the reliability-based design optimization technique (RBDO), stochastic distribution of process parameters is considered in the analysis including material properties and process variation. Quantification of the springback scatters is carried out with the statistical analysis method according to the material strength. It is found that the scattering amount of springback decreases while the amount of springback increases as the tensile strength of the blank material increases, which is investigated by analyzing the strain and stress distribution of the punch and die shoulder. It is noted that the proposed scheme is capable of predicting and responding to the unavoidable scattering of springback in the sheet metal forming process.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.50-60
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• 2023

Ball Grid Array (BGA) is a widely used package type due to its high pin density and good heat dissipation. In BGA, solder balls play an important role in electrically connecting the package to the PCB. Therefore, understanding the inelastic deformation of solder balls under various mechanical loads is essential for the robust design of semiconductor packages. In this study, the geometrical effect on the inelastic deformation and fracture of solder balls were analyzed by finite element analysis. The results showed that fracture occurred in both tilted and hourglass shapes under shear loading, and no fracture occurred in all cases under compressive loading. However, when bending was applied, only the tilted shape failed. When shear and bending loads were combined with compression, the stress triaxiality was maintained at a value less than zero and failure was suppressed. Furthermore, a comparison using the Lagrangian-Green strain tensor of the critical element showed that even under the same loading conditions, there was a significant difference in deformation depending on the shape of the solder ball.

• Design & Manufacturing
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• v.13 no.4
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.2
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• pp.593-601
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• 2021

The axial fan is an element of a blower used for ventilation in various industrial fields. Many studies on aerodynamic performance have been conducted to assess axial fans using fluid dynamics. The subject was a large axial fan size, 1800 mm in diameter with 100 horsepower. The blower's axial fan consisted of blades, hubs, hub caps, and bosses are important components. The blade design has a great influence on the aerodynamic performance. 3D point data is extracted using an aerodynamic performance prediction program, and a 3D modeling shape is generated. The blades and hubs, which are important components, can be easily modified if processed by cutting owing to the environment in which blades and hubs are manufactured through die casting or gravity casting. In this study, the structural safety of components and the analysis results of weak areas at the rated operating speed of the axial fan were verified using the maximum stress and safety factor. The tip clearance reflected in the design was the rotation of the blade. To check whether there is interference with other components, the displacement result was derived to verify the structural safety of the axial fan.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Design & Manufacturing
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• v.17 no.3
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• pp.8-14
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• 2023

In this study, basic research was conducted on manufacturing technology of thick-walled light guide a component that controls the light source of automobile lamps. As a preliminary study for manufacturing the final injection molded parts, a model for analyzing the influence of micro patterns on light guides is presented. The optical characteristics of the light guide were analyzed according to the change of the curvature radius of the micro-optical pattern, and the injection molding characteristics of the light guide according to the change of injection molding conditions were analytically evaluated. It was confirmed that the luminance uniformity improves as the R value decreases for changes in the micro-pattern R value, but it was confirmed that there are technical limitations in actual injection mold core processing and high-replication injection molding. Injection molding analysis showed that cooling channel design is very important compared to general injection molding due to thick-wall characteristics and thickness variation. It was also confirmed that the cooling channel has a great influence on the cycle time and birefringence result due to residual stress. As a result of analyzing the influence of filling time, holding condition, and cooling on shrinkage, it was found that the cooling water temperature has a significant effect on the shrinkage of ultra-fine light guide parts, and the holding condition also has a significant effect.

• Journal of the Korean Institute of Landscape Architecture
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• v.26 no.2
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• pp.54-61
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• 1998

The subsurface environment of the root zone area can set the stae for "do or die" of the turfgrass plant. The good condition of the greens is verified by their physical properties. Therefore, this study was carried to evaluate on the existing green of Hwasan C.C. by undisturbed soil Core Anaysis. We completed the ISTRC SYSTEM BenchMarking of the undisturbed core samples taken from Green #1, Green #5, Green #9-"Best" area, and Green #9-"Stressed" area for the Hwasan C.C.. It was also our understanding that the greens were in "good" to "very good" conditioni. THe exception might be Green #9-"Stress" area, which was the stressed area. The stressed area was confined to a ridge across Green #9. The organic content test results comfirmed the development of organic layering in depth 0-2.5cm. For the amount of compaction in the upper root zones and te development of the green's respective organic layers, the infiltration rates were high in Green #1, Green #5, and Green #9 "Stressed" area. The depicted aerificaton hole might be the probable cause of the relatively high infiltraton rate. Green #9-"Best" area had a tested infiltration rate of 18.75cm/hr. Either this area had not been aerified, or the undisturbed sample did not contain a aerification cavity. The water retention capacity of the undisturbed samples was good. When the greens were first constructed, the original root zone mix had been relatively low water retention properties. And the bulk density and the porosity of the undisturbed samples were good. In the result, all the greens were similar except for the infiltration. Thus, we supposed that Green #9-"Stressed" area might be ainly influenced by the amount of irrigation water and the configuration of the green's surface. There had been a reduction in the amount of irrigation water as the water retention capacity in the greens was promoted. Especially, it had gradually become more of a problem as the green had matured in Green #9-"Stressed" area. Because Green #9-"Stressed" area was a ridge area. The reduction in the amount of irrigation water might be the probable cause of the stress in Green #9-"Stressed" area. Our final observation related to the soil texture and the particle size distribution of the sand. Though and sand contant of all the tested greens were good, the gravel content of them exceeded ISTRC Guidelines. In particle size distribution of the sand, the very coarse and the coarse content of all the tested greens exceeded, but the rest was insufficient. The stability is a function of the material retained on the 0.25mm mesh screen. But, the content of all the tested greens was very insufficient. Though all the greens was serviceable, the coarse root zone sands, such as the sand in the tested greens, tended to be "unstable". Thus, we recommend using a topdressing/aerification sand which should be more in line with ISTRC/USGA Guidelines.;unstable". Thus, we recommend using a topdressing/aerification sand which should be more in line with ISTRC/USGA Guidelines.ines.